scholarly journals Collinear Deflection Method for the Measurement of Thermal Conductivity of Transparent Single Layer Anisotropic Material

2019 ◽  
Vol 9 (8) ◽  
pp. 1522
Author(s):  
Moojoong Kim ◽  
Kuentae Park ◽  
Gwantaek Kim ◽  
Jaisuk Yoo ◽  
Dong-Kwon Kim ◽  
...  
Keyword(s):  
Thermal Conductivity ◽  
Thermal Properties ◽  
Anisotropic Material ◽  
Crystal Orientation ◽  
Three Dimensional ◽  
Single Layer ◽  
Anisotropic Materials ◽  
Analysis Model ◽  
Anisotropic Thermal Conductivity ◽  
Property Measurement

Transparent anisotropic materials have garnered attention along with the growth of the semiconductor and display industries. Transparent anisotropic materials have the characteristic of varying electrical, optical, and thermal properties based on their crystal orientation, and many studies are being conducted on this topic. In order to utilize transparent anisotropic materials properly, thermal properties such as thermal conductivity are essentially required. However, due to the limitations of the existing thermal property measurement methods for transparent anisotropic materials, it is difficult to provide the thermal properties of transparent anisotropic materials. To address this problem, a transparent anisotropic collinear method capable of measuring the effective thermal conductivity of a transparent anisotropic material according to its crystal orientation is proposed in this paper. To this end, the internal temperature distribution of a transparent anisotropic material and the phase delay of the probe beam were theoretically derived through a numerical analysis model that uses a three-dimensional heat conduction equation. This model was applied to anisotropic thermal conductivity with orthorhombic structure. To verify the proposed method of measuring the thermal conductivity of a transparent anisotropic material, the thermal properties of 3 mm-thick A-plane sapphire glass were measured and compared with those of the existing literature. It was confirmed that the absolute errors were less than about 4 W/mk.

Determination of the Thermal Properties of a PCB by Coupled Numerical and Experimental Approach

2020 ◽  
Author(s):  
Yener Usul ◽  
Mustafa Özçatalbaş
Keyword(s):  
Thermal Conductivity ◽  
Heat Capacity ◽  
Thermal Properties ◽  
Numerical Analysis ◽  
Specific Heat ◽  
Specific Heat Capacity ◽  
Thermal Analyses ◽  
Analysis Model ◽  
Linear Temperature ◽  
Coefficient Of Thermal Conductivity

Abstract Increasing demand for usage of electronics intensely in narrow enclosures necessitates accurate thermal analyses to be performed. Conduction based FEM (Finite Element Method) is a common and practical way to examine the thermal behavior of an electronic system. First step to perform a numerical analysis for any system is to set up the correct analysis model. In this paper, a method for obtaining the coefficient of thermal conductivity and specific heat capacity of a PCB which has generally a complex composite layup structure composed of conductive layers, and dielectric layers. In the study, above mentioned properties are obtained performing a simple nondestructive experiment and a numerical analysis. In the method, a small portion of PCB is sandwiched from one side at certain pressure by jaws. A couple of linear temperature profiles are applied to the jaws successively. Unknown values are tuned in the analysis model until the results of FEM analysis and experiment match. The values for the coefficient of thermal conductivity and specific heat capacity which the experiment and numerical analysis results match can be said to be the actual values. From this point on, the PCB whose thermal properties are determined can be analyzed numerically for any desired geometry and boundary condition.

Structural and thermal properties of the monoclinic Lu2SiO5single crystal: evaluation as a new laser matrix

2009 ◽  
Vol 42 (2) ◽  
pp. 284-294 ◽  
Author(s):  
Hengjiang Cong ◽  
Huaijin Zhang ◽  
Jiyang Wang ◽  
Wentao Yu ◽  
Jiandong Fan ◽  
...  
Keyword(s):  
Crystal Structure ◽  
Thermal Conductivity ◽  
Heat Capacity ◽  
Thermal Expansion ◽  
Thermal Properties ◽  
Specific Heat ◽  
Linear Thermal Expansion ◽  
Cell Parameters ◽  
Thermal Expansion Tensor ◽  
Anisotropic Thermal Conductivity

The crystal structure of monoclinic Lu2SiO5(LSO) crystals, grown by the Czochralski method, was determined at room temperature by X-ray diffraction. The unit-cell parameters area= 10.2550 (2),b= 6.6465 (2),c= 12.3626 (4) Å, β = 102.422 (1)° in space groupI2/a. The linear thermal expansion tensor was determined along thea,b,candc* directions over the temperature range from 303.15 to 768.15 K, and the principal coefficients of the thermal expansion tensor are found to be αI= −1.0235 × 10−6 K, αII= 4.9119 × 10−6 K and αIII= 10.1105 × 10−6 K. The temperature dependence of the cell volume and monoclinic angle were also evaluated. In addition, the specific heat and the thermal diffusivity were measured over the temperature ranges from 293.15 to 673.15 K and from 303.15 to 572.45 K, respectively. As a result, the anisotropic thermal conductivity could be calculated and is reported for the first time, to the best of the authors' knowledge. The specific heat capacity of LSO is 139.54 J mol−1 K−1, and the principal components of the thermal conductivity arekI= 2.26 W m−1 K−1,kII= 3.14 W m−1 K−1andkII= 3.67 W m−1 K−1at 303.15 K. A new structure model was proposed to better understand the relationships between the crystal structure and anisotropic thermal properties. In comparison with other laser matrix crystals, it is found that LSO possesses relatively large anisotropic thermal properties, and owing to its small heat capacity it has a moderate thermal conductivity, which is similar to those of the tungstates but lower than those of the vanadates.

Exact Solution of Heat Conduction in a Two-Domain Parallelepiped With an Orthotropic Layer and Its Application to the Estimation of the Three-Dimensional Thermal Conductivity Tensor and Volumetric Heat Capacity of the Orthotropic Layer

2002 ◽  
Author(s):  
Cuauhtemoc Aviles-Ramos
Keyword(s):  
Thermal Conductivity ◽  
Heat Flux ◽  
Exact Solution ◽  
Heat Capacity ◽  
Thermal Properties ◽  
Hybrid Algorithm ◽  
Three Dimensional ◽  
Volumetric Heat Capacity ◽  
Parameter Estimation Problem ◽  
Orthotropic Layer

The three-dimensional exact solution of heat conduction in a two-layer composite is found applying the method of separation of variables. One layer is orthotropic and the other layer is isotropic. This solution is used to calculate sensitivity coefficients with respect to the thermophysical properties of the orthotropic layer at fourteen thermocouple locations. Numerical experiments are carried out to solve a parameter estimation problem that involves the estimation of the thermal conductivities in the x-, y-, and z-directions, the volumetric heat capacity of the orthotropic layer, the effective thermal conductivity of the isotropic layer, and the heat flux input. The exact solution is used to generate temperature readings at fourteen thermocouple locations. First, the parameter estimation problem is solved using the exact temperatures and a hybrid algorithm to estimate the thermal properties and the heat flux. Second, random noise is added to the exact temperatures and the thermal properties and heat flux are estimated using the same hybrid algorithm. It is found that when using the exact temperatures, the minimized quadratic functional has a value of 2.4×10−16 (°C)2 and the estimated properties agree to the ninth decimal place with the “exact” properties.

Spreading Resistance in Multilayered Orthotropic Flux Channels With Different Conductivities in the Three Spatial Directions

2018 ◽  
Vol 140 (7) ◽  
Author(s):  
Belal Al-Khamaiseh ◽  
Yuri S. Muzychka ◽  
Serpil Kocabiyik
Keyword(s):  
Thermal Conductivity ◽  
Analytical Solutions ◽  
Three Dimensional ◽  
Compound System ◽  
Source Plane ◽  
Multilayered Structures ◽  
Anisotropic Thermal Conductivity ◽  
Commercial Software Package ◽  
Microelectronics Industry ◽  
Extreme Performance

In the microelectronics industry, the multilayered structures are found extensively where the microelectronic device/system is manufactured as a compound system of different materials. Recently, a variety of new materials have emerged in the microelectronics industry with properties superior to Silicon, enabling new devices with extreme performance. Such materials include β-Gallium-oxide (β-Ga2O3), and black phosphorus (BP), which are acknowledged to have anisotropic thermal conductivity tensors. In many of these devices, thermal issues due to self-heating are a problem that affects the performance, efficiency, and reliability of the devices. Analytical solutions to the heat conduction equation in such devices with anisotropic thermal conductivity tensor offer significant computational savings over numerical methods. In this paper, general analytical solutions for the temperature distribution and the thermal resistance of a multilayered orthotropic system are obtained. The system is considered as a multilayered three-dimensional (3D) flux channel consisting of N-layers with different thermal conductivities in the three spatial directions in each layer. A single eccentric heat source is considered in the source plane while a uniform heat transfer coefficient is considered along the sink plane. The solutions account for the effect of interfacial conductance between the layers and for considering multiple eccentric heat sources in the source plane. For validation purposes, the analytical results are compared with numerical solution results obtained by solving the problem with the finite element method (FEM) using the ANSYS commercial software package.

scholarly journals Experimental observation of hydrodynamic-like behavior in 3D topological semimetal ZrTe5

2021 ◽  
Author(s):  
Chang-woo Cho ◽  
Peipei Wang ◽  
Fangdong Tang ◽  
Sungkyun Park ◽  
Mingquan He ◽  
...  
Keyword(s):  
Thermal Conductivity ◽  
Thermal Properties ◽  
Wide Temperature Range ◽  
Collective Excitation ◽  
Condensed Matter ◽  
Three Dimensional ◽  
Local Maximum ◽  
Mean Free Path ◽  
Ballistic Regime ◽  
Topological Semimetal

Abstract Hydrodynamic fluidity in condensed matter physics has been experimentally demonstrated only in a limited number of compounds because of the stringent conditions that must be satisfied. Herein, we demonstrate the existence of hydrodynamic-like properties driven by the collective excitation of the Dirac fluid in the three-dimensional topological semimetal ZrTe5. By measuring the electrical and thermal properties in a wide temperature range, we find a regime satisfying phononic hydrodynamic-like characteristics with two representative experimental evidences: a faster evolution of the thermal conductivity than in the ballistic regime and the existence of a local maximum of the effective mean free path. In contrast to phononic hydrodynamics, the Wiedemann-Franz law is violated by about a factor of 100. Moreover, phonon-dragged anomalies are observed, which serve as a signature of the Dirac fluidity in this system.

Application of an Anisotropic Material of Thermal Conductivity in Building Envelope

2011 ◽  
Vol 194-196 ◽  
pp. 829-834 ◽  
Author(s):  
Shun Yu Su ◽  
Jian Chen ◽  
Chun Zhi Zhang
Keyword(s):  
Thermal Conductivity ◽  
Anisotropic Material ◽  
Natural Ventilation ◽  
Laminated Composite ◽  
Building Envelope ◽  
Conductive Heat ◽  
Skin Envelope ◽  
Anisotropic Thermal Conductivity ◽  
Principal Axes ◽  
Double Skin

In this paper, mechanism of anisotropic material of thermal conductivity was revealed by rotating the original rectangular axes so as to determine the principal axes and make the cross-derivative terms disappear. The results indicated that the heat flux vector is commonly not perpendicular to the isothermal surface in anisotropic material. The advantage of anisotropic material of thermal conductivity was analyzed. The application of laminated composite with anisotropic thermal conductivity in double skin envelope was proposed to avoid its disadvantage. The interior envelope in double skin system may be made of laminated glaze or other laminated materials. Basing on the combine of anisotropic material and double skin envelope, the indoor cooling and heating load decrease in summer and winter respectively while the anisotropic material was used as interior building envelope. Especially in summer, the effect of energy saving is obvious since the partial magnitude of conductive heat in the interior envelope could be brought out from the cavity by natural ventilation through it.

scholarly journals Study on Performance of Anisotropic Materials of Thermal Conductivity

2011 ◽  
Vol 5 (1) ◽  
pp. 168-172 ◽  
Author(s):  
Shunyu Su ◽  
Jian Chen ◽  
Chunzhi Zhang
Keyword(s):  
Thermal Conductivity ◽  
Anisotropic Material ◽  
Natural Ventilation ◽  
Laminated Composite ◽  
Building Envelope ◽  
Conductive Heat ◽  
Skin Envelope ◽  
Anisotropic Thermal Conductivity ◽  
Principal Axes ◽  
Double Skin

The advantage and shortcoming of anisotropic material of thermal conductivity using as building envelope were analyzed in this paper. The thermal performance of anisotropic material of thermal conductivity was presented by rotating the original rectangular axes so as to determine the principal axes and make the cross-derivative terms disappear. The results indicated that the heat flux vector is commonly not perpendicular to the isothermal surface in anisotropic material. Double skin facade has been successfully applied in many building designs. The application of laminated composite with anisotropic thermal conductivity in double skin envelope was proposed to avoid its disadvantage. The interior envelope in double skin system may be made of laminated glaze or other laminated materials. Basing on the combination of anisotropic material and double skin envelope, the indoor cooling and heating load decrease in summer and winter respectively while the anisotropic material was used as interior building envelope. Especially in summer, the effect of energy saving is obvious since the partial magnitude of conductive heat in the interior envelope could be brought out from the cavity by natural ventilation through it.

scholarly journals Highly Thermo-Conductive Three-Dimensional Graphene Aqueous Medium

2020 ◽  
Vol 12 (1) ◽  
Author(s):  
Zheng Bo ◽  
Chongyan Ying ◽  
Huachao Yang ◽  
Shenghao Wu ◽  
Jinyuan Yang ◽  
...  
Keyword(s):  
Thermal Conductivity ◽  
Aqueous Medium ◽  
High Performance ◽  
Three Dimensional ◽  
Heating System ◽  
Conduction Model ◽  
3D Graphene ◽  
Conductivity Enhancement ◽  
Practical Applications ◽  
Anisotropic Thermal Conductivity

Abstract Highly thermo-conductive aqueous medium is a crucial premise to demonstrate high-performance thermal-related applications. Graphene has the diamond comparable thermal conductivity, while the intrinsic two-dimensional reality will result in strong anisotropic thermal conductivity and wrinkles or even crumples that significantly sacrifices its inherent properties in practical applications. One strategy to overcome this is to use three-dimensional (3D) architecture of graphene. Herein, 3D graphene structure with covalent-bonding nanofins (3D-GS-CBF) is proposed, which is then used as the filler to demonstrate effective aqueous medium. The thermal conductivity and thermal conductivity enhancement efficiency of 3D-GS-CBF (0.26 vol%) aqueous medium can be as high as 2.61 W m−1 K−1 and 1300%, respectively, around six times larger than highest value of the existed aqueous mediums. Meanwhile, 3D-GS-CBF can be stable in the solution even after 6 months, addressing the instability issues of conventional graphene networks. A multiscale modeling including non-equilibrium molecular dynamics simulations and heat conduction model is applied to interpret experimental results. 3D-GS-CBF aqueous medium can largely improve the solar vapor evaporation rate (by 1.5 times) that are even comparable to the interfacial heating system; meanwhile, its cooling performance is also superior to commercial coolant in thermal management applications.

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