scholarly journals Short-Pulse Laser-Assisted Fabrication of a Si-SiO2 Microcooling Device

Micromachines ◽  
2021 ◽  
Vol 12 (9) ◽  
pp. 1054
Author(s):  
Alexandros Mouskeftaras ◽  
Stephan Beurthey ◽  
Julien Cogan ◽  
Gregory Hallewell ◽  
Olivier Leroy ◽  
...  
Keyword(s):  
Thermal Management ◽  
Heat Dissipation ◽  
Short Pulse ◽  
Surface Patterning ◽  
Anodic Bonding ◽  
Fully Integrated ◽  
Short Pulse Laser ◽  
New Concepts ◽  
Traditional Manufacturing ◽  
Silicon Based

Thermal management is one of the main challenges in the most demanding detector technologies and for the future of microelectronics. Microfluidic cooling has been proposed as a fully integrated solution to the heat dissipation problem in modern high-power microelectronics. Traditional manufacturing of silicon-based microfluidic devices involves advanced, mask-based lithography techniques for surface patterning. The limited availability of such facilities prevents widespread development and use. We demonstrate the relevance of maskless laser writing to advantageously replace lithographic steps and provide a more prototype-friendly process flow. We use a 20 W infrared laser with a pulse duration of 50 ps to engrave and drill a 525 μm-thick silicon wafer. Anodic bonding to a SiO2 wafer is used to encapsulate the patterned surface. Mechanically clamped inlet/outlet connectors complete the fully operational microcooling device. The functionality of the device has been validated by thermofluidic measurements. Our approach constitutes a modular microfabrication solution that should facilitate prototyping studies of new concepts for co-designed electronics and microfluidics.

Low Resistivity Contact Formation for Lsi Interconnection With Short-Pulse-Laser Induced Mo Cvd

1987 ◽  
Vol 101 ◽  
Author(s):  
F. Uesugi ◽  
Y. Morishige ◽  
T. Shinzawa ◽  
S. Kishida ◽  
M. Hirata ◽  
...  
Keyword(s):  
Pulse Laser ◽  
Heat Dissipation ◽  
Short Pulse ◽  
Laser Pulses ◽  
Direct Writing ◽  
Low Resistivity ◽  
Short Pulse Laser ◽  
Localized Heating ◽  
Short Laser Pulses ◽  
First Time

ABSTRACTThe contact characteristics between Al interconnections in LSI's and direct written Mo lines has been substantially improved by adopting, for the first time, short-pulse-laser induced Mo CVD. The linewidth stability upon Al interconnections has also been improved. Transient, localized heating with short laser pulses effectively overcomes the heat dissipation through Al interconnections which degraded contact characteristics and prevented fine drawing near the Al interconnection. This new scheme can appreciably widen the applicable device field of direct writing circuit restructuring.

Silicon Thinning using Ultra-Short Pulse Laser Ablation

2004 ◽  
Author(s):  
F. Beaudoin ◽  
P. Perdu ◽  
C. DeNardi ◽  
R. Desplats ◽  
J. Lopez ◽  
...  
Keyword(s):  
Laser Ablation ◽  
Sample Preparation ◽  
Pulse Laser ◽  
Pulse Laser Ablation ◽  
Short Pulse ◽  
Special Care ◽  
Short Pulse Laser ◽  
Ultra Short Pulse ◽  
Ultra Short Pulse Laser

Abstract Ultra-short pulse laser ablation is applied to IC backside sample preparation. It is contact-less, non-thermal, precise and can ablate the various types of material present in IC packages. This study concerns the optimization of ultra-short pulse laser ablation for silicon thinning. Uncontrolled silicon roughness and poor uniformity of the laser thinned cavity needed to be tackled. Special care is taken to minimize the silicon RMS roughness to less than 1µm. Application to sample preparation of 256Mbit devices is presented.

Chromium oxide dissolution in steels via short pulse laser processing

2013 ◽  
Vol 115 (4) ◽  
pp. 1469-1477 ◽  
Author(s):  
Evgeny Kharanzhevskiy ◽  
Sergey Reshetnikov
Keyword(s):  
Pulse Laser ◽  
Chromium Oxide ◽  
Laser Processing ◽  
Short Pulse ◽  
Oxide Dissolution ◽  
Short Pulse Laser

scholarly journals Experimental study of lateral resistance of bolted joints using Japanese cedar (Cryptomeria japonica) treated with resin impregnation

2020 ◽  
Vol 66 (1) ◽  
Author(s):  
Keita Ogawa ◽  
Satoshi Fukuta ◽  
Kenji Kobayashi
Keyword(s):  
Short Pulse ◽  
Japanese Cedar ◽  
Bolted Joints ◽  
Bolted Joint ◽  
Yield Load ◽  
Short Pulse Laser ◽  
Resin Impregnation ◽  
Lateral Resistance ◽  
Ultraviolet Wavelength ◽  
Resistance Performance

Abstract The development of wooden joints possessing high resistance performance has become an important issue for the construction of newer buildings. This study attempts to strengthen the lateral resistance of bolted joints using the previously reported plasticizing technique. This technique consists of two processing stages: incising the surface of the wood using an ultraviolet wavelength short-pulse laser and impregnating the resin into the incised area. This technique makes it possible to plasticize only a local part of the wood surface. Bolted joint specimens were assembled using plasticized wood around the bolt hole, and the lateral tests were conducted. Acrylic monomer and urethane prepolymer were used as the impregnating resins and their incision depths were set as 4 and 10 mm. When the lateral load acted parallel to the grain, changes in the lateral resistance characteristics were observed, especially for the stiffness and yield load. For example, when acryl was used, and the incision depth was 10 mm, an increment of 73% in the yield load was observed, as compared to the non-impregnated specimens. The specimen groups impregnated with acryl exhibited greater changes in their properties than those using urethane. When loaded perpendicular to the grain, an increase in properties were observed; however, these increments were lower than those of the groups loaded parallel to the grain.

scholarly journals Machine learning for multi-dimensional optimisation and predictive visualisation of laser machining

2021 ◽  
Author(s):  
Michael D. T. McDonnell ◽  
Daniel Arnaldo ◽  
Etienne Pelletier ◽  
James A. Grant-Jacob ◽  
Matthew Praeger ◽  
...  
Keyword(s):  
Short Pulse ◽  
Surface Texturing ◽  
Laser Surface Texturing ◽  
Laser Machining ◽  
Laser Materials ◽  
Parameter Optimisation ◽  
Short Pulse Laser ◽  
Alternative Approach ◽  
Highly Nonlinear ◽  
Wide Range

AbstractInteractions between light and matter during short-pulse laser materials processing are highly nonlinear, and hence acutely sensitive to laser parameters such as the pulse energy, repetition rate, and number of pulses used. Due to this complexity, simulation approaches based on calculation of the underlying physical principles can often only provide a qualitative understanding of the inter-relationships between these parameters. An alternative approach such as parameter optimisation, often requires a systematic and hence time-consuming experimental exploration over the available parameter space. Here, we apply neural networks for parameter optimisation and for predictive visualisation of expected outcomes in laser surface texturing with blind vias for tribology control applications. Critically, this method greatly reduces the amount of experimental laser machining data that is needed and associated development time, without negatively impacting accuracy or performance. The techniques presented here could be applied in a wide range of fields and have the potential to significantly reduce the time, and the costs associated with laser process optimisation.

The study of time dependent, broadband X-ray emission from ultra-short pulse laser produced plasmas

1994 ◽  
Author(s):  
Ronnie Shepherd ◽  
Rex Booth ◽  
Dwight Price ◽  
Rosemary Walling ◽  
Richard More ◽  
...  
Keyword(s):  
Pulse Laser ◽  
Short Pulse ◽  
Time Dependent ◽  
X Ray ◽  
Short Pulse Laser ◽  
Ultra Short Pulse ◽  
Ultra Short Pulse Laser
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