scholarly journals Comparison between Bosch and STiGer Processes for Deep Silicon Etching

Micromachines ◽  
2021 ◽  
Vol 12 (10) ◽  
pp. 1143
Author(s):  
Thomas Tillocher ◽  
Jack Nos ◽  
Gaëlle Antoun ◽  
Philippe Lefaucheux ◽  
Mohamed Boufnichel ◽  
...  

The cryogenic process is well known to etch high aspect ratio features in silicon with smooth sidewalls. A time-multiplexed cryogenic process, called STiGer, was developed in 2006 and patented. Like the Bosch process, it consists in repeating cycles composed of an isotropic etching step followed by a passivation step. If the etching step is similar for both processes, the passivation step is a SiF4/O2 plasma that efficiently deposits a SiOxFy layer on the sidewalls only if the substrate is cooled at cryogenic temperature. In this paper, it is shown that the STiGer process can achieve profiles and performances equivalent to the Bosch process. However, since sidewall passivation is achieved with polymer free plasma chemistry, less frequent chamber cleaning is necessary, which contributes to increase the throughput.

2020 ◽  
Vol 38 (5) ◽  
pp. 053002
Author(s):  
Vy Thi Hoang Nguyen ◽  
Evgeniy Shkondin ◽  
Flemming Jensen ◽  
Jörg Hübner ◽  
Pele Leussink ◽  
...  
Keyword(s):  

2015 ◽  
Author(s):  
Jiang Hu ◽  
Shun Zhou ◽  
Shuai Hu ◽  
Yufeng Zhu ◽  
Weiguo Liu

2020 ◽  
Vol 217 (4) ◽  
pp. 2070017
Author(s):  
Ivan Morozov ◽  
Alexander Gudovskikh ◽  
Alexander Uvarov ◽  
Artem Baranov ◽  
Vladimir Sivakov ◽  
...  

2018 ◽  
Vol 57 (9) ◽  
pp. 098004
Author(s):  
Itsuko Sakai ◽  
Katsunori Yahashi ◽  
Satoshi Shimonishi ◽  
Makoto Sekine ◽  
Masaru Hori

2017 ◽  
Vol 35 (3) ◽  
pp. 03E113 ◽  
Author(s):  
Guillaume Le Dain ◽  
Ahmed Rhallabi ◽  
Marie Claude Fernandez ◽  
Mohamed Boufnichel ◽  
Fabrice Roqueta

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