scholarly journals Sequential Oxidation Strategy for the Fabrication of Liquid Metal Electrothermal Thin Film with Desired Printing and Functional Property

Micromachines ◽  
2021 ◽  
Vol 12 (12) ◽  
pp. 1539
Author(s):  
Jun-Heng Fu ◽  
Xu-Dong Zhang ◽  
Peng Qin ◽  
Jing Liu
Keyword(s):  
Thin Film ◽  
Liquid Metal ◽  
Composite Film ◽  
Flexible Electronics ◽  
High Performance ◽  
Polyimide Film ◽  
Great Promise ◽  
Metal Composite ◽  
Resistive Layer ◽  
Film Substrate

Room temperature liquid metal (LM) showcases a great promise in the fields of flexible functional thin film due to its favorable characteristics of flexibility, inherent conductivity, and printability. Current fabrication strategies of liquid metal film are substrate structure specific and sustain from unanticipated smearing effects. Herein, this paper reported a facile fabrication of liquid metal composite film via sequentially regulating oxidation to change the adhesion characteristics, targeting the ability of electrical connection and electrothermal conversion. The composite film was then made of the electrically resistive layer (oxidizing liquid metal) and the insulating Polyimide film (PI film) substrate, which has the advantages of electrical insulation and ultra-wide temperature working range, and its thickness is only 50 μm. The electrical resistance of composite film can maintain constant for 6 h and could work normally. Additionally, the heating film exhibited excellent thermal switching characteristics that can reach temperature equilibrium within 100 s, and recovery to ambient temperature within 50 s. The maximum working temperature of the as-prepared film is 115 °C, which is consistent with the result of the theoretical calculation, demonstrating a good electrothermal conversion capability. Finally, the heating application under extreme low temperature (−196 °C) was achieved. This conceptual study showed the promising value of the prototype strategy to the specific application areas such as the field of smart homes, flexible electronics, wearable thermal management, and high-performance heating systems.

Static and Dynamic Response of a Cu-Ni Thin Film Heat Flux Sensor

2014 ◽  
Vol 960-961 ◽  
pp. 304-307
Author(s):  
Shuo Wu ◽  
Fang Ye ◽  
Hang Guo ◽  
Chong Fang Ma
Keyword(s):  
Thin Film ◽  
Heat Flux ◽  
Polyimide Film ◽  
Heat Flux Sensor ◽  
Coating Technology ◽  
State Tests ◽  
Static And Dynamic Tests ◽  
Film Substrate ◽  
Different Thickness ◽  
Flux Sensor

A Cu-Ni thin film heat flux sensor had been fabricated on a 0.05mm thick polyimide film substrate by vacuum coating technology. The overall dimension of the sensor was 8 mm long and 4 mm wide. A thermopile and a thermocouple were arranged on the substrate to measure both heat flux and surface temperature. The thermopile had 18 thermocouple junctions which formed 9 pairs of differential thermocouples and were covered by two different thickness of thermal resistance layers. This research carried out static and dynamic tests of the thin film heat flux sensor. Seebeck coefficient of thermocouple is 19.3761μV/(°C). Sensitivity of the thermopile is 0.010121μV/(W/m2). Steady-state tests of the thermopile and the thermocouple were taken separately. Time constant of the thermocouple is about 0.26s, which is faster than the thermopile of 1.57s.

Delamination-Based Measurement and Prediction of the Adhesion Energy of Thin Film/Substrate Interfaces

2017 ◽  
Vol 139 (2) ◽  
Author(s):  
Liangliang Zhu ◽  
Xi Chen
Keyword(s):  
Thin Film ◽  
Flexible Electronics ◽  
Current Method ◽  
Adhesion Energy ◽  
Two Dimensional ◽  
Soft Substrate ◽  
Interface Adhesion ◽  
Compliant Substrates ◽  
And Performance ◽  
Film Substrate

With the rapid emerging of two-dimensional (2D) micro/nanomaterials and their applications in flexible electronics and microfabrication, adhesion between thin film and varying substrates is of great significance for fabrication and performance of micro devices and for the understanding of the buckle delamination mechanics. However, the adhesion energy remains to be difficult to be measured, especially for compliant substrates. We propose a simple methodology to deduce the adhesion energy between a thin film and soft substrate based on the successive or simultaneous emergence of wrinkles and delamination. The new metrology does not explicitly require the knowledge of the Young's modulus, Poisson's ratio, and thickness of the 2D material, the accurate measurement of which could be a challenge in many cases. Therefore, the uncertainty of the results of the current method is notably reduced. Besides, for cases where the delamination width is close to the critical wrinkle wavelength of the thin film/substrate system, the procedure can be further simplified. The simple and experimentally easy methodology developed here is promising for determining/estimating the interface adhesion energy of a variety of thin film/soft substrate systems.

Stencil Printing of Liquid Metal upon Electrospun Nanofibers Enables High-Performance Flexible Electronics

ACS Nano ◽  
2021 ◽  
Author(s):  
Meng Wang ◽  
Chao Ma ◽  
Pierre Claver Uzabakiriho ◽  
Xi Chen ◽  
Zhongrong Chen ◽  
...  
Keyword(s):  
Liquid Metal ◽  
Flexible Electronics ◽  
High Performance ◽  
Electrospun Nanofibers ◽  
Stencil Printing

Design of Tool for Exfoliation of Monocrystalline Microscale Silicon Films

2019 ◽  
Vol 7 (1) ◽  
Author(s):  
Martin Ward ◽  
Michael Cullinan
Keyword(s):  
Thin Film ◽  
Surface Roughness ◽  
Flexible Electronics ◽  
High Performance ◽  
Single Crystal Silicon ◽  
Complementary Metal Oxide Semiconductor ◽  
Metal Oxide Semiconductor ◽  
Oxide Semiconductor ◽  
Crystal Silicon ◽  
Electronic Products

This paper presents the development of a prototype exfoliation tool and process for the fabrication of thin-film, single crystal silicon, which is a key material for creating high-performance flexible electronics. The process described in this paper is compatible with traditional wafer-based, complementary metal–oxide–semiconductor (CMOS) fabrication techniques, which enables high-performance devices fabricated using CMOS processes to be easily integrated into flexible electronic products like wearable or internet of things devices. The exfoliation method presented in this paper uses an electroplated nickel tensile layer and tension-controlled handle layer to propagate a crack across a wafer while controlling film thickness and reducing the surface roughness of the exfoliated devices as compared with previously reported exfoliation methods. Using this exfoliation tool, thin-film silicon samples are produced with a typical average surface roughness of 75 nm and a thickness that can be set anywhere between 5 μm and 35 μm by changing the exfoliation parameters.

Directly deposited MoS2thin film electrodes for high performance supercapacitors

2015 ◽  
Vol 3 (47) ◽  
pp. 24049-24054 ◽  
Author(s):  
Nitin Choudhary ◽  
Mumukshu Patel ◽  
Yee-Hsien Ho ◽  
Narendra B. Dahotre ◽  
Wonki Lee ◽  
...  
Keyword(s):  
Thin Film ◽  
Flexible Electronics ◽  
High Performance ◽  
Cyclic Stability ◽  
Two Dimensional ◽  
Polymer Substrates ◽  
Energy Devices ◽  
Direct Deposition ◽  
Cu Foil

We demonstrate the direct deposition of two-dimensional (2D) MoS2thin film on Cu-foil and polymer substrates, exhibiting an excellent capacitance and outstanding cyclic stability. The MoS2based supercapacitors will enable new opportunities in flexible electronics and energy devices.

12-GHz Thin-Film Transistors on Transferrable Silicon Nanomembranes for High-Performance Flexible Electronics

Small ◽  
2010 ◽  
Vol 6 (22) ◽  
pp. 2553-2557 ◽  
Author(s):  
Lei Sun ◽  
Guoxuan Qin ◽  
Jung-Hun Seo ◽  
George K. Celler ◽  
Weidong Zhou ◽  
...  
Keyword(s):  
Thin Film ◽  
Flexible Electronics ◽  
Thin Film Transistors ◽  
High Performance ◽  
Silicon Nanomembranes
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