MPPE/SEBS Composites with Low Dielectric Loss for High-Frequency Copper Clad Laminates Applications

Copper clad laminates (CCLs) with low dissipation factor (Df) are urgently needed in the fields of high-frequency communications devices. A novel resin matrix of modified poly (2,6-dimethyl-1,4-phenylene ether) (MPPE) and styrene-ethylene/butylene-styrene (SEBS) was employed in the fabrication of high-frequency copper clad laminates (CCLs). The composites were reinforced by E-glass fabrics, which were modified with phenyltriethoxysilane (PhTES). The composite laminates obtained exhibited impressive dielectric loss of 0.0027 at 10 GHz when the weight ratio of MPPE to SEBS was 5:1. In order to modify the dielectric constant (Dk), coefficient of thermal expansion (CTE) and other performances of laminates, Li2TiO3 (LT) ceramic powders were introduced into the resin matrix. The composite laminates showed low dielectric loss of 0.0026 at 10 GHz and relatively high flexural strength of 125 MPa when the mass ratio of LT fillers to resin is 0.4. Moreover, the composite laminates all maintain low water uptake (<0.5%). The microstructure and thermal properties of composite laminates filled with LT ceramic powders were also tested. These results show that copper clad laminates prepared with modified polyphenylene ether (MPPE)/SEBS and LT ceramic fillers have strong competitiveness to fabricate printed circuit boards (PCBs) for high-frequency and high-speed applications.

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Build-up Electrical Insulation Material with Low-Dielectric Loss Tangent, Low-CTE and Low-Surface Roughness

International Symposium on Microelectronics ◽

10.4071/isom-2011-wp5-paper2 ◽

2011 ◽

Vol 2011 (1) ◽

pp. 000813-000819

Author(s):

Eita HORIKI ◽

Isao SUZUKI ◽

Toshiaki TANAKA ◽

Akihiro UENISHI ◽

Hiroshi KOUYANAGI

Keyword(s):

Surface Roughness ◽

Dielectric Loss ◽

Loss Tangent ◽

Dielectric Loss Tangent ◽

High Frequency ◽

Transmission Loss ◽

Coefficient Of Thermal Expansion ◽

Electrical Insulation ◽

Insulation Material ◽

Low Dielectric

With the increasing speed of information and communication equipments in recent years, together with the high-speed signal processing of LSIs, there is a requirement for build-up electrical insulation materials (used in IC package substrates) to have low-dielectric loss tangent which reduces dielectric loss so as to achieve low transmission loss in the high-frequency GHz bands. At the same time, there is an increasing need for materials to have low-CTEs (Coefficient of Thermal Expansion) so as to ensure highly reliable substrates. With ou formulation technology, we have developed a next-generation film-shaped build-up electrical insulation material compatible with high-frequency signal transmission by using a composition of practical thermosetting epoxy resin, which has realized both a low-dielectric loss tangent and at the same time, a low-CTE. In addition, this material can show a low-surface roughness after the film desmear process. It is thus expected to help reduce not only dielectric loss by means of a low-dielectric loss tangent, but also conductor loss caused by the skin effect, and will promote fine line formation by means of SAP (Semi Additive Process).

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Sandwich-Layered Dielectric Film with Intrinsically Excellent Adhesion, Low Dielectric Constant, and Ultralow Dielectric Loss for a High-Frequency Flexible Printed Circuit

Industrial & Engineering Chemistry Research ◽

10.1021/acs.iecr.1c01676 ◽

2021 ◽

Author(s):

Yang Zhang ◽

Zhiyu Liu ◽

Xianlong Zhang ◽

Shaoyun Guo

Keyword(s):

Dielectric Constant ◽

Dielectric Loss ◽

High Frequency ◽

Dielectric Film ◽

Low Dielectric Constant ◽

Printed Circuit ◽

Low Dielectric ◽

Flexible Printed Circuit ◽

Excellent Adhesion ◽

Layered Dielectric

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Core-Shell Sr2CeO4@SiO2 Filled COC‑Based Composites with Low Dielectric Loss for High-Frequency Substrates

Polymers ◽

10.3390/polym13224006 ◽

2021 ◽

Vol 13 (22) ◽

pp. 4006

Author(s):

Qinlong Wang ◽

Hao Wang ◽

Caixia Zhang ◽

Qilong Zhang ◽

Hui Yang

Keyword(s):

Thermal Conductivity ◽

Dielectric Loss ◽

High Frequency ◽

High Speed ◽

Heat Dissipation ◽

Coefficient Of Thermal Expansion ◽

Signal Transmission ◽

Sol Gel ◽

Normal Operation ◽

Core Shell

High-frequency communication equipment urgently needs substrate materials with lower dielectric loss, better heat dissipation, and higher stability, to ensure real-time low-loss and high-speed signal transmission. The core-shell structure of Sr2CeO4@SiO2 was prepared by the sol-gel method, and the modified powders with different volume contents were introduced into the cyclic olefin copolymer (COC) to prepare hydrocarbon resin-based composites. Due to the protective effect of the SiO2 shell, the stability of the powders is significantly improved, and the moisture barrier and corrosion resistance of the composites are enhanced, which is conducive to the normal operation of electronic equipment in harsh and complex environments. When the filler content is 20 vol%, the composite has a dielectric loss of 0.0023 at 10 GHz, a dielectric constant of 3.5, a thermal conductivity of 0.9 W·m−1·K−1, a water absorption of 0.32% and a coefficient of thermal expansion of 37.7 ppm/℃. The COC/Sr2CeO4@SiO2 composites exhibit excellent dielectric properties and thermal conductivity, while maintaining good moisture resistance and dimensional stability, which shows potential application prospects in the field of high-frequency substrates.

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Photosensitive Polyimide having low loss tangent for RF application

International Symposium on Microelectronics ◽

10.4071/2380-4505-2018.1.000476 ◽

2018 ◽

Vol 2018 (1) ◽

pp. 000476-000482 ◽

Cited By ~ 2

Author(s):

Masao Tomikawa ◽

Hitoshi Araki ◽

Yohei Kiuchi ◽

Akira Shimada

Keyword(s):

Molecular Structure ◽

Dielectric Constant ◽

Dielectric Properties ◽

Dielectric Loss ◽

High Frequency ◽

Low Dielectric Constant ◽

Low Loss ◽

Elongation At Break ◽

Low Dielectric ◽

The Poor

Abstract Progress of 5G telecommunication and mm radar for autopilot, high frequency operation is required. Insulator materials having low loss at high frequency is desired for the applications. We designed the low dielectric constant, and low dielectric loss materials examined molecular structure of the polyimide and found that permittivity 2.6 at 20GHz, dielectric loss 0.002. Furthermore, in consideration of mechanical properties such as the toughness and adhesion to copper from a point of practical use. Dielectric properties largely turned worse when giving photosensitivity. To overcome the poor dielectric properties, we designed the photosensitive system. After all, we successfully obtained 3.5 of dielectric constant and 0.004 of dielectric loss, and 100% of elongation at break. In addition, we offered a B stage sheet as well as varnish. These materials are applicable to re-distribution layer of FO-WLP, Interposer and other RF applications for microelectronics.

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Advanced Build-up Materials for High Speed Transmission Application

International Symposium on Microelectronics ◽

10.4071/2380-4505-2018.1.000305 ◽

2018 ◽

Vol 2018 (1) ◽

pp. 000305-000309 ◽

Cited By ~ 2

Author(s):

Shiro Tatsumi ◽

Shohei Fujishima ◽

Hiroyuki Sakauchi

Keyword(s):

High Speed ◽

Printed Circuit Boards ◽

Transmission Loss ◽

Coefficient Of Thermal Expansion ◽

Strip Line ◽

Circuit Boards ◽

Additive Process ◽

Printed Circuit ◽

Low Dielectric ◽

Transmission Speed

Abstract Build-up process is a highly effective method for miniaturization and high density integration of printed circuit boards. Along with increasing demands for high transmission speed of electronic devices with high functionality, packaging substrates installed with semiconductors in such devices are strongly required to reduce the transmission loss. Our insulation materials are used in a semi-additive process (SAP) with low dielectric loss tangent, smooth resin surface after desmear, and good insulation reliability. Actually, the transmission loss of strip line substrates and Cu surface roughness impact on transmission loss were measured using our materials. Furthermore, low dielectric molding film with low coefficient of thermal expansion (CTE) and low Young's modulus are introduced.

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Advanced Build-up Materials and Processes for Packages with Fine Line and Space

International Symposium on Microelectronics ◽

10.4071/isom-wa32 ◽

2014 ◽

Vol 2014 (1) ◽

pp. 000444-000447 ◽

Cited By ~ 5

Author(s):

Yoshio Nishimura ◽

Hirohisa Narahashi ◽

Shigeo Nakamura ◽

Tadahiko Yokota

Keyword(s):

Printed Circuit Boards ◽

Coefficient Of Thermal Expansion ◽

High Reliability ◽

Electronic Devices ◽

Circuit Boards ◽

Additive Process ◽

Fine Line ◽

Printed Circuit ◽

Low Dielectric ◽

Line Space

Printed circuit boards manufactured by a semi-additive process are widely used for packaging substrates. Along with increasing demands of downsizing electronic devices with high functionality, packaging substrates installed with semiconductors in such devices are strongly required to be miniaturized with high density of circuit wirings. We report our insulation build-up materials and processes for advanced packages with fine line/space and high reliability. The insulation materials we developed show low coefficient of thermal expansion (CTE), low dielectric loss tangent and good thinner insulation reliability. They can produce fine line and space (FLS) under 10μm pitch by a semi-additive process.

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