scholarly journals Nanoarchitectonics of BN/AgNWs/Epoxy Composites with High Thermal Conductivity and Electrical Insulation

Polymers ◽  
2021 ◽  
Vol 13 (24) ◽  
pp. 4417
Author(s):  
Xue Li ◽  
Ling Weng ◽  
Hebing Wang ◽  
Xiaoming Wang

To promote the construction of the thermal network in the epoxy resin (EP), a certain proportion of silver nanowires (AgNWs) coupled with the hexagonal boron nitride (BN) nanoplates were chosen as fillers to improve the thermal conductivity of EP resin. Before preparing the composites, BN was treated by silane coupling agent 3-aminopropyltriethoxysilane (KH550), and AgNWs was coated by dopamine hydrochloride. The BN/AgNWs/EP composites were prepared after curing, and the thermal conductivity and dielectric properties of the composites was tested. Results showed that the AgNWs and BN were uniformly dispersed in epoxy resin. It synergistically built a thermal network and greatly increased the thermal conductivity of the composites, which increased 9% after adding AgNWs. Moreover, the electrical property test showed that the addition of AgNWs had little effect on the dielectric constant and dielectric loss of the composites, indicating a rather good electrical insulation of the composites.


NANO ◽  
2018 ◽  
Vol 13 (11) ◽  
pp. 1850133 ◽  
Author(s):  
Ling Weng ◽  
HeBing Wang ◽  
Xiaorui Zhang ◽  
Lizhu Liu ◽  
Hexin Zhang

The hexagonal boron nitride nanosheets (BN) were firstly treated by silane coupling agents 3-aminopropyltriethoxysilane (KH550) and 3-glycidoxypropyl-trimethoxysilane (KH560) to introduce some amino and epoxy (EP) groups on the BN surface. These modified BN nanosheets were incorporated into an EP matrix to prepare BN@KH560/EP composites with excellent thermal conductivity and electrical insulation properties. Results showed that the thermal conductivity of BN@KH560/EP composite with 20[Formula: see text]vol% BN dosage was found to be 0.442[Formula: see text]W/(m[Formula: see text]K), which was 81% higher than that of pure EP resin. Both BN/EP composites treated by KH550 and KH560 showed rather good electrical insulation properties, although the dielectric constant of BN@KH550/EP composites were slightly higher than BN@KH560/EP composites. Moreover, BN@KH560/EP composites also showed better thermal and mechanical properties than that of BN@KH550/EP composites.



Nanomaterials ◽  
2019 ◽  
Vol 9 (9) ◽  
pp. 1264 ◽  
Author(s):  
Li Zhang ◽  
Wenfeng Zhu ◽  
Ying Huang ◽  
Shuhua Qi

One-dimensional silver nanowires (AgNWs) and two-dimensional graphene oxide (GO) were combined to construct a three-dimensional network structure. The AgNWs can effectively inhibit stacking of adjacent GO sheets by occupying regions between layers of GO. Moreover, the GO sheets embedded in the gaps of the AgNWs network increase the interfacial contact area between the AgNWs and the epoxy matrix, resulting in the formation of more efficient phonon transport channels. To prepare an epoxy-based thermal conductive composite, hybrid networks were fabricated and added to epoxy resin using a solution mixing method. Significant synergistic effects were observed between the AgNWs and GO sheets. The thermal conductivity of epoxy composites filled with 10 wt.% AgNW/GO hybrids was found to be 1.2 W/mK and the impact strength was 28.85 KJ/m2, which are higher than the corresponding values of composites containing AgNWs or GO sheets alone. Thus, the thermal conductivity and impact strength of the epoxy composites were improved. The additive effects are mainly owing to the improved interfacial contact between the hybrid fillers and the epoxy resin, resulting in a more efficient phonon transport network. The use of hybrid fillers with different structures is a simple and scalable strategy for manufacturing high-performance thermally conductive materials for electronic packaging.



Author(s):  
Jing He ◽  
Hua Wang ◽  
Zheng Su ◽  
Yulan Guo ◽  
Xingyou Tian ◽  
...  


2011 ◽  
Vol 316 (1) ◽  
pp. 185-190 ◽  
Author(s):  
Xiao-kun Ma ◽  
Nam-Hee Lee ◽  
Hyo-Jin Oh ◽  
Sang-Chul Jung ◽  
Won-Jae Lee ◽  
...  


2019 ◽  
Vol 40 (S2) ◽  
pp. E1600-E1611 ◽  
Author(s):  
Yulan Guo ◽  
Jing He ◽  
Hua Wang ◽  
Zheng Su ◽  
Qiqi Qu ◽  
...  


2013 ◽  
Vol 14 (5) ◽  
pp. 759-766 ◽  
Author(s):  
Jinshui Yang ◽  
Jiayu Xiao ◽  
Jingcheng Zeng ◽  
Liping Bian ◽  
Chaoyi Peng ◽  
...  




2015 ◽  
Vol 3 (27) ◽  
pp. 7195-7202 ◽  
Author(s):  
Jun-Wei Zha ◽  
Tian-Xing Zhu ◽  
Yun-Hui Wu ◽  
Si-Jiao Wang ◽  
Robert K. Y. Li ◽  
...  

Epoxy resin is widely used for electrical and electronics packaging in various forms due to its excellent adhesion, low cure shrinkage and good electrical insulation.





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