scholarly journals Photolithographically Home-Made PVDF Sensor for Cavitation Impact Load Measurement

Processes ◽  
2021 ◽  
Vol 9 (10) ◽  
pp. 1761
Author(s):  
Jan Hujer ◽  
Petra Dančová ◽  
Tomáš Kořínek ◽  
Miloš Müller
Keyword(s):  
Cavitation Bubble ◽  
Printed Circuit Boards ◽  
Impact Load ◽  
Protective Layer ◽  
Circuit Boards ◽  
Ball Impact ◽  
Load Measurement ◽  
Printed Circuit ◽  
Laboratory Techniques ◽  
Theoretical And Numerical Analysis

Piezoelectric PVDF sensors offer a unique option for the measurement of cavitation aggressiveness represented by the magnitude of impacts due to cavitation bubble collapses near walls. The aggressiveness measurement requires specific sensor shape and area, whereas commercial PVDF sensors are fabricated in limited geometry and size ranges. The photolithography method offers a possibility of production of home-made PVDF sensors of arbitrary shape and size. The methodology of a unique application of the standard photolithography method, which is commonly used for the production of printed circuit boards, is described in this paper. It enables mass production of high quality sensors contrary to laboratory techniques. This paper deals with the fabrication and the calibration of a photolithographically home-made PVDF sensor for the cavitation impact load measurement. The calibration of sensors was carried out by the ball drop method. Sensors of different sizes were fabricated by the photolithography method from a multi-purpose, both side metallized PVDF sheet. Commercial PVDF sensors of the same size were calibrated, and the calibration results were compared with the home-made sensors. The effect of size and the effect of one added protective layer of Kapton tape on a sensor sensitivity were investigated. The theoretical and numerical analysis was conducted to explain some issues during the ball impact.

scholarly journals Photolithographically Home-Made PVDF Sensor for Cavitation Impact Load Measurement

2020 ◽  
Vol 328 ◽  
pp. 01004
Author(s):  
Jan Hujer ◽  
Menghuot Phan ◽  
Tomáš Kořínek ◽  
Petra Dančová ◽  
Miloš Müller
Keyword(s):  
Cavitation Bubble ◽  
Arbitrary Shape ◽  
Printed Circuit Boards ◽  
Impact Load ◽  
Protective Layer ◽  
Circuit Boards ◽  
Load Measurement ◽  
Printed Circuit ◽  
Kapton Tape ◽  
Shape And Size

Piezoelectric PVDF sensors offer a unique option for the measurement of cavitation aggressiveness represented by the magnitude of impacts due to cavitation bubble collapses near walls. The aggressiveness measurement requires specific sensors shape and area, whereas commercial PVDF sensors are fabricated in limited geometry and size ranges. The photolithography method offers a possibility of production of home-made PVDF sensors of arbitrary shape and size. This paper deals with the calibration of a photolithographically home-made PVDF sensor for the cavitation impact load measurement. The calibration of sensors was carried out by the ball drop method. Sensors of different sizes were fabricated by the photolithography method from multi-purpose both side metallized PVDF sheet. The standard technology used for the fabrication of printed circuit boards was utilized. Commercial PVDF sensors of the same size were calibrated and the calibration results were compared with the home-made sensors. The effect of size and the effect of one added protective layer of Kapton tape on a sensor sensitivity were investigated.

Experimental Study on Impact Mechanical Properties of Waste Printed Circuit Boards

2010 ◽  
Vol 113-116 ◽  
pp. 1123-1127
Author(s):  
Nian Xin Zhou ◽  
Ya Qun He ◽  
Chen Long Duan ◽  
Shu Ai Wang
Keyword(s):  
Mechanical Properties ◽  
Printed Circuit Boards ◽  
Impact Load ◽  
Circuit Board ◽  
Circuit Boards ◽  
X Ray ◽  
Printed Circuit ◽  
Waste Printed Circuit Boards ◽  
The Impact ◽  
Scanning Electron

Comminution is a key part of the reutilization of discarded circuit board. In order to find out the most appropriate method of crushing, the characteristics of the materials and the mechanical properties of resistance impact of discarded circuit boards were studied. The substrate of circuit boards, slots of ISA and PCI were adopted as the specimen. The scanning electron microscope (SEM) and energy disperse X-ray spectroscopy (EDX) were used to characterize and analyze the combined state of the fracturing materials on the specimen surfaces after comminution. Results showed that the metals and nonmetals in the slots were crushed and dissociated easily.At the same time, the metal and nonmetal combined interfaces in the substrate have a trend to be broken and separated under the impact effect, which means the crushing circuit board has a favorable break effect under impact load.

Slit Effect of Common Ground Patterns in Affecting Cross-Talk Noise between Two Parallel Signal Traces on Printed Circuit Boards

2008 ◽  
Vol 128 (11) ◽  
pp. 657-662 ◽  
Author(s):  
Tsuyoshi Maeno ◽  
Yukihiko Sakurai ◽  
Takanori Unou ◽  
Kouji Ichikawa ◽  
Osamu Fujiwara
Keyword(s):  
Cross Talk ◽  
Printed Circuit Boards ◽  
Common Ground ◽  
Circuit Boards ◽  
Printed Circuit

Influence of Component Mounting Density on Oscillating Characteristics of Multilayer Printed Circuit Boards

2018 ◽  
Vol 23 (2) ◽  
pp. 141-148
Author(s):  
S.Sh. Rekhviashvili ◽  
◽  
M.O. Mamchuev ◽  
V.V. Narozhnov ◽  
M.M. Oshkhunov ◽  
...  
Keyword(s):  
Printed Circuit Boards ◽  
Circuit Boards ◽  
Printed Circuit ◽  
Oscillating Characteristics

Noise properties of thin-film Ni-P resistors embedded in printed circuit boards

2013 ◽  
Vol 61 (3) ◽  
pp. 731-735
Author(s):  
A.W. Stadler ◽  
Z. Zawiślak ◽  
W. Stęplewski ◽  
A. Dziedzic
Keyword(s):  
Thin Film ◽  
Printed Circuit Boards ◽  
Circuit Boards ◽  
Noise Component ◽  
Printed Circuit ◽  
Resistance Bridge ◽  
Different Types ◽  
Signal Path ◽  
Resistance Fluctuations ◽  
Made In

Abstract. Noise studies of planar thin-film Ni-P resistors made in/on Printed Circuit Boards, both covered with two different types of cladding or uncladded have been described. The resistors have been made of the resistive-conductive-material (Ohmega-Ply©) of 100 Ώ/sq. Noise of the selected pairs of samples has been measured in the DC resistance bridge with a transformer as the first stage in a signal path. 1/f noise caused by resistance fluctuations has been found to be the main noise component. Parameters describing noise properties of the resistors have been calculated and then compared with the parameters of other previously studied thin- and thick-film resistive materials.

Sign in / Sign up

Export Citation Format

Share Document