scholarly journals Methodological Consideration on the Prediction of Electrochemical Mechanical Polishing Process Parameters by Monitoring of Electrochemical Characteristics of Copper Surface

2020 ◽  
Author(s):  
Yong-Jin Seo
Keyword(s):  
Process Parameters ◽  
Copper Surface ◽  
Mechanical Polishing ◽  
Electrochemical Characteristics ◽  
Polishing Process ◽  
Methodological Consideration ◽  
Electrochemical Mechanical Polishing

Experimental Research of Electrochemical Mechanical Polishing (ECMP) for Micro Tool Electrode

2011 ◽  
Vol 314-316 ◽  
pp. 1846-1850 ◽  
Author(s):  
Shuai Guo ◽  
Z.N Guo ◽  
Hong Ping Luo ◽  
Wen Cai Gu
Keyword(s):  
Experimental Research ◽  
Process Parameters ◽  
Mechanical Polishing ◽  
Working Fluid ◽  
Tool Electrode ◽  
Electrical Parameters ◽  
Electrochemical Mechanical Polishing ◽  
Major Process ◽  
Micro Tool ◽  
Quantitative Analyses

The mechanism of the elctrochemical mechanical polishing (ECMP) technology for micro tool electrode was investigated. In this paper, suitable major process parameters on the surface quality were evaluated, the major parameters contains electrical parameters, machining gap, the working fluid and other factors. In quantitative analyses, the process of the ECMP technology were conducted. The roughness of the workpiece was reduced from a relatively high value to a mirror effect.

Study on electrochemical mechanical polishing process of copper circuit on PCB

2010 ◽  
Vol 27 (1) ◽  
pp. 310-314 ◽  
Author(s):  
Nadiia Kulyk ◽  
Chang Yong An ◽  
Jung Hoon Oh ◽  
Sung Min Cho ◽  
Changsup Ryu ◽  
...  
Keyword(s):  
Mechanical Polishing ◽  
Polishing Process ◽  
Electrochemical Mechanical Polishing
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