Acoustic Field Analysis of a T Type Waveguide in Single Wafer Megasonic Cleaning and its Effect on Particle Removal

2007 ◽  
pp. 229-232
Author(s):  
Yang Lae Lee ◽  
Eui Su Lim ◽  
Kook Jin Kang ◽  
Hyun Se Kim ◽  
Tae Gon Kim ◽  
...  
Keyword(s):  
Acoustic Field ◽  
Field Analysis ◽  
Particle Removal ◽  
Megasonic Cleaning

Acoustic Field Analysis of a T Type Waveguide in Single Wafer Megasonic Cleaning and its Effect on Particle Removal

2007 ◽  
Vol 134 ◽  
pp. 229-232 ◽  
Author(s):  
Yang Lae Lee ◽  
Eui Su Lim ◽  
Kook Jin Kang ◽  
Hyun Se Kim ◽  
Tae Gon Kim ◽  
...  
Keyword(s):  
Finite Element Method ◽  
Acoustic Pressure ◽  
Field Analysis ◽  
Particle Removal ◽  
Pressure Measurements ◽  
Cleaning Efficiency ◽  
Transverse Waves ◽  
Megasonic Cleaning ◽  
Longitudinal Waves ◽  
Wafer Cleaning

T type megasonic waveguide was analyzed by finite element method (FEM), acoustic pressure measurements and particle removal efficiency for the single wafer cleaning application. Compared to conventional longitudinal waves, a transverse waves were generated in a T type waveguide. Not like longitudinal waves, transverse waves showed changes of direction and phase which increased the cleaning efficiency.

Particle removal from semiconductor wafers by megasonic cleaning

1996 ◽  
Vol 27 ◽  
pp. S427-S428 ◽  
Author(s):  
T.H. Kuehn ◽  
D.B. Kittelson ◽  
Y. Wu ◽  
R. Gouk
Keyword(s):  
Particle Removal ◽  
Megasonic Cleaning

High Efficiency Single Wafer Cleaning for Wafer Bonding-Based 3D Integration Applications

2012 ◽  
Vol 187 ◽  
pp. 269-272 ◽  
Author(s):  
Don Dussault ◽  
F. Fournel ◽  
V. Dragoi
Keyword(s):  
Removal Efficiency ◽  
Wafer Bonding ◽  
High Efficiency ◽  
Current Work ◽  
Particle Removal ◽  
3D Integration ◽  
Production Scale ◽  
Megasonic Cleaning ◽  
Wafer Cleaning ◽  
Transducer Design

Current work describes development, testing and verification of a single wafer megasonic cleaning method utilizing a transducer design that meets the extreme particle neutrality, Particle Removal Efficiency (PRE), and repeatability requirements of production scale wafer bonding and other applications requiring extremely low particle levels.

Simulation of Acoustic Field for Megasonic Bath Cleaning in Advanced Semiconductor Manufacturing

2013 ◽  
Vol 289 ◽  
pp. 81-86
Author(s):  
Ya Ting Huang ◽  
Xiu Ping Dong
Keyword(s):  
Acoustic Field ◽  
Sound Wave ◽  
Semiconductor Manufacturing ◽  
Semiconductor Industry ◽  
Wave Direction ◽  
Megasonic Cleaning ◽  
Local Areas ◽  
Small Structure ◽  
Wafer Surfaces

Megasonic cleaning has been one of the most successful techniques for nanoparticle cleaning in semiconductor industry. However, the megasonic energy often causes a pattern collapse and some damage to very small structure. In this study, the distribution of sonic pressure in a wet cleaning bath with different arrangement of megasonic transducers is simulated. Megasonic wave transmits directional and will be disturbed. Thus the wafer surfaces should be arranged parallel to the sound wave direction of propagation. Convergence gain in the whole cleaning space is limited but results in great variance in local areas. Thus the wafer moving, rotating and oscillating is necessary.

Particle Removal Efficiency and Damage Analysis on Silicon Wafers after Megasonic Cleaning in Solvents

2009 ◽  
Vol 23 (12) ◽  
pp. 1709-1721 ◽  
Author(s):  
Francesca Barbagini ◽  
Sandip Halder ◽  
Tom Janssens ◽  
Karine Kenis ◽  
Kurt Wostyn ◽  
...  
Keyword(s):  
Removal Efficiency ◽  
Silicon Wafers ◽  
Damage Analysis ◽  
Particle Removal ◽  
Megasonic Cleaning

Ex Situ Bubble Generation, Enhancing the Particle Removal Rate for Single Wafer Megasonic Cleaning Processes

2007 ◽  
Vol 134 ◽  
pp. 201-204 ◽  
Author(s):  
Frank Holsteyns ◽  
Tom Janssens ◽  
Sophia Arnauts ◽  
Wouter Van der Putte ◽  
Vincent Minsier ◽  
...  
Keyword(s):  
Removal Rate ◽  
Ex Situ ◽  
Particle Removal ◽  
Bubble Generation ◽  
Megasonic Cleaning

Impact of Re-Gasified Water on Megasonic Cleaning

2007 ◽  
Vol 134 ◽  
pp. 217-220 ◽  
Author(s):  
Boon Cheng Goh ◽  
Felicia Goh ◽  
Christopher Lim ◽  
Zainab Ismail ◽  
Mei Sheng Zhou
Keyword(s):  
Removal Efficiency ◽  
Particle Removal ◽  
Megasonic Cleaning ◽  
Cavitation Activity

Megasonic cleaning using de-gassed water (less than 2ppm N2, O2, CO2) in a 300mm batch immersion tool often does not give optimal particle performance, with particle streaks and clusters added onto the wafer, and low particle removal efficiency (PRE). When water was re-gasified with N2, the resultant stable cavitation activity reduced particle adders and increased PRE. With N2 concentration increased to just above 5ppm, number of particle adders decreased by three folds. Optimal particle performance could be obtained by operating at an N2 level close to saturation.

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