Research on Interference of Electromagnetic Radiation on Micro-Strip Line

2011 ◽  
Vol 110-116 ◽  
pp. 971-976
Author(s):  
Hong You Wang ◽  
Jin Guang Li

Micro-strip line is a kind of transmission line that is the most widely used in microwave integrated circuit. With the development of microwave integrated circuits and the increasing work frequency of the micro-strip line, a higher requirement for its electromagnetic compatibility has been raised. Finite-Difference Time-Domain (FDTD) method has characteristics of good adaptability in the analysis of electromagnetic compatibility issues and superiority in complexity of the structure modeling. For these reasons, this Article uses FDTD method which is widely used in electromagnetic field calculation to analyze the time-domain of micro-strip line, calculates its current and voltage induced in ports and discuss the response feature under different radiation conditions.

2012 ◽  
Vol 20 (01) ◽  
pp. 1250004 ◽  
Author(s):  
ANDREAS HÜPPE ◽  
MANFRED KALTENBACHER

In recent years the development of free field radiation conditions in the time domain has become a topic of intensive research. Perfectly matched layer (PML) approaches for the frequency domain are well known. In the time domain, on the other hand, they suffer in many cases from highly increased complexity and instabilities. In this paper, we introduce a PML for the conservation equations of linear acoustics. The used formulation requires three auxiliary variables in 3D and circumvents thereby convolution integrals and higher order time derivatives. Furthermore, we prove the weak stability of the proposed formulation and show their good absorption properties by means of numerical examples.


2014 ◽  
Vol 7 (2) ◽  
pp. 173-178 ◽  
Author(s):  
Xiang Gao ◽  
Zhengwei Du

A SPICE model of an antenna for transmitting is proposed. This model allows for the calculation of the frequency-domain radiation fields for a range of frequencies in which the model is valid, it also allows for the direct calculation of the time-domain (TD) radiation fields for an arbitrary TD excitation signal, the spectrum of which should be within the modeling range. The model is then verified by two examples, both of them demonstrate its validity. This model can be a part of a complete system-level model for electromagnetic compatibility simulation.


2015 ◽  
Vol 4 (2) ◽  
pp. 17 ◽  
Author(s):  
N. Deymier ◽  
T. Volpert ◽  
X. Ferrieres ◽  
V. Mouysset ◽  
B. Pecqueux

In electromagnetic compatibility (EMC) context, we are interested in developing new ac- curate methods to solve efficiently and accurately Maxwell’s equations in the time domain. Indeed, usual methods such as FDTD or FVTD present im- portant dissipative and/or dispersive errors which prevent to obtain a good numerical approximation of the physical solution for a given industrial scene unless we use a mesh with a very small cell size. To avoid this problem, schemes like the Discontinuous Galerkin (DG) method, based on higher order spa- tial approximations, have been introduced and stud- ied on unstructured meshes. However the cost of this kind of method can become prohibitive accord- ing to the mesh used. In this paper, we first present a higher order spatial approximation method on carte- sian meshes. It is based on a finite element ap- proach and recovers at the order 1 the well-known Yee’s schema. Next, to deal with EMC problem, a non-oriented thin wire formalism is proposed for this method. Finally, several examples are given to present the benefits of this new method by compar- ison with both Yee’s schema and DG approaches.


2011 ◽  
Vol 8 (3) ◽  
pp. 114-120
Author(s):  
K. Webb ◽  
H. Song

A compensation scheme that reduces the impact of the excess reactance of bond wires is introduced. From the 3D finite element code and the time domain reflectometry (TDR), physical models were evaluated and the excess reactance of the signal path was determined to optimize the compensation structure. The presented method can be employed to reduce the negative impact caused by the excess reactances in bond wires for high signal integrity integrated circuit (IC) packaging applications.


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