Study on the Modification of Polishing Putty by Inorganic Filler
2011 ◽
Vol 50-51
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pp. 780-784
Keyword(s):
In order to decrease the cost of polishing putty, the interrelations between talcum powder as the filler and KH550, KH560, or silane compound coupler were investigated by atomic force microscopy (AFM) and Fourier transform infrared spectrum (FTIR). It was proved that the effect of Modification of KH560 coupler is the best.
2015 ◽
Vol 2015
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pp. 1-12
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2000 ◽
Vol 78
(2)
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pp. 846-856
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2004 ◽
Vol 43
(7B)
◽
pp. 4591-4594
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1998 ◽
Vol 76
(2)
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pp. 159-166
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2016 ◽
Vol 18
(3)
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pp. 507-532
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2018 ◽
Vol 183
◽
pp. 171-179
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2005 ◽
Vol 35
(1)
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pp. 13-20
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