Research on the Package of High Voltage SiC JBS

2015 ◽  
Vol 713-715 ◽  
pp. 1038-1041
Author(s):  
Gang Chen ◽  
Ya Nan Li ◽  
Lin Wang ◽  
Ao Liu ◽  
Song Bai ◽  
...  

According to the application of the high voltage SiC devices, studying the package of three kinds of SiC dies with different metals. Experiments show that all die wire bonding and shear strength measurement up to standard, and provide three kinds of packages for different applications, at the same time, filling the needs of producing. The purpose of the shear strength test is to determine the integrity of materials used to attach SiC die to package substrates.

2014 ◽  
Vol 9 (3) ◽  
pp. 139-150 ◽  
Author(s):  
Ildikó Buocz ◽  
Nikoletta Rozgonyi-Boissinot ◽  
Ákos Török ◽  
Péter Görög

2018 ◽  
Author(s):  
Louay N. Mohammad ◽  
Mostafa A. Elseifi ◽  
Ramendra Das ◽  
Wei Cao ◽  
◽  
...  

2011 ◽  
Vol 417 (1-3) ◽  
pp. 383-386 ◽  
Author(s):  
Hun-Chea Jung ◽  
Tatsuya Hinoki ◽  
Yutai Katoh ◽  
Akira Kohyama

1999 ◽  
Vol 122 (2) ◽  
pp. 168-171 ◽  
Author(s):  
J. Z. Shi ◽  
X. M. Xie ◽  
F. Stubhan ◽  
J. Freytag

A novel two-step process based on isothermal solidification is developed for die attachment of ceramic package. With a simple design of the multilayer system, silicon chip could be bonded onto the allumina substrate in between 200°C and 300°C. The total process time is less than 15 seconds during which the actual assembly time is within one second. Most of the samples can pass the shear strength test specified by MIL STD 883D. All the samples could pass 1750 cycles between −55°C and 125°C with slight degradation in die shear strength after the test. The microstructures of the bonds are characterized with metallographical investigation. Comparisons are made between the present technique and the Au/Si eutectic bonding. [S1043-7398(00)01202-0]


2012 ◽  
Vol 214 ◽  
pp. 333-337
Author(s):  
Guang Zhang ◽  
Jun Rong Ma ◽  
Jing Xi Chen ◽  
Hua Lin Zhou ◽  
Dong Hua Wang

To obtain the necessary shear strength parameters of the retaining wall bottom in a bank revetment project, in-situ shearing strength test must be conducted. There are 3 kinds of foundations. One is undisturbed soil foundation, and the other two are composite foundations. Due to the limited of the engineering conditions, each kind of foundation has prepared one specimen only. So the single shearing strength test can't separate cohesion c and friction angle φ. To solve this problem, a method which is a combination of shear strength test and sliding strength test is used. Sliding strength test is carried on specimens that have already failed after shearing strength test. This test is carried in wet conditions and cohesion values and friction angle values are obtained. In addition, the influence of the processing of composite foundation to equivalent friction coefficient is analyzed. Test result can be referenced by bank revetment projects which have similar geological conditions.


UKaRsT ◽  
2020 ◽  
Vol 4 (2) ◽  
pp. 151
Author(s):  
Anita Widianti ◽  
Willis Diana ◽  
Maratul Hasana

Indonesia is the largest coconut producing country in the world. However, the resulting coir waste is still rarely used for structural materials. This research studied the effect of random inclusion of coir fiber on the shear strength of clay with high plasticity. The carried test in this study is a direct shear strength test. The fiber content variations used are 0%, 0.25%, 0.50%, 0.75%, and 1% of the dry weight of the mixture with a fiber length of between 30 mm to 50 mm. The results show that the reinforcement of coir fiber can increase the cohesion and friction angle. The maximum increase in cohesion value was obtained at fiber content of 0.75%, which was 39.66%. The increase in the value of the friction angle was obtained at 1% fiber content, which was 46.67%. The optimum coir fiber content was achieved at the fiber content of 0.75%. With this content, the value of the shear strength reaches its maximum with an increase of 39.4% at a normal stress of 8.071 kPa.


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