Heat Transfer Analysis of Extruded Rectangular Fin over Conventional Rectangular Fins by Numerical Simulation

2015 ◽  
Vol 812 ◽  
pp. 130-135
Author(s):  
Subramania Pillai Sivaraja ◽  
P.K. Balakumar ◽  
G. Sudha ◽  
R. Parthiban
Keyword(s):  
Heat Transfer ◽  
Heat Sink ◽  
Good Alternative ◽  
Computer Hardware ◽  
Dynamics Simulation ◽  
Junction Temperature ◽  
Heat Transfer Analysis ◽  
Cfd Modeling ◽  
Electronic Components ◽  
Fin Design

Improving the performance of the computers and maintaining the operating temperature is an important task for the computer hardware manufacturers. The junction temperature of the electronic components is a critical problem which needs to be addressed in a competent way. Due to the improvement in the technology, the size and weight of the electronic components reduced to a greater extent and which in turn increases the operating power and speed. This increases the heat generated by the electronic component. Electronic components normally use conventional rectangular fin as heat sink for the step up in heat transfer. The need is to make a heat sink design that should overcome the problem related to transfer of heat by the electronic components. The heat transfer depends on parameters like heat sink’s surface area, pitch, design and material used. Optimization of the fin design by number of experiments is more expensive and laborious as well. CFD (Computational Fluid Dynamics) simulation validated with experimentation can be a good alternative for performing series of experiments. CFD modeling and simulation for the best fin design has been carried out for the current study. An alternative design for conventional rectangular fin has been proposed for this study called as Extruded Rectangular Fin (ERF). The proposed ERF shows good heat transfer when compared to conventional and interrupted rectangular fin with holes. Optimum cooling achieved for the system with the fin aspect ratio of 3.5.

scholarly journals Simulation analysis of heat transfer performance of heat sink with reduced material design

2020 ◽  
Vol 12 (5) ◽  
pp. 168781402092130
Author(s):  
Ya-Chu Chang
Keyword(s):  
Heat Transfer ◽  
Reynolds Number ◽  
Thermal Resistance ◽  
Heat Sink ◽  
Heat Transfer Performance ◽  
Electronic Device ◽  
Local Heating ◽  
Transfer Performance ◽  
Electronic Components ◽  
Thermal Reliability

The field of electronic device applications is becoming more and more extensive. With the development of science and technology and the improvement of the integration of electronic components, local heating is becoming more and more serious. If heat cannot be discharged immediately, it will cause heat to accumulate, causing the temperature of each component to exceed the limit. The reliability of electronic equipment is greatly reduced. Especially in important fields such as military and aerospace, the thermal reliability of electronic components is higher. The research results show that increasing the Reynolds number is helpful to reduce the overall temperature and thermal resistance of the heat sink, but the increase of the Reynolds number and the decrease of the thermal resistance value are gradually flat. The design concept of material reduction has a significant impact on processing and cost. The results of this article show that selecting the appropriate heat sink fins and matching the specific Reynolds number can effectively improve the heat transfer performance of the heat sink.

Performance Enhancement of Air Cooled Heat Sink Used in Inverter Drives of Residential Air Conditioners

2020 ◽  
Vol 28 (01) ◽  
pp. 2050008
Author(s):  
Vignesh Lakshmanan ◽  
Pushpak Doiphode ◽  
Indraneel Samanta
Keyword(s):  
Heat Transfer ◽  
Thermal Performance ◽  
Heat Sink ◽  
Performance Enhancement ◽  
Air Conditioner ◽  
Electronic Components ◽  
Variable Frequency Drive ◽  
Air Conditioners ◽  
Baseline Case ◽  
Heating Load

Inverter air conditioners are being widely used in the air conditioning sector for energy saving purposes. These air conditioners use an inverter or a variable frequency drive (VFD) to control the compressor operating speed based on cooling or heating load fluctuations. If the heat generated by the electronic components of the VFD is not dissipated properly, it can lead to failure of the VFD. In general, a heat sink is used for dissipating the heat generated by the electronic components of the VFD. The heat sink can be either air cooled or liquid cooled. Using computational fluid dynamics (CFD), this paper deals with optimization of the thermal performance of an air cooled plate-fin heat sink with rectangular fins used in a residential split inverter air conditioner. Commercially available CFD tool has been used for simulations. It has been observed that enhancing fluid flow around the heat sink and improving heat transfer area of the fins significantly improve the thermal performance of the heat sink. By using heat sink with rectangular fins having a stepped profile, it has been possible to improve the heat transfer from the baseline case by 27%. Whereas, by using hollow fins, heat transfer improvement of 20% has been achieved.

scholarly journals Heat Transfer Analysis of Hollow Block Ventilated Wall Based on CFD Modeling

2015 ◽  
Vol 121 ◽  
pp. 1312-1317 ◽  
Author(s):  
Jian Yang ◽  
Jinghua Yu ◽  
Chao Xiong
Keyword(s):  
Heat Transfer ◽  
Heat Transfer Analysis ◽  
Cfd Modeling ◽  
Hollow Block

Thermal Simulation Analysis of High Power LED with Varied Heat Sink Fin Design

2014 ◽  
Vol 1082 ◽  
pp. 332-335
Author(s):  
Vithyacharan Retnasamy ◽  
Zaliman Sauli ◽  
Hussin Kamarudin ◽  
Muammar Mohamad Isa ◽  
Gan Meng Kuan
Keyword(s):  
High Power ◽  
Heat Sink ◽  
Simulation Analysis ◽  
Input Power ◽  
Junction Temperature ◽  
Single Chip ◽  
Pin Fin ◽  
High Power Led ◽  
Different Shapes ◽  
Fin Design

In this paper, the heat distribution for single chip high power LED package attached with varied heat sink fin shapes were analyzed through simulation. The main focus of this study was to scrutinize the fluctuation of junction temperature with different shapes of heat sink fin designs. The simulation was done using Ansys version 11. The single chip LED was loaded with input power of 0.5 W and 1 W . Simulation was done at ambient temperature of 25°C under three convection coefficient of 5, 10 and 15 W/m2.oC respectively. The obtained results showed that the LED package with pyramid pin fin heat sink has demonstrated a better thermal performance compared to the LED package with cylindrical pin fin heat sink.

scholarly journals Heat Transfer Analysis of Plate-fin Heat Sink with Piezoelectric Fan

2015 ◽  
Vol 3 (1) ◽  
pp. 12-20
Author(s):  
Yen-Tso Chang ◽  
Han-Ching Lin ◽  
Chi-Jui Huang ◽  
Chun-Hsien Chen ◽  
Chien-Jen Lin ◽  
...  
Keyword(s):  
Heat Transfer ◽  
Heat Sink ◽  
Heat Transfer Analysis

Thermal Performance of Metal Foam Heat Sink With Pin Fins for Nonuniform Heat Flux Electronics Cooling

2020 ◽  
Vol 143 (1) ◽  
Author(s):  
Yongtong Li ◽  
Liang Gong ◽  
Minghai Xu ◽  
Yogendra Joshi
Keyword(s):  
Heat Transfer ◽  
Heat Flux ◽  
Heat Sink ◽  
Heat Transfer Performance ◽  
Metal Foam ◽  
Electronics Cooling ◽  
Flow Distribution ◽  
Junction Temperature ◽  
Transfer Performance ◽  
Pin Fins

Abstract In this paper, a concept of metal foam heat sink with pin fins (MFPF heat sink) is proposed to improve the cooling performance of high-powered electronics with nonuniform heat flux. Numerical simulations are carried out to investigate the thermohydraulic performance of MFPF heat sink, and the metal foam (MF) heat sink and traditional pin fin (PF) heat sink are employed for comparison. The capability of MFPF heat sink in handling nonuniform heat flux is examined under different power levels. It indicates that the MFPF heat sink greatly enhances the heat transfer performance, due to the common effects of the improved flow distribution and enhanced overall effective thermal conductivity (ETC). Results also show that the MFPF heat sink promotes the improvement of the bottom wall temperature uniformity. Porosity has more pronounced effects on heat transfer performance of MFPF heat sink than pore density. A nonuniform distribution heat flux (15–80–15 W/cm2) can be successfully dissipated using the proposed MFPF heat sink with the junction temperature below 95 °C at Re of 500.

Geometric Optimization of Multiple-Arrays of Micropin-Fins

2011 ◽  
Author(s):  
Fervent Urebho Ighalo ◽  
Tunde Bello-Ochende ◽  
Josua Petrus Meyer
Keyword(s):  
Heat Transfer ◽  
Thermal Conductivity ◽  
Reynolds Number ◽  
Heat Sink ◽  
Geometric Optimization ◽  
Dynamics Simulation ◽  
Thermal Conductivity Ratio ◽  
Conductive Heat ◽  
First Case ◽  
Pin Fins

This study concerns the geometric design of a cylindrical micropin-fin heat sink with multiple row configurations. The objective is to maximize the rate of heat transfer from the solid to the fluid subject to total fin volume and manufacturing constraints. A heat sink with dimensions of 1 mm × 0.6 mm × 1 mm is used for the computational analysis. An automated gradient-based optimization algorithm, which effectively handles an objective function obtained from a computational fluid dynamics simulation is implemented. The optimal design is obtained as results of balance of conductive heat transfer along the pin-fins with laminar forced convection. In the first case, the fins are arranged in two rows of pin-fins with different geometric sizes (diameter, height, and spacing between the fins). The optimal configurations obtained as a function of thermal conductivity ratio and Reynolds number are found to be in good agreement with those obtained from theory and numerical optimization. In the second case, the fins are arranged in rows of three, the effect of thermal conductivity and Reynolds number on the optimal configuration and the maximized heat transfer rate from the arrays of cylinders is reported.

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