Study on the Removal Mechanism of Magnetorheological Finishing (MRF) by Using of Nano-Diamond Abrasives

2014 ◽  
Vol 1027 ◽  
pp. 226-229
Author(s):  
Zhi Qiang Xu ◽  
Shao Hui Yin ◽  
Sheng Gong ◽  
Yong Qiang Wang
Keyword(s):  
Surface Quality ◽  
Material Removal ◽  
High Efficiency ◽  
Optical Glass ◽  
Magnetorheological Fluid ◽  
Removal Mechanism ◽  
Material Removal Mechanism ◽  
Magnetorheological Finishing ◽  
Advanced Machining ◽  
Series Of Experiments

Magnetorheological finishing (MRF) is an advanced machining technology can achieve high efficiency and smoother surfaces. This study discusses the material removal mechanism of MRF, and proposes a kind of magnetorheological fluid with the nano-diamond abrasives. A series of experiments on the BK7 optical glass were conducted to investigate effects of the concentration of nano-diamond abrasives on surface quality and removal efficiency.

A Review of Material Removal Mechanism in Ultra-Precision Polishing of Optical Glass

2021 ◽  
Vol 48 (4) ◽  
pp. 0401014
Author(s):  
蒋小为 Jiang Xiaowei ◽  
龙兴武 Long Xingwu ◽  
谭中奇 Tan Zhongqi
Keyword(s):  
Material Removal ◽  
Optical Glass ◽  
Removal Mechanism ◽  
Material Removal Mechanism ◽  
Ultra Precision

scholarly journals Research on Material Removal Mechanism of C/SiC Composites in Ultrasound Vibration-Assisted Grinding

Materials ◽  
2020 ◽  
Vol 13 (8) ◽  
pp. 1918
Author(s):  
Dongpo Wang ◽  
Shouxiang Lu ◽  
Dong Xu ◽  
Yuanlin Zhang
Keyword(s):  
Ultrasonic Vibration ◽  
Material Removal ◽  
Failure Modes ◽  
High Efficiency ◽  
Abrasive Particle ◽  
Grinding Force ◽  
Removal Mechanism ◽  
Material Removal Mechanism ◽  
Cutting Test ◽  
Sic Composites

C/SiC composites are the preferred materials for hot-end structures and other important components of aerospace vehicles. It is important to reveal the material removal mechanism of ultrasound vibration-assisted grinding for realizing low damage and high efficiency processing of C/SiC composites. In this paper, a single abrasive particle ultrasound vibration cutting test was carried out. The failure modes of SiC matrix and carbon fiber under ordinary cutting and ultrasound cutting conditions were observed and analyzed. With the help of ultrasonic energy, compared with ordinary cutting, under the conditions of ultrasonic vibration-assisted grinding, the grinding force is reduced to varying degrees, and the maximum reduction ratio reaches about 60%, which means that ultrasonic vibration is beneficial to reduce the grinding force. With the observation of cutting debris, it is found that the size of debris is not much affected by the a p with ultrasound vibration. Thus, the ultrasound vibration-assisted grinding method is an effective method to achieve low damage and high efficiency processing of C/SiC composites.

Material Removal Mechanism in Vibration-Assisted Magnetic Abrasive Finishing

2008 ◽  
Vol 53-54 ◽  
pp. 57-63 ◽  
Author(s):  
Shao Hui Yin ◽  
Yu Wang ◽  
Takeo Shinmura ◽  
Yong Jian Zhu ◽  
Feng Jun Chen
Keyword(s):  
Material Removal ◽  
Removal Rate ◽  
Removal Mechanism ◽  
Material Removal Mechanism ◽  
Magnetic Abrasive Finishing ◽  
Finishing Process ◽  
Abrasive Finishing ◽  
Vibration Assistance ◽  
Series Of Experiments ◽  
Working Distance

This paper proposed a viewpoint to explain why vibration assistance may increase material removal rate (MRR) in vibration-assisted magnetic abrasive finishing process. A series of experiments on vibration-assisted finishing have been carried out. On the basis of these experiments, the finishing characteristics are represented summarily. It was shown that the increase in material rate is mainly due to an increase in material removal per unit working distance.

Study on Polishing Technology for Hard-Brittle Materials by a Micro Abrasive Water Jet

2014 ◽  
Vol 1027 ◽  
pp. 52-57 ◽  
Author(s):  
Zeng Wen Liu ◽  
R.Y. Liu
Keyword(s):  
Surface Roughness ◽  
Surface Quality ◽  
Silicate Glass ◽  
Material Removal ◽  
Brittle Materials ◽  
Material Surface ◽  
Abrasive Water Jet ◽  
Removal Mechanism ◽  
Material Removal Mechanism ◽  
Average Roughness

s: Abrasive jet micromachining is considered as a promising precision processing technology for brittle materials such as silicate glass and silicon nitride that are increasingly used in various applications. In this study, some polishing experiments are conducted for hard-brittle materials by a micro slurry jet. The results show that the morphology and the integrity of the material surface are improved greatly after polishing. The average roughness (Ra) value of the silicate glass decrease from 2.32μm to 0.35μm and the average roughness (Ra) value of the Si3N4 decrease from 2.63μm to 0.34μm. The material removal mechanism and the surface formation mechanism are studied. The factors to influence the surface morphology, the surface quality and the surface roughness are analyzed in order to take measures to improve the surface quality and reduce the surface roughness value.

scholarly journals Modeling and Analysis of the Material Removal Rate for Ultrasonic Vibration-assisted Polishing of Optical Glass BK7

2021 ◽  
Author(s):  
Yingdong Liang ◽  
Chao Zhang ◽  
Xin Chen ◽  
Tianqi Zhang ◽  
Tianbiao Yu ◽  
...  
Keyword(s):  
Ultrasonic Vibration ◽  
Material Removal Rate ◽  
Material Removal ◽  
Optical Glass ◽  
Removal Rate ◽  
Machining Accuracy ◽  
Removal Mechanism ◽  
Material Removal Mechanism ◽  
Abrasive Particles ◽  
Material Removal Model

Abstract The emergence of ultrasonic vibration-assisted polishing technology has effectively improved the machining accuracy and efficiency of hard and brittle materials in modern optical industry, however, the material removal mechanism of ultrasonic vibration-assisted polishing (UVAP) still needs to be further revealed. This paper focuses on the material removal mechanism of ultrasonic vibration-assisted polishing of optical glass (BK7), the application of ultrasonic vibration to axial vibration and the atomization of polishing slurry, the material removal model was established. Based on the analysis of the relationship between the nominal distance d of the polishing pad and the actual contact area distribution, the prediction of the material removal profile is realized. In addition, the effects of different parameters on the material removal rate (MRR) were analyzed, including polishing force, spindle speed, abrasive particle size, ultrasonic amplitude, feed rate, and flow-rate of polishing slurry. Based on the motion equation of abrasive particles, the trajectory of abrasive particles in the polishing slurry was simulated, and the simulation results show that the introduction of the ultrasonic vibration field changes the motion state and trajectory of embedded and free abrasive particles. The new model can not only qualitatively analyze the influence of different process parameters on MRR, but also predict the material removal depth and MRR, providing a possibility for deterministic material removal and a theoretical basis for subsequent polishing of complex curved surfaces of optical glass.

A Review of Material Removal Mechanism in Ultra-Precision Polishing of Optical Glass

2021 ◽  
Vol 48 (4) ◽  
pp. 0402014
Author(s):  
蒋小为 Jiang Xiaowei ◽  
龙兴武 Long Xingwu ◽  
谭中奇 Tan Zhongqi
Keyword(s):  
Material Removal ◽  
Optical Glass ◽  
Removal Mechanism ◽  
Material Removal Mechanism ◽  
Ultra Precision

Research on Material Removal Mechanism of Magnetorheological Finishing

2006 ◽  
Vol 532-533 ◽  
pp. 133-136
Author(s):  
Gui Wen Kang ◽  
Fei Hu Zhang
Keyword(s):  
Material Removal ◽  
Optical Materials ◽  
Magnetic Particles ◽  
Optical Glass ◽  
Material Removal Mechanism ◽  
Magnetorheological Finishing ◽  
Carrier Fluid ◽  
Finishing Process ◽  
Main Factors ◽  
Surface Figure

Magnetorheological finishing (MRF) is a novel precision optical machining technology. MRF utilizes magnetic particles, nonmagnetic polishing abrasives in carrier fluid, and a magnetic field to finish optical materials. Owing to its flexible finishing process, MRF eliminates subsurface damage, corrects surface figure errors and the finishing process can be easily controlled by computer. To achieve deterministic finishing, it’s necessary to know the mechanism of material removal. Different magnetorheological fluids are used to finish optical glass on the same machining condition. The material removal and surface quality are examined after finishing with no polishing abrasive, aluminium oxide and cerium oxide. The results show that the hardness of polishing abrasive is not the main factors to affect material removal.

scholarly journals Experimental and Numerical Investigation on the Effect of Scratch Direction on Material Removal and Friction Characteristic in BK7 Scratching

Materials ◽  
2020 ◽  
Vol 13 (8) ◽  
pp. 1842
Author(s):  
Wei Wang ◽  
Zhenping Wan ◽  
Shu Yang ◽  
Junyuan Feng ◽  
Liujie Dong ◽  
...  
Keyword(s):  
Recovery Rate ◽  
Material Removal ◽  
Optical Glass ◽  
Elastic Recovery ◽  
Field Analysis ◽  
Tool Geometry ◽  
Removal Mechanism ◽  
Material Removal Mechanism ◽  
Initiation And Propagation ◽  
The Face

In order to study the influence of scratch direction on the deformation characteristics and material removal mechanism of optical glass BK7, nanoscratching experiments were conducted on a Nano indenter using Vickers indenter. Results indicate that the face-forward scratch is more likely to induce the initiation and propagation of lateral cracks, which is found to be more beneficial to material removal processes; in contrast, small chips and debris are released from the machined grooves without introducing lateral cracks in the edge-forward condition, leading to poor material removal efficiency. In addition, the choice of scratch direction can make differences to the elastic recovery rate of optical glass BK7. The results revealed that both the elastic recovery rate and the residual stresses of the material under the face-forward scratching are greater than those of the edge-forward scratching. A theoretical model for coefficient of friction (COF) under different scratch directions was established. It is found that the COF between indenter and workpiece in the edge-forward scratching is larger than the face-forward scratching under otherwise identical conditions, this finding is consistent with experimental results. A stress field analysis using finite element method (FEM) was conducted to understand the different crack initiation and propagation behaviors from different scratch directions. The current study discusses the significance of scratch direction on material removal behavior of optical glass BK7, and the results would encourage further research on investigating the connections between tool geometry and material removal mechanism.

Modeling and Analyzing on Nonuniformity of Material Removal in Chemical Mechanical Polishing of Silicon Wafer

2004 ◽  
Vol 471-472 ◽  
pp. 26-31 ◽  
Author(s):  
Jian Xiu Su ◽  
Dong Ming Guo ◽  
Ren Ke Kang ◽  
Zhu Ji Jin ◽  
X.J. Li ◽  
...  
Keyword(s):  
Silicon Wafer ◽  
Chemical Mechanical Polishing ◽  
Material Removal ◽  
Mechanical Polishing ◽  
Wafer Surface ◽  
Removal Mechanism ◽  
Particle Movement ◽  
Material Removal Mechanism ◽  
The Relationship ◽  
Nonuniform Material

Chemical mechanical polishing (CMP) has already become a mainstream technology in global planarization of wafer, but the mechanism of nonuniform material removal has not been revealed. In this paper, the calculation of particle movement tracks on wafer surface was conducted by the motion relationship between the wafer and the polishing pad on a large-sized single head CMP machine. Based on the distribution of particle tracks on wafer surface, the model for the within-wafer-nonuniformity (WIWNU) of material removal was put forward. By the calculation and analysis, the relationship between the motion variables of the CMP machine and the WIWNU of material removal on wafer surface had been derived. This model can be used not only for predicting the WIWNU, but also for providing theoretical guide to the design of CMP equipment, selecting the motion variables of CMP and further understanding the material removal mechanism in wafer CMP.

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