Study on Polishing Technology for Hard-Brittle Materials by a Micro Abrasive Water Jet

2014 ◽  
Vol 1027 ◽  
pp. 52-57 ◽  
Author(s):  
Zeng Wen Liu ◽  
R.Y. Liu
Keyword(s):  
Surface Roughness ◽  
Surface Quality ◽  
Silicate Glass ◽  
Material Removal ◽  
Brittle Materials ◽  
Material Surface ◽  
Abrasive Water Jet ◽  
Removal Mechanism ◽  
Material Removal Mechanism ◽  
Average Roughness

s: Abrasive jet micromachining is considered as a promising precision processing technology for brittle materials such as silicate glass and silicon nitride that are increasingly used in various applications. In this study, some polishing experiments are conducted for hard-brittle materials by a micro slurry jet. The results show that the morphology and the integrity of the material surface are improved greatly after polishing. The average roughness (Ra) value of the silicate glass decrease from 2.32μm to 0.35μm and the average roughness (Ra) value of the Si3N4 decrease from 2.63μm to 0.34μm. The material removal mechanism and the surface formation mechanism are studied. The factors to influence the surface morphology, the surface quality and the surface roughness are analyzed in order to take measures to improve the surface quality and reduce the surface roughness value.

Effects of Horizontal Vibration Assistance on Surface Roughness in Magnetic Abrasive Finishing

2009 ◽  
Vol 76-78 ◽  
pp. 246-251
Author(s):  
Shao Hui Yin ◽  
Yu Wang ◽  
Han Huang ◽  
Yong Jian Zhu ◽  
Yu Feng Fan ◽  
...  
Keyword(s):  
Surface Roughness ◽  
Material Removal ◽  
Removal Mechanism ◽  
Material Removal Mechanism ◽  
Horizontal Vibration ◽  
Magnetic Abrasive Finishing ◽  
Abrasive Finishing ◽  
Cutting Effect ◽  
Vibration Assistance ◽  
The Cross

This paper investigates the effect of horizontal vibration assistance on surface roughness in magnetic abrasive finishing, and the material removal mechanism associated. The experiments on vibration-assisted finishing have clearly indicated that the improvement of surface roughness is mainly attributed to the cross-cutting effect of abrasives.

Experimental Research on Surface Integrity of Ceramic Nanocomposites in Two-Dimensional Ultrasonic Vibration Grinding

2007 ◽  
Vol 329 ◽  
pp. 445-450 ◽  
Author(s):  
Bo Zhao ◽  
Yan Wu ◽  
Feng Jiao ◽  
G.F. Gao ◽  
Xun Sheng Zhu
Keyword(s):  
Surface Roughness ◽  
Ultrasonic Vibration ◽  
Material Removal ◽  
Machining Accuracy ◽  
Two Dimensional ◽  
Removal Mechanism ◽  
Material Removal Mechanism ◽  
Pull Out ◽  
Material Removal Model ◽  
Ceramic Nanocomposites

The grain cutting trace of elliptical spiral in workpiece two-dimensional ultrasonic vibration grinding(WTDUVG) is defined, the reason of machining accuracy improvement by applying two-dimensional ultrasonic vibration is discussed. Adopting two-dimensional ultrasonic composite processing, the influences of grinding depth, worktable velocity, wheel granularity on the surface roughness of Al2O3/ZrO2 ceramic nanocomposites were described. Experimental results of AFM microstructure show that the material removal model in WTDUVG is dominated by ductile flow of material, some crystal refinement, the crush powder and grain pull-out are visible and there is almost no fracture. Furthermore, the surface roughness in WTDUVG with coarse grit is about 30 40% less than that in CG under identical grinding condition; the qualitative analysis of X-diffraction results indicated that the surface phases are composed of α-Al2O3, t-ZrO2 and small quality m-ZrO2, there are amorphous phase in the surface both with and without vibration grinding. M-zirconia phase transitions rule in vibration and conventional grinding was found. Under definitive grinding conditions, the material removal mechanism of inelastic deformation is the principal removal mechanism of Al2O3/ZrO2 ceramic nanocomposites, the grit size of diamond wheel and vibration grinding mode have important influence on material removal mechanism of ceramic nanocomposites.

Study on the Removal Mechanism of Magnetorheological Finishing (MRF) by Using of Nano-Diamond Abrasives

2014 ◽  
Vol 1027 ◽  
pp. 226-229
Author(s):  
Zhi Qiang Xu ◽  
Shao Hui Yin ◽  
Sheng Gong ◽  
Yong Qiang Wang
Keyword(s):  
Surface Quality ◽  
Material Removal ◽  
High Efficiency ◽  
Optical Glass ◽  
Magnetorheological Fluid ◽  
Removal Mechanism ◽  
Material Removal Mechanism ◽  
Magnetorheological Finishing ◽  
Advanced Machining ◽  
Series Of Experiments

Magnetorheological finishing (MRF) is an advanced machining technology can achieve high efficiency and smoother surfaces. This study discusses the material removal mechanism of MRF, and proposes a kind of magnetorheological fluid with the nano-diamond abrasives. A series of experiments on the BK7 optical glass were conducted to investigate effects of the concentration of nano-diamond abrasives on surface quality and removal efficiency.

Micromachining of Silicon - Study on the Material Removal Mechanism

2014 ◽  
Vol 1018 ◽  
pp. 167-174 ◽  
Author(s):  
Marina Carrella ◽  
Jan C. Aurich
Keyword(s):  
Process Parameters ◽  
Material Removal ◽  
Brittle Materials ◽  
Cutting Speed ◽  
Tool Geometry ◽  
Removal Mechanism ◽  
Material Removal Mechanism ◽  
Structure Quality ◽  
Hard And Brittle Materials ◽  
High Structure

The growing demand for micro products of hard and brittle materials requires suitable manufacturing processes, which serve high structure quality and accuracy. Therefore, micro pencil grinding tools are used. While grinding hard and brittle materials the structure quality and accuracy depends on the material removal mechanism. This mechanism is a complex interaction between the process parameters, the material response and the tool geometry. In this paper the influence of the process parameters, particularly the cutting speed and the feed rate, on the material removal mechanism are discussed. Furthermore, a method for the analysis of the structure quality and accuracy and within the material removal mechanism is shown.

Study on the Finishing Process for the Aluminum Nitride Substrates

2009 ◽  
Vol 69-70 ◽  
pp. 282-286
Author(s):  
Zhao Zhong Zhou ◽  
Ju Long Yuan ◽  
Bing Hai Lv
Keyword(s):  
Surface Roughness ◽  
Aluminum Nitride ◽  
Material Removal ◽  
Smooth Surface ◽  
Removal Rate ◽  
Removal Mechanism ◽  
Material Removal Mechanism ◽  
Finishing Process ◽  
Ultra Precision

Aluminum nitride (AlN) ceramic has excellent electrical insulation and dielectric properties. The ultra-precision lapping and polishing techniques for the AlN substrate are studied in this paper, and the influence of the lapping parameters such as load and slurry on the surface roughness, material removal rate of AlN is discussed. The surface of workpiece after processing is observed with microscope to analyze the material removal mechanism. An extremely smooth surface with roughness 6nm Ra is obtained after the finishing process. It is also found that the gap between grains will decrease the precision and quality of AlN substrate.

Research on Removal Mechanism and Surface Features of Al2O3 Engineering Ceramics in Ultrasonic Lapping

2014 ◽  
Vol 621 ◽  
pp. 146-152
Author(s):  
Chang Juan Zhang ◽  
Jing Lin Tong ◽  
Bo Zhao ◽  
Feng Jiao
Keyword(s):  
Surface Roughness ◽  
Surface Quality ◽  
Material Removal Rate ◽  
Material Removal ◽  
Removal Rate ◽  
Surface Microstructure ◽  
Machining Efficiency ◽  
Removal Mechanism ◽  
Engineering Ceramics ◽  
The Common

Ultrasonic lapping can effectively improve machining efficiency and obtain higher machining precision, which can be as the final process. This paper discusses the ultrasonic lapping mechanism through simulating the lapping tracks. Based on the contrast experiments between common and ultrasonic lapping, the influence of different lapping parameters on material removal rate and surface roughness were studied and the surface microstructure of workpiece was analyzed. The experimental results show that material removal rate of ultrasonic lapping is nearly two times that of the common lapping, especially in ultrasonic axial lapping, and the better surface quality can be obtained during ultrasonic lapping. Meanwhile, the reasons for material removal rate increasing and surface quality improving were analyzed.

Research on Ultra-Precision Process of STAVAX ESR

2004 ◽  
Vol 471-472 ◽  
pp. 63-66 ◽  
Author(s):  
Ju Long Yuan ◽  
Fei Yan Lou ◽  
Zhi Wei Wang ◽  
M. Chang ◽  
W.P. Du ◽  
...  
Keyword(s):  
Surface Roughness ◽  
Stainless Steel ◽  
Cast Iron ◽  
Material Removal ◽  
Smooth Surface ◽  
Removal Rate ◽  
Linear Velocity ◽  
Removal Mechanism ◽  
Material Removal Mechanism ◽  
Ultra Precision

STAVAX ESR（S-136）is a type of high stainless steel, used in precision mould widely . It has fine anticorrosion, polishing-alike, wearable，good process capacity and quench stability. To obtain the smooth surface of STAVAX ESR, the material removal mechanism in the paper is discussed. The experiment is processed on the ultra-precision plane polishing machine (Nanopoli-100). The experiment processes are as follows. Rough lapping and Ultra-precision lapping: the material of lapping pads is cast iron. #1000Al203 (10wt%) abrasive powders are used in rough lapping. Finally, surface roughness is 62nm. In ultra-precision lapping, abrasive powders are for #4000Al203（10wt%）. Removal rate is 1nm with linear velocity 8.6m/min, pressure 3.65MPa. After 4000 rounds, surface roughness is 35nm.Ultra precision polishing: The super smooth surfaces of STAVAX ESR（S-136）with 5nm roughness have been obtained by adopting SiO2(> 30wt%) slurry and soft tin polisher in the experiment.

Modeling and Analyzing on Nonuniformity of Material Removal in Chemical Mechanical Polishing of Silicon Wafer

2004 ◽  
Vol 471-472 ◽  
pp. 26-31 ◽  
Author(s):  
Jian Xiu Su ◽  
Dong Ming Guo ◽  
Ren Ke Kang ◽  
Zhu Ji Jin ◽  
X.J. Li ◽  
...  
Keyword(s):  
Silicon Wafer ◽  
Chemical Mechanical Polishing ◽  
Material Removal ◽  
Mechanical Polishing ◽  
Wafer Surface ◽  
Removal Mechanism ◽  
Particle Movement ◽  
Material Removal Mechanism ◽  
The Relationship ◽  
Nonuniform Material

Chemical mechanical polishing (CMP) has already become a mainstream technology in global planarization of wafer, but the mechanism of nonuniform material removal has not been revealed. In this paper, the calculation of particle movement tracks on wafer surface was conducted by the motion relationship between the wafer and the polishing pad on a large-sized single head CMP machine. Based on the distribution of particle tracks on wafer surface, the model for the within-wafer-nonuniformity (WIWNU) of material removal was put forward. By the calculation and analysis, the relationship between the motion variables of the CMP machine and the WIWNU of material removal on wafer surface had been derived. This model can be used not only for predicting the WIWNU, but also for providing theoretical guide to the design of CMP equipment, selecting the motion variables of CMP and further understanding the material removal mechanism in wafer CMP.

Fundamental study on material removal mechanism in single-crystal germanium

2021 ◽  
pp. 103773
Author(s):  
Ruiwen Geng ◽  
Xiaojing Yang ◽  
Qiming Xie ◽  
Jianguo Xiao ◽  
Wanqing Zhang ◽  
...  
Keyword(s):  
Single Crystal ◽  
Material Removal ◽  
Removal Mechanism ◽  
Material Removal Mechanism ◽  
Fundamental Study
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