Influence of Surfactant Sparys on Agglomeration of Inhalable Particle

2014 ◽  
Vol 1044-1045 ◽  
pp. 344-347 ◽  
Author(s):  
De Shuai Sun ◽  
Long Fang ◽  
Ya Li Liu
Keyword(s):  
Nonionic Surfactant ◽  
Surfactant Concentration ◽  
Active Agent ◽  
Atmospheric Environment ◽  
Ionic Surfactant ◽  
Particle Removal ◽  
Inhalable Particles ◽  
Removal Efficiencies

Inhalable particles suspended in air were an important pollution of atmospheric Environment. Because of very small in size, they were different to be captured by conventional filter. Chemical active agent, surfactant and flocculate, were introduced into chamber and encouraged the agglomeration of inhalable particles. Nonionic surfactant could reduce more than 30% of particles, while ionic surfactant could lead to the decrement of 23-26%. The particle removal efficiencies were only 15-18% in the presence of polymer flocculate and slightly above that of water. The larger droplet of spray favored the agglomeration of inhalable particles. Increasing the surfactant concentration resulted in the higher removal of inhalable particle.

Mutual Diffusion Measurements in a Ternary System:  Ionic Surfactant−Nonionic Surfactant−Water at 25 °C

Langmuir ◽  
1998 ◽  
Vol 14 (21) ◽  
pp. 5994-5998 ◽  
Author(s):  
M. Castaldi ◽  
L. Costantino ◽  
O. Ortona ◽  
L. Paduano ◽  
V. Vitagliano
Keyword(s):  
Ternary System ◽  
Nonionic Surfactant ◽  
Mutual Diffusion ◽  
Ionic Surfactant

scholarly journals Thermal behaviour of different non-ionic surfactant concentration on the polymeric membrane

2021 ◽  
Vol 1874 (1) ◽  
pp. 012059
Author(s):  
B BadrulHaswan ◽  
A R Hassan ◽  
K Ali ◽  
A A M Redhwan ◽  
A Nasir
Keyword(s):  
Thermal Behaviour ◽  
Surfactant Concentration ◽  
Polymeric Membrane ◽  
Ionic Surfactant

scholarly journals A model of bubble coalescence in the presence of a nonionic surfactant with a low bubble approach velocity

2021 ◽  
Author(s):  
Yuelin Wang ◽  
Huahai Zhang ◽  
Tiefeng Wang
Keyword(s):  
Nonionic Surfactant ◽  
Surfactant Concentration ◽  
Bubble Coalescence ◽  
Bulk Concentration ◽  
High Concentration ◽  
Coalescence Time ◽  
Approach Velocity ◽  
Marangoni Stress ◽  
High Concentrations ◽  
High Concentration Range

A bubble coalescence model for a solution with a nonionic surfactant and with a small bubble approach velocity was developed, in which the mechanism of how coalescence is hindered by Marangoni stress was quantitatively analyzed. The bubble coalescence time calculated for ethanol-water and MIBC-water systems were in good agreement with experimental data. At low surfactant concentrations, the Marangoni stress and bubble coalescence time increased with bulk concentration increase. Conversely, in the high concentration range, the Marangoni stress and coalescence time decreased with bulk concentration. Numerical results showed that the nonlinear relationship between coalescence time and surfactant concentration is determined by the mass transport flux between the film and its interface, which tends to diminish the spatial concentration variation of the interface, i.e., it acts as a “damper”. This damping effect increases with increased surfactant concentration, therefore decreasing the coalescence time at high concentrations.

Study of the Dynamics of Local Particle Removal Efficiencies Using Localized Haze Maps

2007 ◽  
pp. 233-236
Author(s):  
Tom Janssens ◽  
Frank Holsteyns ◽  
Karine Kenis ◽  
Sophia Arnauts ◽  
Twan Bearda ◽  
...  
Keyword(s):  
Particle Removal ◽  
Removal Efficiencies

Roles of Surfactant Molecules in Post-CMP Cleaning

2005 ◽  
Author(s):  
Dedy Ng ◽  
Milind Kulkarni ◽  
Hong Liang
Keyword(s):  
Surfactant Concentration ◽  
Substrate Surface ◽  
Wafer Surface ◽  
Particle Removal ◽  
Abrasive Particles ◽  
Effective Particle ◽  
Cleaning Solution ◽  
Before And After ◽  
First Time ◽  
Hydrophilic Particles

One major concern in post-CMP cleaning is particles contamination on the substrate surface after the CMP process. These particles can be abrasive particles from the slurry, debris from pad material, and particles of film being polished. The cleaning method used in this study is direct contact of the substrate surface and brush sweeping. To enhance the cleaning process, an anionic surfactant is added in the cleaning solution. In order to understand effects of surfactant molecules on post-CMP cleaning, for the first time, we use a tribological approach over a range of surfactant concentration and temperature. In this regard, we observe how the surfactant behavior before and after it reaches the critical micelles concentration (cmc). Experimental results show that increase in surfactant concentration can promote bilayer interaction of micelles on the hydrophilic particles. Based on our study, we propose an interactive explanation of surface molecules with the wafer surface and nanoparticles through friction. This understanding will serve as a guide on how much surfactant should be added in order to achieve effective particle removal.

Enhanced Nanoparticle Removal Using Surfactants

MRS Advances ◽  
2016 ◽  
Vol 1 (31) ◽  
pp. 2213-2224
Author(s):  
Michael L. Free
Keyword(s):  
Critical Micelle Concentration ◽  
Semiconductor Manufacturing ◽  
Chemical Mechanical Planarization ◽  
Ionic Surfactant ◽  
Electrostatic Repulsion ◽  
Particle Removal ◽  
Precision Manufacturing ◽  
Manufacturing Operations ◽  
Drag Forces ◽  
Fluid Drag

ABSTRACTNanoparticles are used in chemical mechanical planarization for semiconductor manufacturing as well as in other precision manufacturing operations. Particles used in processing need to be removed from surfaces in order to enhance yields. Nanoparticles are difficult to remove from surfaces during cleaning due to the high van der Waals attractive forces between particles and surfaces relative to the low fluid drag forces that are used for typical removal methods. Ionic surfactant molecules can adsorb on particles and surfaces to create an electrostatic repulsion between particles and surfaces as well as provide a steric barrier to mitigate adsorption and adhesion. The effectiveness of the surfactant in enhancing particle removal is related to surfactant properties, and it can be correlated with and modeled relative to the critical micelle concentration of the surfactant. The general approach for modeling will be discussed, and the model will be compared with particle removal data.

Adsorption of Chitosan and Interaction with a Non-Ionic Surfactant on Silica

2011 ◽  
Vol 233-235 ◽  
pp. 1398-1401
Author(s):  
Bing Tao Liu ◽  
Remco Fokkink ◽  
Arie de Keizer
Keyword(s):  
Nonionic Surfactant ◽  
Ionic Surfactant ◽  
Alkyl Ether ◽  
Surface Functionality ◽  
Adsorbed Amount ◽  
Adsorbed Mass ◽  
Optical Reflectometry ◽  
Poly Ethylene Oxide ◽  
Poly Ethylene ◽  
Protein Bovine Serum Albumin

Optical reflectometry is applied as a tool for studying single and simultaneous adsorption of a carbohydrate, a nonionic surfactant, and a protein, For the nonionic surfactant poly(ethylene oxide) alkyl ether on a silica surface the adsorption process is fast and reversible, and the maximum adsorbed amount was 2.45 mg•m-2. Also, the effect of pH on the adsorption of chitosan on silica, and its interaction with C12EO5have been studied. The maximum adsorbed amount was obtained for pH ≥6.8 (0.80 mg•m-2). Changes in surface functionality upon adsorbing C12EO5on a chitosan layer and the protein, bovine serum albumin, are reported. The results are discussed in terms of adsorption kinetics, adsorbed mass plateau values, and reversibility of layer formation.

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