Rigid Joints Transferring Forces outside Box Columns with Deviation of Column's Location Axis-Finite Element Method Simulation

2014 ◽  
Vol 1065-1069 ◽  
pp. 1101-1105
Author(s):  
Zhong Gen Xu ◽  
Guang Xian Liang ◽  
Wei Ming Chen ◽  
Chang Gen Deng

location axis, joints, force-transforming plates, carrying capacityAbstract: Steel structure has been widely used all over the world. In actual construction process, steel structure inevitably has initial defects, which may have bad influences on its performance. Three groups of specimens were designed in this paper to compare the performance of rigid joints transferring forces outside box columns to that of perfect traditional joints and that of traditional joints with uniaxial and biaxial deviation of column's location axis by finite element method program ANSYS. From the analysis of stiffness, yielding capacity, and ultimate carrying capacity, the impact of force-transforming plates can be evaluated. The adding force-transforming plates were helpful to reduce the influence from column imperfect.

2014 ◽  
Vol 578-579 ◽  
pp. 131-136
Author(s):  
Guang Xian Liang ◽  
Zhong Gen Xu ◽  
Wei Ming Chen ◽  
Chang Gen Deng

In the process of steel structure construction, it was inevitable that the members of structure had initial imperfections which might decrease capacity of the structure. In order to consider the influence of lateral deviation of beams on rigid joints transferring forces outside box columns, in this paper 4 specimens were designed to compare the performance of joints with force-transforming plates to traditional joints by finite element method program ANSYS. The results indicated that adding force-transforming plates could transmit stresses to beams which were far from the panel zone, to avoid joints’ stress concentration. Moreover, in the same case, when the beams were imperfect, the yielding capacity and ultimate carrying capacity of the joints with force-transforming plates were significant higher than those of traditional joints. Moreover, the adding force-transforming plates were helpful to reduce the influence from the beams imperfect. This kind of joints can be used to the practical engineering.


2014 ◽  
Vol 945-949 ◽  
pp. 1201-1206
Author(s):  
Guang Xian Liang ◽  
Zhong Gen Xu ◽  
Wei Ming Chen ◽  
Chang Gen Deng

Three groups of specimens were designed in this paper to compare the performance of rigid joints transferring forces outside box columns to that of traditional joints by finite element method program ANSYS. The influences of deviation of verticality in columns on stiffness, yielding capacity, and ultimate carrying capacity were analyzed. The evaluation of working performance by adding force-transforming plates could be found. The thickness and width of adding plates would be the key parameters of steel frame joints. This paper put forward the optimal range of design parameters.


Author(s):  
Ah-Young Park ◽  
Satish Chaparala ◽  
Seungbae Park

Through-silicon via (TSV) technology is expected to overcome the limitations of I/O density and helps in enhancing system performance of conventional flip chip packages. One of the challenges for producing reliable TSV packages is the stacking and joining of thin wafers or dies. In the case of the conventional solder interconnections, many reliability issues arise at the interface between solder and copper bump. As an alternative solution, Cu-Cu direct thermo-compression bonding (CuDB) is a possible option to enable three-dimension (3D) package integration. CuDB has several advantages over the solder based micro bump joining, such as reduction in soldering process steps, enabling higher interconnect density, enhanced thermal conductivity and decreased concerns about intermetallic compounds (IMC) formation. Critical issue of CuDB is bonding interface condition. After the bonding process, Cu-Cu direct bonding interface is obtained. However, several researchers have reported small voids at the bonded interface. These defects can act as an initial crack which may lead to eventual fracture of the interface. The fracture could happen due to the thermal expansion coefficient (CTE) mismatch between the substrate and the chip during the postbonding process, board level reflow or thermal cycling with large temperature changes. In this study, a quantitative assessment of the energy release rate has been made at the CuDB interface during temperature change finite element method (FEM). A parametric study is conducted to analyze the impact of the initial crack location and the material properties of surrounding materials. Finally, design recommendations are provided to minimize the probability of interfacial delamination in CuDB.


Author(s):  
Márton Tamás Birosz ◽  
Mátyás Andó ◽  
Sudhanraj Jeganmohan

AbstractDesigning components is a complex task, which depends on the component function, the raw material, and the production technology. In the case of rotating parts with higher RPM, the creep and orientation are essential material properties. The PLA components made with the material extrusion process are more resistant than VeroWhite (material jetting) and behave similarly to weakly cross-linked elastomers. Also, based on the tensile tests, Young’s modulus shows minimal anisotropy. Multilinear isotropic hardening and modified time hardening models are used to create the finite element model. Based on the measurements, the finite element method simulation was identified. The deformation in the compressor wheel during rotation became definable. It was concluded that the strain of the compressor wheel manufactured with material extrusion technology is not significant.


2014 ◽  
Vol 17 (1) ◽  
pp. 21-28
Author(s):  
Dien Khanh Le ◽  
Nam Thanh Nguyen ◽  
Binh Thien Nguyen

Single Point Incremental Forming (SPIF) has become popular for metal sheet forming technology in industry in many advanced countries. In the recent decade, there were lots of related studies that have concentrated on this new technology by Finite Element Method as well as by empirical practice. There have had very rare studies by pure analytical theory and almost all these researches were based on the formula of ISEKI. However, we consider that this formula does not reflect yet the mechanics of destruction of the sheet work piece as well as the behavior of the sheet in reality. The main aim of this paper is to examine ISEKI’s formula and to suggest a new analytical computation of three elements of stresses at any random point on the sheet work piece. The suggested formula is carefully verified by the results of Finite Element Method simulation.


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