Finite Element Analysis and Experimental Verification on Mechanical Properties of Steel Mash Reinforced HDPE Composite Materials

2011 ◽  
Vol 311-313 ◽  
pp. 155-159 ◽  
Author(s):  
Xin Qian ◽  
Yang Fu Jin ◽  
Mi Zhou ◽  
Jia Na Sun
Keyword(s):  
Finite Element Analysis ◽  
Finite Element ◽  
Composite Material ◽  
Steel Wire ◽  
Flexural Modulus ◽  
Tensile Modulus ◽  
Wire Diameter ◽  
Element Analysis ◽  
Steel Wires ◽  
Specimen Width

Thorough constructing steel-plastic composite material model and using ANSYS finite element analysis software, this research make a CAE analysis and experimental verification to the elastic modulus and flexural modulus of reinforced HDPE composites under different steel structures. The research found that the tensile modulus of steel mash reinforced HDPE linearly increases with the increase of steel wire diameter and the number of steel wires on the specimen width. When the steel wire diameter is 3mm, the tensile modulus is up to 10 times of the pure HDPE’s. The number of steel wires on the specimen length does not affect the tensile modulus. Similarly, the flexural modulus of the composite material also linearly increases with the increase of steel wire diameter and the number of steel wires on the specimen width. However, when the steel wire diameter is 3mm, the flexural modulus is only 2 times of the pure HDPE’s. The data simulated by ANSYS software has a very good agreement with the experiment results. Therefore it can be applied to the actual design.

scholarly journals Finite element analysis of mild steel - rubber sandwich composite material

2018 ◽  
Vol 376 ◽  
pp. 012040 ◽  
Author(s):  
Y P Ravitej ◽  
V Swaroop ◽  
S Ramesh ◽  
H Adarsha ◽  
Veerachari ◽  
...  
Keyword(s):  
Finite Element Analysis ◽  
Finite Element ◽  
Composite Material ◽  
Mild Steel ◽  
Sandwich Composite ◽  
Element Analysis

Finite Element Analysis of Shear Behavior of Reinforced Concrete Beam Strengthened by High-Strength Steel Wire Mesh

2013 ◽  
Vol 482 ◽  
pp. 15-19
Author(s):  
Chen Xing Yang ◽  
Zheng Liu ◽  
Li Ping Sun ◽  
Jiong Li
Keyword(s):  
Finite Element Analysis ◽  
Finite Element ◽  
Shear Strength ◽  
High Strength Steel ◽  
Steel Wire ◽  
High Strength ◽  
Wire Mesh ◽  
Element Analysis ◽  
Strength And Stiffness ◽  
Steel Wire Mesh

Based on the experimental study of shear strengthened of reinforced concrete rectangular beam strengthened by high-strength steel wire mesh and polymer mortar , the finite element extended analysis was used. The finite element analysis software showed that with the increasing of the strand dosage and reinforcement strand length,the shear strength and stiffness of strengthened members improved . However,with the increasing of shear span ratio , the shear strength and stiffness reduced obviously .

COMPUTATIONAL INVESTIGATION OF ENERGY DISSIPATION THROUGH PROGRESSIVE FAILURE IN TAILORED COMPOSITE STRUCTURES VIA EXPLICIT FINITE ELEMENT ANALYSIS

2021 ◽  
Author(s):  
ANIRUDH SRINIVAS ◽  
D. STEFAN DANCILA
Keyword(s):  
Finite Element Analysis ◽  
Finite Element ◽  
Composite Material ◽  
Energy Dissipation ◽  
Progressive Failure ◽  
Tensile Loading ◽  
Stress Wave Propagation ◽  
Element Analysis ◽  
Explicit Finite Element ◽  
Explicit Finite Element Analysis

A composite material tailoring concept for progressive failure under tensile loading has been previously developed, modeled, and experimentally validated by the second author and his collaborators. The concept relies upon a sequential failure process induced in a structure of series connection of parallel redundant load path elements of tailored length and strength. The resulting yield-type response under tensile loading is characterized by an increased energy dissipation compared to a reference conventional structural element of nominally identical length and crosssectional area, and of the same composite material. In this work, this composite tailoring concept is computationally investigated for IM7-8552 composite material using a dynamic, explicit finite element analysis in Abaqus. The approach offers the advantage of capturing the stress wave propagation within the model throughout the dynamic failure sequence, thereby providing a better understanding of the failure progression and the energy dissipation mechanisms at work. In this study, progressive failure of the tailored composite structure is modeled and analyzed for different configurations of lengths and widths. Model predictions are illustrated for and compared with selected tailoring configurations from the literature. Developing an explicit finite element approach for analyzing the tailoring concept opens the door to characterizing a wide variety of related, more complex configurations for which analytical solutions do not yet exist or may not even be feasible, and/or for which experimental results may be difficult or overly expensive to obtain.

Control of the micromovements of a composite-material nail design: A finite element analysis

2016 ◽  
Vol 54 ◽  
pp. 223-228 ◽  
Author(s):  
Mor Ben-Or ◽  
Ronen Shavit ◽  
Tomer Ben-Tov ◽  
Moshe Salai ◽  
Ely L. Steinberg
Keyword(s):  
Finite Element Analysis ◽  
Finite Element ◽  
Composite Material ◽  
Element Analysis

Investigation of the Lead-On-Chip Package’s Reliability

1998 ◽  
Vol 120 (2) ◽  
pp. 171-174 ◽  
Author(s):  
P.-H. Tsao ◽  
L. C. Chang ◽  
T. C. Chen ◽  
C. Haung ◽  
C. Z. Chen
Keyword(s):  
Finite Element Analysis ◽  
Finite Element ◽  
Flexural Modulus ◽  
Test Chip ◽  
Element Analysis ◽  
Thermally Induced ◽  
Molding Compounds ◽  
Different Types ◽  
Induced Stresses ◽  
On Chip

An assembly test chip (ATC), consisting of varieties of test structures, had been utilized to monitor the package integrity of SOJ lead-on-chip (LOC) packages after various reliability tests. Two different types of epoxy molding compounds, namely biphenyl and EOCN epoxies, were chosen to investigate their effects on package’s reliability. After the reliability tests, silicon chip crack was observed in three test samples due to the existence of a large chip backside chipping (˜120 μm). Qualitative study about this failure mechanism was carried out by a finite element analysis and it was found that, due to the higher flexural modulus and CTE of the biphenyl epoxy, the thermally induced stresses developed in the chip encapsulated by this epoxy during reliability tests were more likely to cause the crack propagation in the silicon chip than those induced by using EOCN type epoxy.

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