Mould Parts Design Based on Knowledge Fusion of NX

2011 ◽  
Vol 402 ◽  
pp. 775-779 ◽  
Author(s):  
Ling Yun Wang ◽  
Hong Hui Huang
Keyword(s):  
Parametric Design ◽  
New Technology ◽  
Geometric Distortion ◽  
Geometric Information ◽  
Knowledge Fusion ◽  
Knowledge Based ◽  
Knowledge Based Engineering

In traditional CAD technology, it is mainly to express the geometric information of parts, but can not express non-geometric information, such as weight, strength, and can not do the design of geometric distortion for changed topology. The combination of knowledge-based engineering (KBE) and CAD solved these problem in the filed of molding. NX/KF is a new technology to integrate CAD and KBE. This paper develops the mould parts with NX/KF as an example to explain its application. It analyzes the substance of parametric design and point out the developing direction of CAD by analyzing new characteristics of knowledge fusion.

Application of Knowledge Based Engineering in Building Mould Standard Components

2011 ◽  
Vol 128-129 ◽  
pp. 1121-1125
Author(s):  
Hong Hui Huang ◽  
Ling Yun Wang
Keyword(s):  
Parametric Design ◽  
New Technology ◽  
Product Knowledge ◽  
Knowledge Fusion ◽  
Knowledge Based ◽  
Knowledge Based Engineering ◽  
Design Experience ◽  
Standard Components

It analyzed the substance of parametric design. Nowadays, the CAD technology can not express the product knowledge and design experience. The combination of knowledge-based engineering (KBE) and CAD solved these problem in the filed of molding. UG/KF is a new technology to integrate CAD and KBE. This paper develops the mould parts with UG/KF as an example to explain its application, and point out the developing direction of CAD by analyzing new characteristics of knowledge fusion.

Application of Knowledge Based Engineering in Aeronautics Mold Parts Parametric Design

2013 ◽  
Vol 765-767 ◽  
pp. 47-50
Author(s):  
Yan Ling Zhao ◽  
Chun Yu Che ◽  
Hong Bo Wang ◽  
Zi Yan Yun ◽  
Guan Hong Xu
Keyword(s):  
Knowledge Representation ◽  
Production Efficiency ◽  
Parametric Design ◽  
Knowledge Engineering ◽  
Secondary Development ◽  
Engineering Technology ◽  
Knowledge Based ◽  
Knowledge Reasoning ◽  
Development Tools ◽  
Knowledge Based Engineering

In the process of designing aeronautic composite mold parts, previous designing knowledge and expertise cant be well used, the cycle of parts modeling is long and its production efficiency is low. According to the classification and characteristics of aeronautic mold parts and the knowledge engineering technology, based on the fusion module in UG6.0, we establish its repository by the knowledge acquisition, knowledge representation and knowledge reasoning of aeronautic mold parts. With the UG secondary development tools, UG/Open Menuscript and UG/Open Uistyler, we develop user menu and parametric design interface of aeronautic mold parts, make good use of its designing knowledge, and fulfill the knowledge-driven parts parametric design. They satisfy the rapid design requires of aeronautic mold parts and shorten its designing cycle.

Rod Design: A Concept to Production Connecting Rod Design System

1994 ◽  
Author(s):  
Eric L. Chau
Keyword(s):  
Lead Time ◽  
Parametric Design ◽  
State Of The Art ◽  
Design System ◽  
Connecting Rod ◽  
Design Environment ◽  
Lead Time Reduction ◽  
Knowledge Based ◽  
Knowledge Based Engineering ◽  
Engineering Constraint

Abstract A Concept to Production Parametric Design Environment for connecting rod design is described. The system utilizes state of the art knowledge based engineering, constraint based reasoning, computer aided engineering (CAE), design (CAD), and manufacturing (CAM) technology to achieve 80% lead time reduction on prototype parts with similar lead time reductions possible on production parts.

Cyberphysical Design Automation Framework for Knowledge-based Engineering

2013 ◽  
Vol 1 (1) ◽  
pp. 158-178
Author(s):  
Urcun John Tanik
Keyword(s):  
System Design ◽  
Design Process ◽  
Design Automation ◽  
Design Theory ◽  
Knowledge Bases ◽  
Knowledge Based ◽  
Knowledge Based Engineering ◽  
Cyberphysical System ◽  
Automation Framework

Cyberphysical system design automation utilizing knowledge based engineering techniques with globally networked knowledge bases can tremendously improve the design process for emerging systems. Our goal is to develop a comprehensive architectural framework to improve the design process for cyberphysical systems (CPS) and implement a case study with Axiomatic Design Solutions Inc. to develop next generation toolsets utilizing knowledge-based engineering (KBE) systems adapted to multiple domains in the field of CPS design automation. The Cyberphysical System Design Automation Framework (CPSDAF) will be based on advances in CPS design theory based on current research and knowledge collected from global sources automatically via Semantic Web Services. A case study utilizing STEM students is discussed.

Industrial Application of Knowledge-Based Engineering in Commercial CAD / CAE Systems

2021 ◽  
pp. 100255
Author(s):  
Jerzy Pokojski ◽  
Karol Szustakiewicz ◽  
Łukasz Woźnicki ◽  
Konrad Oleksiński ◽  
Jarosław Pruszyński
Keyword(s):  
Industrial Application ◽  
Knowledge Based ◽  
Knowledge Based Engineering

Application of Knowledge-Based Engineering Methods for Hull Structural Member Design

2009 ◽  
Author(s):  
Jinfeng Chen ◽  
◽  
Hezhen Yang ◽  
Ruhong Jiang ◽  
Deyu Wang ◽  
...  
Keyword(s):  
Structural Member ◽  
Knowledge Based ◽  
Knowledge Based Engineering

Parametric Design and Reliability Analysis of WIT Wafer Level Packaging

2000 ◽  
Author(s):  
Y. T. Lin ◽  
P. J. Tang ◽  
K. N. Chiang
Keyword(s):  
Reliability Analysis ◽  
Flip Chip ◽  
Parametric Design ◽  
Material Selection ◽  
New Technology ◽  
Rapid Expansion ◽  
Wafer Level ◽  
Good Reliability ◽  
Wafer Level Packaging ◽  
Wafer Level Package

Abstract The demands of electronic packages toward lower profile, lighter weight, and higher density of I/O lead to rapid expansion in the field of flip chip, chip scale package (CSP) and wafer level packaging (WLP) technologies. The urgent needs of high I/O density and good reliability characteristic lead to the evolution of the ultra high-density type of non-solder interconnection such as the wire interconnect technology (WIT). The new technology using copper posts to replace the solder bumps as interconnections shown a great improvement in the reliability life. Moreover, this type of wafer level package could achieve higher I/O density, as well as ultra fine pitch. This research will focus on the reliability analysis of the WIT package structures in material selection and structural design, etc. This research will use finite element method to analyze the physical behavior of packaging structures under thermal cycling condition to compare the reliability characteristics of conventional wafer level package and WIT packages. Parametric studies of specific parameters will be performed, and the plastic and temperature dependent material properties will be applied to all of the models.

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