Effect of High Glass Transition Temperature on Reliability of Non-Conductive Film (NCF)

2006 ◽  
Vol 326-328 ◽  
pp. 517-520 ◽  
Author(s):  
Jin Hyoung Park ◽  
Chang Kyu Chung ◽  
Kyoung Wook Paik ◽  
Soon Bok Lee
Keyword(s):  
Glass Transition ◽  
Shear Strain ◽  
Flip Chip ◽  
Coefficient Of Thermal Expansion ◽  
Moiré Interferometry ◽  
Moire Interferometry ◽  
Effective Parameters ◽  
Conductive Film ◽  
Interferometry Method ◽  
Stress Free State

Among many factors that influence the reliability of a flip-chip assembly using NCF interconnections, the most effective parameters are often the coefficient of thermal expansion (CTE), the modulus (E), and the glass transition temperatures (Tg). Of these factors, the effect of Tg on thermal deformation and device reliability is significant; however, it has not been shown clearly what effect Tg has on the reliability of NCF. The Tg of a conventional NCF material is approximately 110°C. In this study, a new high Tg NCF material that has a 140oC Tg is proposed. The thermal behaviors of the conventional and new NCFs between -40oC to 150oC are observed using an optical method. Twyman-Green interferometry and the moiré interferometry method are used to measure the thermal micro-deformations. The Twyman-Green interferometry measurement technique is applied to verify the stress-free state. The stress-free temperatures of the conventional and new Tg NCF materials are approximately 100oC and 120oC respectively. A shear strain at a part of the NCF chip edge is measured by moiré interferometry. Additionally, a method to accurately measure the residual warpage and shear strain at room temperature is proposed. Through the analysis of the relationship between the warpage and the shear strain, the effect of the high-Tg NCF material on the reliability is studied.

In‐Situ Mapping and Modeling Verification of Thermomechanical Deformation in Underfilled Flip‐Chip Packaging Using Moiré Interferometry

1996 ◽  
Vol 445 ◽  
Author(s):  
Xiang Dai ◽  
Connie Kim ◽  
Ralf Willecke ◽  
Paul S. Ho
Keyword(s):  
Flip Chip ◽  
Thermal Loading ◽  
Deformation Monitoring ◽  
Moiré Interferometry ◽  
Moire Interferometry ◽  
Fringe Analysis ◽  
Element Analysis ◽  
Solder Bumps ◽  
Thermomechanical Deformation

AbstractAn experimental technique of environmental moiré interferometry has been developed for in‐situ monitoring and analysis of thermomechanical deformation of microelectronics packages subjected to thermal loading under a controlled atmosphere. Coupled with fractional fringe analysis and digital image processing, the environmental moiré interferometry technique achieves accurate and realistic deformation monitoring with high sensitivity and excellent spatial resolution. It has been applied to investigate the thermomechanical deformations induced by thermal loading in an underfilled flip‐chip‐on‐board packaging. The effects of temperature change in the range of 102 °C to 22 °C are analyzed for underfill and solder bumps. In addition, shear deformation and shear strains across the solder bumps are determined as a function of temperature. The experimental results are compared with the results of a finite element analysis for modeling verification. Good agreement between the modeling results and experimental measurements has been found in the overall displacement fields. Through this study, the role of underfill in the thermomechanical deformation of the underfilled flip‐chip package is determined.

scholarly journals Thermal Deformation Analysis of Flip-Chip Devices by Moire Interferometry.

2002 ◽  
Vol 5 (7) ◽  
pp. 654-659
Author(s):  
Yasuyuki MORITA ◽  
Kazuo ARAKAWA ◽  
Mitsugu TODO ◽  
Masayuki KANETO
Keyword(s):  
Thermal Deformation ◽  
Flip Chip ◽  
Moiré Interferometry ◽  
Deformation Analysis ◽  
Moire Interferometry

The Creep Measurement of 475°C Pipeline Using Moire Interferometry

1998 ◽  
Vol 120 (2) ◽  
pp. 144-148 ◽  
Author(s):  
X. Huimin ◽  
Z. Daqing ◽  
D. Fulong ◽  
Z. Wei ◽  
P. Dietz ◽  
...  
Keyword(s):  
High Temperature ◽  
Power Plant ◽  
Experimental Method ◽  
Moiré Interferometry ◽  
Experimental Results ◽  
Measuring Error ◽  
Moire Interferometry ◽  
Interferometry Method ◽  
Main Steam ◽  
Creep Measurement

In this study, a new experimental method for measuring the creep of pipeline using moire interferometry was proposed. Curved-surface-deformed grating replicating technique was combined with the high-temperature-resistant grating and moire interferometry method, and was applied to measure the creep of a 475°C main steam pipeline in the Qinghe Power Plant for 3600 h. The measuring principle and experimental techniques are described. The measuring error and experimental results are discussed in detail.

Thermal Strain Measurements of Solder Joints in Second Level Interconnections Using Moire Interferometry

1992 ◽  
Vol 114 (1) ◽  
pp. 88-92 ◽  
Author(s):  
Yifan Guo ◽  
Charles G. Woychik
Keyword(s):  
Thermal Expansion ◽  
Solder Joints ◽  
Coefficient Of Thermal Expansion ◽  
Low Cycle Fatigue ◽  
Thermal Strain ◽  
Moiré Interferometry ◽  
Moire Interferometry ◽  
Mechanical Reliability ◽  
Surface Mount ◽  
Inherent Strength

Low cycle fatigue of solder joints is one of the major kinds of failures in second level interconnections of an electronic package. The fatigue failure is caused by thermal strains which are created from a mismatch of coefficients of thermal expansion (CTE) that occurs between two levels of packaging. As the package approaches smaller dimensions, measurements of thermal strains in the solder interconnections become very difficult. In this paper, moire interferometry technique was applied to evaluate the thermal strains in the second level interconnections for both conventional pin-in-hole (PIH) packages and surface mount components. The coefficient of thermal expansion of each component was measured. Thermal strain distributions in the solder interconnections were determined, and reliability issues were discussed. The strains in solder joints of the PIH components were much higher than those of the stacked surface mount components. Even though the surface mount components had a lower inherent strength, their overall mechanical reliability was much higher since they had practically no localized strain concentrations.

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