Damage Mechanics of Solder Joints under High Current Density

2007 ◽  
Vol 345-346 ◽  
pp. 1403-1410
Author(s):  
Cemal Basaran
Keyword(s):  
Damage Mechanics ◽  
Solder Joints ◽  
High Current Density ◽  
Time History ◽  
Moiré Interferometry ◽  
Lead Free ◽  
Moire Interferometry ◽  
Lead Free Solder ◽  
Current Stressing ◽  
Free Solder

In this paper, Moiré interferometry technique is used to measure the in-situ displacement evolution of lead-free solder joints under high density (104A/cm2). An electromigration constitutive model is developed to simulate deformation of lead-free solder joint under current stressing. The simulation predicts Moiré interferometry measurements in both spatial distribution and time history evolution, which indicates that the model is reasonably good for predicting the mechanical behavior of lead-free solder joints under electric current stressing.

Effects of Current Stressing and Isothermal Aging on the Tensile Strength of Microscale Lead-Free Solder Joints with Different Joint Volumes

2013 ◽  
Vol 634-638 ◽  
pp. 2800-2803 ◽  
Author(s):  
Li Meng Yin ◽  
Yan Fei Geng ◽  
Zhang Liang Xu ◽  
Song Wei
Keyword(s):  
Tensile Strength ◽  
Current Density ◽  
Isothermal Aging ◽  
Solder Joints ◽  
High Current Density ◽  
Copper Wire ◽  
Lead Free ◽  
Lead Free Solder ◽  
Current Stressing ◽  
Free Solder

Adopting an accurate micro-tensile method based on dynamic mechanical analyzer (DMA) instrument, the tensile strength of three kinds of copper-wire/solder/copper-wire sandwich structured microscale lead-free solder joints that underwent current stressing with a direct current density of 1.0×104 A/cm2 and loading time of 48 hours were investigated, and compared with those solder joints isothermal aged at 100 0C for 48 hours and as-reflowed condition. These three kinds of microscale columnar solder joints have different volumes, i.e., a same diameter of 300 μm but different heights of 100 μm, 200 μm and 300 μm. Experimental results show that both current stressing and isothermal aging degrades the tensile strength of microscale solder joints, and the solder joint with smaller volume obtains higher tensile strength under same test condition. In addition, current stressing induces obvious electromigration (EM) issue under high current density of 1.0×104 A/cm2, resulting in the decreasing of tensile strength and different fracture position, mode and surface morphology of microscale solder joints. The degree of strength degradation increases with the increasing of joint height when keep joint diameter constant, this is mainly due to that electromigration leads to voids form and grow at the interface of cathode, and solder joints with larger volume may contains more soldering defects as well.

Effects of high current density on lead-free solder joints of chip-size passive SMD components

2018 ◽  
Vol 30 (2) ◽  
pp. 74-80 ◽  
Author(s):  
Attila Geczy ◽  
Daniel Straubinger ◽  
Andras Kovacs ◽  
Oliver Krammer ◽  
Pavel Mach ◽  
...  
Keyword(s):  
Current Density ◽  
Solder Joints ◽  
High Current Density ◽  
Lead Free ◽  
Lead Free Solder ◽  
High Current ◽  
Chip Size ◽  
Free Solder

Void Formation and Their Effect on Reliability of Lead-Free Solder Joints on MID and PCB Substrates

2017 ◽  
Vol 66 (4) ◽  
pp. 1229-1237 ◽  
Author(s):  
P. Wild ◽  
T. Grozinger ◽  
D. Lorenz ◽  
A. Zimmermann
Keyword(s):  
Solder Joints ◽  
Void Formation ◽  
Lead Free ◽  
Lead Free Solder ◽  
Free Solder
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