scholarly journals Solutions and Discussions of thin film Undergoing the Nonlinear Peeling

2003 ◽  
Vol 795 ◽  
Author(s):  
Yueguang Wei ◽  
Siqi Shu ◽  
Ying Du LNM
Keyword(s):  
Thin Film ◽  
Fracture Toughness ◽  
Effective Strain ◽  
Slope Angle ◽  
Interfacial Crack ◽  
Crack Tip ◽  
Interfacial Fracture ◽  
Interfacial Fracture Toughness ◽  
Element Analysis ◽  
Von Mises

ABSTRACTBased on the bending model, three double-parameter criteria characterizing thin film peeling process are introduced and analyzed in detail. Three double-parameter criteria include: (1) the interfacial fracture toughness and the separation strength, (2) the interfacial fracture toughness and the interfacial crack tip slope angle of thin film, and (3) the interfacial fracture toughness and the critical von Mises effective strain of thin film at crack tip. Based on the three double-parameter criteria, the thin film nonlinear peeling problems are solved analytically for each case. The results show that the solutions of thin film nonlinear peeling based on the bending model are very sensitive to the model parameter selections. Through analyses and comparisons for different solutions, a connection between solutions based on the bending models and based on the two-dimensional elastic-plastic finite element analysis is obtained.

Modified Decohesion Test (MDT) for Interfacial Fracture Toughness Measurement in Microelectronic/MEMS Applications

2002 ◽  
Author(s):  
Mitul B. Modi ◽  
Suresh K. Sitaraman
Keyword(s):  
Thin Film ◽  
Thin Films ◽  
Fracture Toughness ◽  
Energy Release ◽  
Physical Vapor Deposition ◽  
Interfacial Fracture ◽  
Interfacial Fracture Toughness ◽  
Testing Methods ◽  
Structural Variations ◽  
Metal Thin Film

Delamination of intrinsically or residually stressed thin films is commonly encountered in microelectronics and MEMS systems. Thin films typically accrue stresses through micro structural variations caused by physical vapor deposition, thermally induced stresses imposed due to thermal mismatch, and/or extrinsically introduced forces. These stresses can reach upwards of 1 GPa and can easily exceed the strength of the metal thin film interface. Knowledge of the interfacial fracture toughness (Γ) is necessary to predict if delamination will occur. However, measuring Γ is a challenge for thin film interfaces. Typical testing methods such as bimaterial cantilever, microscratch, peel, bulge, or edge lift-off are limited to organic films, cause complex stress fields, can only measure a single mode mix, or cannot achieve the large energy release rates typical of metal thin film interfaces. A new approach based on the decohesion test, called the modified decohesion test (MDT), eliminates these shortcomings of current testing methods. In this approach, a highly stressed super layer is used to drive delamination and “tune-in” the mode mix at the crack tip. Since the deformations remain elastic, a mechanics-based solution can be used to correlate test parameters to the energy release rate. Common IC fabrication techniques are used to prepare the sample and execute the test, thereby making the test compatible with current microelectronic or MEMS facilities. Varying the crack surface area rather than the energy in the super layer allows the ability to bound Γ using a single test wafer providing a 90% savings in resources and 95% savings in time. Other modifications allow application of the method to highly chemically reactive metals and decrease the sample preparation time. Design, preparation, and execution of the MDT are presented. Results of finite element models are used to validate the approach. Results are shown for a Ti/Al2O3 interface.

Superlayer Test for Interfacial Fracture Toughness Measurements

2004 ◽  
Author(s):  
Jiantao Zheng ◽  
Suresh K. Sitaraman
Keyword(s):  
Thin Film ◽  
Fracture Toughness ◽  
Interfacial Fracture ◽  
Critical Energy ◽  
Interfacial Fracture Toughness ◽  
Mode Mixity ◽  
Critical Energy Release Rate ◽  
Component Reliability ◽  
Interfacial Delamination ◽  
Interface Delamination

Knowledge of the mode-mixity (?) dependent interfacial fracture toughness (Γ) is needed to predict the interface delamination and the component reliability of thin-film structures. Mode-mixity, ?, is a measure of the relative shearing to tensile opening of the interface crack near the tip. Typically, Γ increases as ? increases, such that the delamination is less likely when the loading on the interface is shear-dominated. The measurement of mode-mixity dependent Γ has been a challenge for thin film interfaces. The single-strip superlayer test, developed by the authors, eliminates the shortcomings of current testing methods. This test employs a stress-engineered superlayer to drive the interfacial delamination between the thin-film and the substrate. An innovative aspect of the proposed test is to introduce a release layer of varying width between the interested interfaces to control the amount of energy available for delamination propagation. By designing a decreasing area of the release layer, it is possible to arrest the interfacial delamination at a given location, and the interfacial fracture toughness or critical energy release rate can be found at the location where the delamination ceases to propagate. Design, preparation, and execution of the test are presented. Results are shown for Ti/Si interfaces of different mode mixities.

Elasto-Plastic Analysis of the Peel Test for Thin Film Adhesion

1988 ◽  
Vol 110 (3) ◽  
pp. 266-273 ◽  
Author(s):  
Kyung-Suk Kim ◽  
Junglhl Kim
Keyword(s):  
Fracture Toughness ◽  
Interfacial Crack ◽  
Peel Test ◽  
Interfacial Fracture ◽  
Peel Strength ◽  
Interfacial Fracture Toughness ◽  
Cu Films ◽  
Film Adhesion ◽  
Thin Film Adhesion ◽  
Elastoplastic Bending

Analyses have been made to extract the objective interfacial fracture toughness from the peel strength of very thin metallic films. An elastoplastic bending model of the adherend film has been employed in the analyses applying the fracture mechanics concept of steady-state interfacial crack growth. The analytic result finally shown is a universal peel diagram where the objective interfacial fracture toughness is readily readable when the peel strength is known. Experimental results for Cu films on Si and polyimide substrate systems with a Cr interface are also presented.

Single-Strip Decohesion Test to Characterize Nano-Scale Thin Film Delamination

2005 ◽  
Author(s):  
Jiantao Zheng ◽  
Suresh K. Sitaraman
Keyword(s):  
Thin Film ◽  
Fracture Toughness ◽  
Interfacial Fracture ◽  
Critical Energy ◽  
Test Method ◽  
Interfacial Fracture Toughness ◽  
Critical Energy Release Rate ◽  
Nano Scale ◽  
Thin Film Adhesion ◽  
Single Strip

A new test method, Single-Strip Decohesion Test (SSDT), has been developed and used to measure the interfacial fracture toughness of nano-scale thin film on substrate. This fixtureless test employs a stress-engineered superlayer deposited on patterned titanium (Ti) film strips to supply the energy for the delamination from a thick silicon (Si) substrate. The amount of energy available for delamination propagation is varied by fabricating an etchable thin release layer of varying width between the film strips and the substrate. By designing a decreasing area of the release layer, it is possible to arrest the delamination at a given location, and the interfacial fracture toughness or critical energy release rate can be found at the location where the delamination ceases to propagate. Common IC fabrication techniques are used to prepare the sample and execute the test, thereby making the test compatible with current microelectronic or MEMS facilities and suitable for in process measurement of thin film adhesion strength. The methodology presented in this paper is generic in nature, and can be used to measure the process-dependent interfacial fracture toughness of various micro-scale and nano-scale thin film interfaces. Ti thin film with thickness ranging from 5nm to 100nm can be studied using this method.

A Technique to Measure Interfacial Toughness Over a Range of Phase Angles

1999 ◽  
Vol 122 (2) ◽  
pp. 147-151 ◽  
Author(s):  
Adam Kuhl ◽  
Jianmin Qu
Keyword(s):  
Fracture Toughness ◽  
Interfacial Fracture ◽  
Interfacial Fracture Toughness ◽  
Adhesive Systems ◽  
Adhesive Material ◽  
Element Analysis ◽  
Interfacial Toughness ◽  
Loading Direction ◽  
Wide Range ◽  
Phase Angles

An experimental technique using sandwiched Brazil-nut specimens to quantitatively characterize interfacial fracture toughness over a wide range of phase angles is presented. Specimens are made by sandwiching a thin layer of adhesive material between two metal substrates. Tensile loads are applied to the specimens at various loading angles. Through the use of fracture mechanics and finite element analysis, interfacial fracture toughness as a function of loading phase angle is determined from the experimentally obtained critical load and loading direction. The fracture toughness curves for several different Cu/adhesive systems are obtained. [S1043-7398(00)00302-9]

Numerical Analysis of Three-Dimensional Semi-Elliptical Interfacial Cracks Subjected to Indentation Load

2014 ◽  
Vol 627 ◽  
pp. 289-292 ◽  
Author(s):  
N. Kurihara ◽  
Masayuki Arai
Keyword(s):  
Fracture Toughness ◽  
Three Dimensional ◽  
Analytical Formula ◽  
Interfacial Crack ◽  
Indentation Test ◽  
Interfacial Fracture ◽  
Indentation Load ◽  
J Integral ◽  
Interfacial Fracture Toughness ◽  
Interfacial Cracks

The aim of this study is to show elastic J-integral needed to evaluate the interfacial fracture toughness of bi-material in indentation test. Three dimensional J-integrals along the crack front tip in semi-elliptical crack lying on the interface were analyzed using domain integral technique installed in commercialized finite element code MARC. The J-integral was calculated under several kind of aspect ratio of semi-elliptical cracks. In order to have to evaluate the interfacial fracture toughness from interfacial crack length and indentation load obtained in indentation tests, the analytical formula for two dimensional interfacial crack J-integral under plane stress, which had been introduced by J. R. Rice and G. C. Sih, was modified in reflecting upon the three dimensional effect. Finally, the indentation test was conducted for Aluminum alloy/ PMMA combination sample, and the associated fracture toughness was evaluated.Fig.1 Schematic illustration of indentation testFig.2 Schematic illustration of analysis mode

Interfacial Fracture Toughness for Film on Substrate Determined by Indentation Method

2007 ◽  
Vol 345-346 ◽  
pp. 801-804
Author(s):  
Soo Hyun Lee ◽  
Jink Wang Kim ◽  
Su Nam Kim ◽  
Sang Bong Cho ◽  
Jon Do Yun
Keyword(s):  
Fracture Toughness ◽  
Tensile Testing ◽  
Interfacial Fracture ◽  
Interface Fracture ◽  
Interfacial Fracture Toughness ◽  
Indentation Method ◽  
Element Analysis ◽  
Fracture Toughness Measurement ◽  
Interface Fracture Toughness ◽  
Toughness Measurement

Indentation method was used to determine the interfacial fracture toughness of epoxy coating on aluminum substrate. Tensile testing followed by finite element analysis was also performed to determine the interface fracture toughness. Fracture toughness values determined by two methods were consistent, giving reliability to indentation method for interfacial fracture toughness measurement.

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