Thermal Stress Analysis of Powder Metallurgy Sintering Process Based on ANSYS

2015 ◽  
Vol 667 ◽  
pp. 244-249
Author(s):  
Hui Qiu ◽  
Yong Gang Zhu ◽  
Li Zhang
Keyword(s):  
Temperature Field ◽  
Thermal Stress ◽  
Powder Metallurgy ◽  
Temperature Distribution ◽  
Stress Distribution ◽  
Stress Field ◽  
Sintering Temperature ◽  
Sintered Body ◽  
Sintering Process ◽  
Thermal Stress Field

Powder metallurgy is a technology process that the powder is pressed and sintered to get the metal and composite products. The sintering temperature is one of the main technology parameters of pressing sintering. In significant measure, the sintering temperature determines the organization and geometry size of the material, which directly affects the performance of the material. This paper takes magnesium powder metallurgy sintering material as the research object, studying the transient thermal analysis with the ANSYS finite element software, systematic researching the sinter temperature field and thermal stress field of sintered body in the sintering process, and observing in the corresponding distribution of stress field and deformation under different sintering temperature distribution graph. Temperature field and thermal stress field are the main factors affecting the quality of the sintered body in sintering process. Uneven temperature distribution will cause larger thermal stress. When the thermal stress exceeds a certain limit, the sample will be deformed. With the temperature increases, the sintering temperature difference increases, the stress distribution in the constantly changes. The stress and deformation is not entirely visible for sintered body, the deformation and cracking will be side by side in the sintering process. Therefore, theory of temperature field and thermal stress distribution are studied and discussed in certain sintering processing, the sintering process optimization can be designed to provide quantitative basis of the theoretical analysis.

Investigation on Temperature Field and Thermal Stress of Dish Solar Concentrator’s Focal Region

2011 ◽  
Vol 148-149 ◽  
pp. 20-23
Author(s):  
Xing Zhi Wang ◽  
Yong Shuai ◽  
Fu Qiang Wang ◽  
Chun Liang Yu
Keyword(s):  
Temperature Field ◽  
Thermal Stress ◽  
Stress Field ◽  
Infrared Camera ◽  
Radiant Heat ◽  
Focal Region ◽  
Solar Concentrator ◽  
Flux Function ◽  
Thermal Stress Field ◽  
Good Accordance

Depending on the solar radiant flux and velocity measured in Harbin, with finite element method, use a modified radiant heat flux function to calculate the temperature field of a plate on the focal region of a dish solar concentrator. Compared the result with picture taken by infrared camera, there is a good accordance between them. The temperature field is used as the loading parameters to calculate the thickness’s impact on the thermal stress field in the plate. When the value of the thickness increases, the maximum values of the stress increase, but the overall stress field tend to decrease.

Laser-Induced Thermal Damage to K9 Glass on Finite Element Method

2013 ◽  
Vol 444-445 ◽  
pp. 1422-1426
Author(s):  
Li Zi Chen ◽  
Chun Yuan Jing ◽  
Xiao Wei Guan
Keyword(s):  
Finite Element ◽  
Temperature Field ◽  
Thermal Stress ◽  
Stress Field ◽  
Thermal Damage ◽  
Laser Damage Threshold ◽  
Element Analysis ◽  
Finite Element Software ◽  
Thermal Stress Field ◽  
K9 Glass

Based on the theory of the thermal conduction and the thermal elastic equations, does some researches in view of the thermal Damage of K9 glass by finite element analysis. The distribution of temperature field and thermal stress field of the ideal K9 glass which irradiated by 100W pulsed-Nd: YAG laser are simulated with finite element software. The result shows that the temperature of the surface of glass doesnt reach the melting and the thermal stress of it doesnt get to the requirement for fracture strength. Then, the model of K9 glass containing inclusions has be built. The simulation result indicates that inclusions may affect the distribution of temperature field and thermal stress field of the K9 glass, which makes the injected laser beams energy centralize on a small area around the inclusions owing to the existence of the strong absorbing, thus leading to K9 glass laser damage threshold reduction and easier to thermal damage.

Analysis of Thermal-Mechanism Coupled Stress Field of a Diesel Engine Cylinder Head

2013 ◽  
Vol 401-403 ◽  
pp. 59-64
Author(s):  
Qi Liu ◽  
Guang Yao Ouyang ◽  
Ping Zhang
Keyword(s):  
Temperature Field ◽  
Thermal Stress ◽  
Diesel Engine ◽  
Stress Field ◽  
Cylinder Head ◽  
Element Analysis ◽  
Mechanical Loads ◽  
Thermal Stress Field ◽  
Engine Cylinder ◽  
Thermal Mechanism

The paper analyzed the temperature field, the thermal stress field and the stress field under mechanical loads of a diesel engine cylinder head with finite element analysis software ANASYS, then took above temperature field results and mechanical loads as boundary conditions to impose on the established model of cylinder head using the thermal mechanism indirect coupled method, researched the stress field and distortion of cylinder head under effect of multiplicative loads. The result indicates that the point of the highest temperature and the maximum thermal stress locates on the middle nose of fire deck; under thermal mechanism coupled effect, the points of maximum stress locate on the interface of bolt head and screw of cylinder head and on the middle nose of fire deck; the maximum pull stress the cylinder head undertook is less than that the material can survive; the distortion of the cylinder head is very small, thus has little influence on the fabrication of other accessories, and the global distortion of cylinder head performs symmetry.

A Coupled Thermal Structural Finite Element Analysis of a Single Pulse Micro-EDM Process

2013 ◽  
Vol 579-580 ◽  
pp. 86-90
Author(s):  
Cheng Guo ◽  
Yu Kui Wang ◽  
Zhen Long Wang ◽  
Bao Cheng Xie
Keyword(s):  
Temperature Field ◽  
Thermal Stress ◽  
Stress Field ◽  
Structural Model ◽  
White Layer ◽  
Three Dimensional ◽  
Single Pulse ◽  
Discharge Process ◽  
Element Analysis ◽  
Thermal Stress Field

A three-dimensional coupled thermal structural model for micro electrical discharge is presented in this paper. Temperature field and thermal stress field of a single spark discharge process are analysed using this model by indirect coupling method. Temperature field is firstly solved which acts as the foundation of solving thermal stress field. To make the simulation results more reliable, these important elements are also taken into account, such as temperature-dependent properties of material, the phenomenon of plasma channel radius expanding, the percentage of discharge energy transferred to the workpiece and Gaussian distribution of heat flux. The results can explain the formation of cracks around the discharge crater. The thickness of the white layer and residual stresses can be predicated using this model.

The Simulation of Thermal Stress Field for Polysilicon Crystal in Different Shapes of Crucible

2014 ◽  
Vol 926-930 ◽  
pp. 286-291
Author(s):  
Yu Feng Luo ◽  
Hua Wei Song ◽  
Fa Yun Zhang ◽  
Hua Xia Peng ◽  
Yun Hu ◽  
...  
Keyword(s):  
Thermal Stress ◽  
Stress Distribution ◽  
Stress Field ◽  
Production Process ◽  
Comsol Multiphysics ◽  
Inverted Cone ◽  
Thermal Stress Field ◽  
Different Types ◽  
Different Shapes ◽  
Thermal Stress Distribution

The thermal stress field in the polysilicon was simulated and comparatively analyzed at different shapes of crucibes which have different types of a flat, a inverted-conical and concave bottom by COMSOL Multiphysics version 4.3a. The results indicated that: within the flat-bottomed crucible ,the isotherm in the crystal was slightly convex and the area of the maximum thermal stress was distributed in the bottom of the crystal edge and near the top of crystal edge; within the inverted-cone crucible, the isotherm in the crystal was straight and the area of the maximum thermal stress was only distributed in the bottom of the crystal edge; within the bottom of the concave crucible, the isotherm in the crystal was slightly concave and the area of the maximum thermal stress distributed in the bottom of the crystal edge was larger than that of the crystal within the first two kinds of crucibles. To sum up, the inverted-cone crucibe was beneficial to reduce the thermal stress distribution in the polysilicon which could provide theoretical guidance for improving the production process of the polysilicon.

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