Laser-Induced Thermal Damage to K9 Glass on Finite Element Method

2013 ◽  
Vol 444-445 ◽  
pp. 1422-1426
Author(s):  
Li Zi Chen ◽  
Chun Yuan Jing ◽  
Xiao Wei Guan
Keyword(s):  
Finite Element ◽  
Temperature Field ◽  
Thermal Stress ◽  
Stress Field ◽  
Thermal Damage ◽  
Laser Damage Threshold ◽  
Element Analysis ◽  
Finite Element Software ◽  
Thermal Stress Field ◽  
K9 Glass

Based on the theory of the thermal conduction and the thermal elastic equations, does some researches in view of the thermal Damage of K9 glass by finite element analysis. The distribution of temperature field and thermal stress field of the ideal K9 glass which irradiated by 100W pulsed-Nd: YAG laser are simulated with finite element software. The result shows that the temperature of the surface of glass doesnt reach the melting and the thermal stress of it doesnt get to the requirement for fracture strength. Then, the model of K9 glass containing inclusions has be built. The simulation result indicates that inclusions may affect the distribution of temperature field and thermal stress field of the K9 glass, which makes the injected laser beams energy centralize on a small area around the inclusions owing to the existence of the strong absorbing, thus leading to K9 glass laser damage threshold reduction and easier to thermal damage.

Analysis of Thermal-Mechanism Coupled Stress Field of a Diesel Engine Cylinder Head

2013 ◽  
Vol 401-403 ◽  
pp. 59-64
Author(s):  
Qi Liu ◽  
Guang Yao Ouyang ◽  
Ping Zhang
Keyword(s):  
Temperature Field ◽  
Thermal Stress ◽  
Diesel Engine ◽  
Stress Field ◽  
Cylinder Head ◽  
Element Analysis ◽  
Mechanical Loads ◽  
Thermal Stress Field ◽  
Engine Cylinder ◽  
Thermal Mechanism

The paper analyzed the temperature field, the thermal stress field and the stress field under mechanical loads of a diesel engine cylinder head with finite element analysis software ANASYS, then took above temperature field results and mechanical loads as boundary conditions to impose on the established model of cylinder head using the thermal mechanism indirect coupled method, researched the stress field and distortion of cylinder head under effect of multiplicative loads. The result indicates that the point of the highest temperature and the maximum thermal stress locates on the middle nose of fire deck; under thermal mechanism coupled effect, the points of maximum stress locate on the interface of bolt head and screw of cylinder head and on the middle nose of fire deck; the maximum pull stress the cylinder head undertook is less than that the material can survive; the distortion of the cylinder head is very small, thus has little influence on the fabrication of other accessories, and the global distortion of cylinder head performs symmetry.

A Coupled Thermal Structural Finite Element Analysis of a Single Pulse Micro-EDM Process

2013 ◽  
Vol 579-580 ◽  
pp. 86-90
Author(s):  
Cheng Guo ◽  
Yu Kui Wang ◽  
Zhen Long Wang ◽  
Bao Cheng Xie
Keyword(s):  
Temperature Field ◽  
Thermal Stress ◽  
Stress Field ◽  
Structural Model ◽  
White Layer ◽  
Three Dimensional ◽  
Single Pulse ◽  
Discharge Process ◽  
Element Analysis ◽  
Thermal Stress Field

A three-dimensional coupled thermal structural model for micro electrical discharge is presented in this paper. Temperature field and thermal stress field of a single spark discharge process are analysed using this model by indirect coupling method. Temperature field is firstly solved which acts as the foundation of solving thermal stress field. To make the simulation results more reliable, these important elements are also taken into account, such as temperature-dependent properties of material, the phenomenon of plasma channel radius expanding, the percentage of discharge energy transferred to the workpiece and Gaussian distribution of heat flux. The results can explain the formation of cracks around the discharge crater. The thickness of the white layer and residual stresses can be predicated using this model.

Finite Element Analysis about the Influence that High-Speed Motorized Spindle Spindle System Material has on its Temperature Field

2013 ◽  
Vol 712-715 ◽  
pp. 1209-1212 ◽  
Author(s):  
Ke Zhang ◽  
Xiang Nan Ma ◽  
Li Xiu Zhang ◽  
Wen Da Yu ◽  
Yu Hou Wu
Keyword(s):  
Heat Transfer ◽  
Finite Element ◽  
Temperature Field ◽  
Heat Transfer Rate ◽  
Transfer Rate ◽  
High Speed ◽  
Ceramic Materials ◽  
Motorized Spindle ◽  
Element Analysis ◽  
Finite Element Software

The article has analyzed the changes of temperature of different materials of the spindle, and considered 170SD30 Ceramic Motorized Spindle and the same model Metal Motorized Spindle as the research objects, analyzed the inside heat source and heat transfer mechanism of the high-speed motorized spindle; used finite element software to set up the model of the motorized spindle, and did simulation and analysis. Verified by simulation, heat transfer rate of ceramic materials is slower than the metallic materials, in actual operation of the process, due to different materials have different heat transfer rate, so the temperature distribution of the different materials of motorized spindle are different. This conclusion provides the basis to solve motorized spindle temperature field distribution.

Calculation and Analysis of 2-D Thermal Stress Field in Induction Motor with Compound Cage Rotor under Different Load

2011 ◽  
Vol 117-119 ◽  
pp. 97-100
Author(s):  
Jun Ci Cao ◽  
Rong Chao Qian ◽  
Wei Li Li
Keyword(s):  
Finite Element ◽  
Thermal Stress ◽  
Stress Field ◽  
Induction Motor ◽  
Reference Value ◽  
Single Site ◽  
Compound Material ◽  
Thermal Stress Field ◽  
New Type ◽  
Cage Rotor

3kW two poles induction motor with compound cage rotor is illustrated in this paper, and 2-D thermal stress field of induction motor rotor is calculated and analyzed by finite element. Contrasting with common induction motor, induction motor with compound cage rotor has specific rotor shot shape and the bar is comprised of the upper compound material and the lower cast aluminium, which cause distribution of thermal stress is special. The motor with the rotor shot of compound material laid at single site is chosen to analyzing. The maximum thermal stress in the bar is calculated at different load, and the distribution of thermal stress in the bar is analyzed at rate load. The law of distribution of thermal stress in the bar has same reference value for designing new type of induction motor.

Investigation on Temperature Field and Thermal Stress of Dish Solar Concentrator’s Focal Region

2011 ◽  
Vol 148-149 ◽  
pp. 20-23
Author(s):  
Xing Zhi Wang ◽  
Yong Shuai ◽  
Fu Qiang Wang ◽  
Chun Liang Yu
Keyword(s):  
Temperature Field ◽  
Thermal Stress ◽  
Stress Field ◽  
Infrared Camera ◽  
Radiant Heat ◽  
Focal Region ◽  
Solar Concentrator ◽  
Flux Function ◽  
Thermal Stress Field ◽  
Good Accordance

Depending on the solar radiant flux and velocity measured in Harbin, with finite element method, use a modified radiant heat flux function to calculate the temperature field of a plate on the focal region of a dish solar concentrator. Compared the result with picture taken by infrared camera, there is a good accordance between them. The temperature field is used as the loading parameters to calculate the thickness’s impact on the thermal stress field in the plate. When the value of the thickness increases, the maximum values of the stress increase, but the overall stress field tend to decrease.

Three-Dimensional Finite Element Coupled Analysis of a Diesel Engine Piston

2014 ◽  
Vol 684 ◽  
pp. 347-353
Author(s):  
Qi Liu ◽  
Guang Yao Ouyang ◽  
Ping Zhang
Keyword(s):  
Finite Element ◽  
Thermal Stress ◽  
Diesel Engine ◽  
Stress Field ◽  
Cylinder Liner ◽  
Coupled Analysis ◽  
Stress Effect ◽  
Element Analysis ◽  
Engine Piston ◽  
Thermal Mechanism

The paper analyzed the temperature field and the thermal stress field of a diesel engine piston with finite element analysis software ANASYS, then used the thermal mechanism indirect coupled method, researched the coupled stress field of piston. The result indicated that the point of the highest temperature located on the middle of firebox which under the dangerous temperature of the material; under thermal stress effect, the max displacement of the piston did not exceed the clearance between piston and cylinder liner, but the non-roundness at the third ring reached 0.08mm, which had some influence on the pressurize and lubricate of piston; under thermal mechanism coupled effect, the point of max stress located on the interface of the seat of the pin and the pin hole, so as the top on the pin hole and inner on the seat of pin, so it was recommended to set rib between cervix and the seat of pin of piston to enhance the practical carrying capacity of the seat of the pin.

Thermal-stress analysis and calculation of single and dual chip set double-sided circuit board based on three-dimensional finite element algorithm

Circuit World ◽  
2015 ◽  
Vol 41 (2) ◽  
pp. 49-54
Author(s):  
Lan Song ◽  
Yang Zhao ◽  
Yaoming Zhou ◽  
Haifei Xiang
Keyword(s):  
Finite Element ◽  
Temperature Field ◽  
Thermal Stress ◽  
Three Dimensional ◽  
Circuit Board ◽  
Content Type ◽  
Thermal Stress Field ◽  
Dimensional Finite Element ◽  
Three Dimensional Finite Element ◽  
Element Algorithm

Purpose – The purpose of this paper is to analyze and figure out the temperature field and thermal stress field with the calculation model of thermal insulation material and composite material. Design/methodology/approach – The paper adopted the three-dimensional finite element algorithm. Findings – The simulated results showed great shearing strength between the chipset and the printed circuit board. The position of chip exerts great influence on the distribution of temperature field and thermal stress field of circuit board. The reasonable distribution of chip will effectively reduce the temperature extremum and stress extremum of circuit board. Originality/value – The paper analyzes and presents a discussion of the problems relating to the density of electronic packaging. The analysis process and the method of the paper provide essential help in resolving electronic device heat problems.

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