Study of Nickel Wick Structure Applied to Loop Heat Pipe with Flat Evaporator

2016 ◽  
Vol 723 ◽  
pp. 282-287 ◽  
Author(s):  
Shen Chun Wu ◽  
Shih Hsuan Yen ◽  
Wei Chen Lo ◽  
Chen Yu Chung ◽  
Shen Jwu Su

This study investigated the use of sintered Nickel powder as the wick material of Loop heat pipe with flat evaporator (Flat loop heat pipe, FLHP) and its effect on the heat transfer performance. Add the 1-heptanol into water and form Self-rewetting Fluid (SRF), resulting in the Marangoni effect. The colder liquid can be transport to the heating surface, delaying the occurrence of dry-out and increasing the critical heat load. This paper use Surface tension measurements to measure the change of 1-heptanol SRF, then it was apply to nickel wick FLHP as working fluid to investigate its effect on the heat transfer performance. This study successfully established production process of Nickel wick structure. Results of wick structure for the effective pore radius of 2.6 μm, porosity of 62%, permeability of 5.7 × 10-13m2. Results of Surface tension measurements show that 1-heptanol aqueous solution’s surface tension increases with increasing temperature, Results from applying 0.1% 1-heptanol aqueous solution to FLHP as working fluid. For performance testing show that the critical heat load was 240 W and the total thermal resistance was 0.77 ° C/W. Compared with FLHP with pure water, SRF raised the maximum heat flux of 70%, the total thermal resistance of the system reduces 40%, SRF has the potential to enhance the heat transfer performance of FLHP.

2014 ◽  
Vol 595 ◽  
pp. 24-29 ◽  
Author(s):  
Shen Chun Wu ◽  
Kuei Chi Lo ◽  
Jia Ruei Chen ◽  
Chen Yu Chung ◽  
Weie Jhih Lin ◽  
...  

This paper specifically addresses the effect of the sintering temperature curve in manufacturing nickel powder capillary structure (wick) for a loop heat pipe (LHP) with flat evaporator. The sintering temperature curve is composed of three regions: a region of increasing temperature, a region of constant temperature, and a region of decreasing temperature. The most important region is the increasing temperature region, as the rate of temperature increase directly affects the performance of the wick.When the slope of the region of increasing temperature is 0.8 (equivalent to 8 OC/min), the structure of the manufactured wick is complete, with the best heat transfer performance result. Experimental resultsshowed that the optimal heat transfer performance is 160W, the minimal total thermal resistance is approximately 0.43OC/W, and the heat flux is 17W/cm2; the optimal wick manufactured has an effective pore radius of 5.2 μm, a permeability of 5.9×10-13m2, and a porosity of 64%.


2013 ◽  
Vol 589-590 ◽  
pp. 552-558
Author(s):  
Xi Bing Li ◽  
Xun Wang ◽  
Yun Shi Ma ◽  
Zhong Liang Cao

As a highly efficient heat dissipation unit, a micro heat pipe is widely used in high heat flux microelectronic chips, and its thermal resistance is crucial to heat transfer capacity. Through analyses of the structure and heat transfer performance of a circular heat pipe with sintered wick, the theoretical model of total thermal resistance was established on heat transfer theory, and then simplified, finally a testing platform was set up to test for total thermal resistance performance. The testing results show that when the micro heat pipe is in optimal heat transfer state, its total thermal resistance conform well with that from the theoretical model, and its actual thermal resistance is much lower than that of the rod made of the material with perfect thermal conductivity and of the same geometric size. With the increment of heat transfer capability, the total thermal resistance of a micro heat pipe with sintered wick decreases first, then increases and reaches the minimum when it is in the optimal heat transfer state. The greater total thermal resistance in low heat transfer performance is mainly caused by too much working fluid accumulating in evaporator and the lower velocity in vapor cavity, and the greater total thermal resistance in high heat transfer performance is mainly due to the working fluid drying up in condenser. Total thermal resistance is related to many factors, such as thermal conductivity of tube-shell material, wall thickness, wick thickness, copper powders grain size and porosity, the lengths of condenser and evaporator, and the diameter of vapor cavity etc.. Therefore, the structure parameters of a micro heat pipe with sintered wick should be reasonably designed according to the specific conditions to ensure its heat transfer capacity and total thermal resistance to meet the requirements.


2016 ◽  
Vol 693 ◽  
pp. 395-402
Author(s):  
Xi Bing Li ◽  
Ming Jian Li ◽  
Ming Li ◽  
Ying Si Wan

As an efficient heat conducting unit, micro heat pipe is widely used in high heat flux microelectronic chips, and thermal resistance is one of the factors that are crucial to its heat transfer capacity. Based on heat transfer theory, this paper established a theoretical model of total thermal resistance through analyzing the structure and heat transfer performance of circular heat pipe with trapezium-grooved wick, simplified the model and tested the micro heat pipe for its total thermal resistance performance by setting up a testing platform. The testing results show that when the micro heat pipe is in the optimal heat transfer state, its total thermal resistance well coincides with that from the established theoretical model. As for a micro heat pipe with trapezium-grooved wick, its total thermal resistance first decreases, then increases with heat transfer capability increment, and reaches the minimum when it is in the optimal state of heat transfer performance. That too much working fluid accumulates in evaporation section and the vapor velocity is rather low is the main cause for the greater thermal resistance when the pipe is in low heat transfer quantity, yet the greater total thermal resistance when the pipe is in high heat transfer quantity is mainly caused by the working fluid drying up in condensation section. The total thermal resistance is related to many factors, such as the thermal conductivity of tube-shell material, wall thickness, wick thickness, the number of the grooves, the lengths of condensation and evaporation sections, the diameter of vapor cavity etc.. Therefore, the structure parameters of a micro heat pipe with trapezium-grooved wick should be rationally designed according to specific conditions to ensure its heat transfer capacity and total thermal resistance to meet the requirements and be in the optimal state.


2012 ◽  
Vol 55 (4) ◽  
pp. 1304-1315 ◽  
Author(s):  
Xuan Hung Nguyen ◽  
Byung Ho Sung ◽  
Jeehoon Choi ◽  
Seong Ryoul Ryoo ◽  
Han Seo Ko ◽  
...  

2015 ◽  
Vol 88 ◽  
pp. 391-397 ◽  
Author(s):  
Hui Li ◽  
Bo Zhou ◽  
Yong Tang ◽  
Rui Zhou ◽  
Zhongshan Liu ◽  
...  

Author(s):  
Randeep Singh ◽  
Aliakbar Akbarzadeh ◽  
Masataka Mochizuki ◽  
Thang Nguyen ◽  
Vijit Wuttijumnong

Loop heat pipe (LHP) is a very versatile heat transfer device that uses capillary forces developed in the wick structure and latent heat of evaporation of the working fluid to carry high heat loads over considerable distances. Robust behaviour and temperature control capabilities of this device has enable it to score an edge over the traditional heat pipes. In the past, LHPs has been invariably assessed for electronic cooling at large scale. As the size of the thermal footprint and available space is going down drastically, miniature size of the LHP has to be developed. In this paper, results of the investigation on the miniature LHP (mLHP) for thermal control of electronic devices with heat dissipation capacity of up to 70 W have been discussed. Copper mLHP with disk-shaped flat evaporator 30 mm in diameter and 10 mm thickness was developed. Flat evaporators are easy to attach to the heat source without any need of cylinder-plane-reducer saddle that creates additional thermal resistance in the case of cylindrical evaporators. Wick structure made from sintered nickel powder with pore size of 3–5 μm was able to provide adequate capillary forces for the continuos circulation of the working fluid, and successfully transport heat load at the required distance of 60 mm. Heat was transferred using 3 mm ID copper tube with vapour and liquid lines of 60 mm and 200 mm length respectively. mLHP showed very reliable start up at different heat loads and was able to achieve steady state without any symptoms of wick dry-out. Tests were conducted on the mLHP with evaporator and condenser at the same level. Total thermal resistance, R total of the mLHP came out to be in the range of 1–4°C/W. It is concluded from the outcomes of the investigation that mLHP with flat evaporator can be effectively used for the thermal control of the electronic equipments with restricted space and high heat flux chipsets.


Author(s):  
Lilin Chu ◽  
Yulong Ji ◽  
Chunrong Yu ◽  
Yantao Li ◽  
Hongbin Ma ◽  
...  

Abstract In order to understand the heat transfer performance, startup and fluid flow condition of oscillating heat pipe (OHP) with hydraulic diameter far exceeding the maximum hydraulic diameter (MHD), an experimental investigation on heat transfer performance and visualization was conducted. From the experimental performance, it is found that the OHP can still work well with ethanol as the working fluid when the tube diameter has exceeded the MHD of 91.6%. In addition, the detailed flow patterns of the OHP were recorded by a highspeed camera for vertical and horizontal orientation to understand its physical mechanism. In the vertical orientation, initially working fluid generates small bubbles, and then the small bubbles coalesce and grow to vapor plugs, the vapor plugs finally pushes the liquid slugs to oscillate in the tube. In the horizontal orientation, the working fluid surface fluctuates due to the vapors flow from the evaporator to the condenser and bubbles burst in the evaporator. When the peak of liquid wave reaches the upper surface of tube, a liquid slug has been formed, and then the steam flow pushes the liquid slugs to oscillate in the tube.


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