Titanium Nitride - Silicon Nitride Composite Coatings Deposited by Reactive Magnetron Sputtering

1998 ◽  
Vol 287-288 ◽  
pp. 267-268
Author(s):  
Jörg Patscheider ◽  
M Diserens ◽  
F. Lévy
JOM ◽  
2015 ◽  
Vol 69 (8) ◽  
pp. 1455-1455
Author(s):  
Violeta Valentina Merie ◽  
Marius Sorin Pustan ◽  
Corina Bîrleanu ◽  
Gavril Negrea

1990 ◽  
Vol 190 (2) ◽  
pp. 265-277 ◽  
Author(s):  
M.Y. Al-Jaroudi ◽  
H.T.G. Hentzell ◽  
S.E. Hörnström ◽  
A. Bengtson

1989 ◽  
Vol 182 (1-2) ◽  
pp. 153-166 ◽  
Author(s):  
M.Y. Al-Jaroudi ◽  
H.T.G. Hentzell ◽  
S.E. Hörnström ◽  
A. Bengtson

Author(s):  
Kai Yang ◽  
Jianqing Jiang ◽  
Mingyuan Gu

Titanium nitride (TiN) films were grown on Si (111) and 95W18Cr4V high-speed steel substrates using DC reactive magnetron sputtering technique with different deposition time. The changes in crystal growth orientation of the TiN films were measured by X-ray diffraction (XRD). The surface & cross-sectional morphologies of TiN films were analyzed using field emission scanning electron microscopy (FESEM). The hardness and adhesive property of TiN films were evaluated as well. It is found that the increase of the film thickness favors the formation of the {111} preferred orientation of TiN films. When the {111} preferred orientation is presented, TiN films exhibit a kind of surface morphology of triangular pyramid with right angles. With the increase of the film thickness, the columnar grains continuously grow lengthwise and breadthwise. The size of grains influences the hardness of TiN films more greatly. The adhesive property of the film/substrate interface decreased with increasing film thickness.


2017 ◽  
Author(s):  
Nafarizal Nayan ◽  
Soo Ren How ◽  
Jais Lias ◽  
Mohd Khairul Ahmad ◽  
Mohd Zainizan Sahdan ◽  
...  

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