Thermal Stability of 40Cr Steel with Surface Nanocrystallization

2006 ◽  
Vol 510-511 ◽  
pp. 434-437 ◽  
Author(s):  
Yu Liang Liu ◽  
Tian Ying Xiong ◽  
Ke Yang

Surface Nanocrystallization(SNC) is a new method of fabricating nanostructured materials while thermal stability is an important problem for the application of nanostructured materials. A nanostructured layer was fabricated on the surface of 40Cr steel by Supersonic Particles Bombarding method, and the variation of microstructure and microhardness of nanostructured layer was studied. Nanostructured surface layer showed high thermal stability.

2007 ◽  
Vol 546-549 ◽  
pp. 1129-1134 ◽  
Author(s):  
Jin Fang Ma ◽  
Lan Qing Hu ◽  
Xu Guang Liu ◽  
Bing She Xu

After surface mechanical attrition treatment (SMAT) for Al-Zn-Mg alloy, a gradient structure with average grain size increased from 20nm in surface layer to about 100nm at a depth of 20μm was formed. The thermal stability of surface nanostructured layer in Al-Zn-Mg alloy samples was investigated by vacuum annealing at 100°C, 150°C, 200°C and 250°C for 1h, respectively. The microstructural evolution as well as the microhardness along the depth from top surface layer to matrix of SMATed samples was analyzed. Experimental results showed that the grain size of surface nanocrystallites remains in submicro-scale, ranging from 300nm to 400nm, when annealed at a temperature of 250°C, and the microhardness of surface nanostructured layer was still high compared with that of matrix, indicating satisfying thermal stability of nanocrystallized layer. This might be attributed to the presence of substantive trident grain boundaries and pinning effect of dispersive precipitated phases in nanocrystalline materials, which hindered the grain boundary migration that leading to grain growth.


2010 ◽  
Vol 59 (4) ◽  
pp. 733-740 ◽  
Author(s):  
M. P. Yutkin ◽  
M. S. Zavakhina ◽  
D. G. Samsonenko ◽  
D. N. Dybtsev ◽  
V. P. Fedin

Author(s):  
F.F. do Carmo ◽  
J.P.C. do Nascimento ◽  
J.E.V. de Morais ◽  
V.C. Martins ◽  
J.C. Sales ◽  
...  

2021 ◽  
pp. 93-98
Author(s):  
Evgenii Erofeev ◽  
Egor Polyntsev ◽  
Sergei Ishutkin

Electrophysical characteristics and their thermal stability of thin-film resistors based on tantalum nitride (TaN) obtained by reactive magnetron sputtering were investigated. The optimal modes of the magnetron sputtering process are determined, ensuring the Ta2N phase film composition with the value of the specific electrical resistance of 250 μm cm and high thermal stability of the parameters. On the basis of the investigations carried out, thin-film matching resistors were manufactured for use as part of an electro-optical InP-based MZ modulator


2020 ◽  
Vol 22 (28) ◽  
pp. 16294-16300
Author(s):  
Xiuxia Yang ◽  
Lei Zhao ◽  
Zhichao Liu ◽  
Shuyu Tian ◽  
Hao Zhang ◽  
...  

Manipulating the local environment of CAS by substitution of Al3+–Y3+ for Si4+–Ca2+ to achieve more stability in the structure of CYA.


Fuel ◽  
2020 ◽  
Vol 260 ◽  
pp. 116424 ◽  
Author(s):  
Jiawei Xie ◽  
Tinghao Jia ◽  
Si Gong ◽  
Ning Liu ◽  
Genkuo Nie ◽  
...  

2019 ◽  
Vol 35 (2) ◽  
pp. 785-791
Author(s):  
AZZA ABDULLAH Al-GHAMDI

Acrylonitrile (AN) was copolymerized with itaconic acid metal complexes [Co(II),Ni(II),Cu(II)] aiming to synthetize self-colored acrylonitrile fiber. The copolymerization occurred in water at 60°C using sodium bisulfite and potassium persulfate as redox initiators. The resulting copolymers are colored and exhibited high thermal stability as shown from their TGA curves. The investigated copolymers exhibited comparable thermal stability as that of PAN. The AN/ itaconic acid Co(NO3)2copolymer was considerably the most thermal stable copolymer while that of Ni(II) copolymer was the less stable one. Cu(II) copolymer showed an intermediate stability. The data also revealed that the maximum degradation occurred after 300°C (the cyclization temperature). Thus, neither the copolymerization nor the complexation affected the nitrile oligomerization reaction. The effect of adding ammonium hydroxide solution to acrylonitrile – itaconic acid copper(II) complex copolymer on the thermal stability of copolymer was also studied.


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