Selected Values for the Stacking Fault Energy of Face Centered Cubic Metals

2008 ◽  
Vol 591-593 ◽  
pp. 708-711 ◽  
Author(s):  
Marcos Flavio de Campos
Keyword(s):  
High Resolution Electron Microscopy ◽  
Accurate Method ◽  
Stacking Fault ◽  
Metals And Alloys ◽  
Stacking Fault Energy ◽  
Face Centered Cubic ◽  
Resolution Electron ◽  
Plastic Deformation Behavior ◽  
Face Centered ◽  
The 1960S

The Stacking fault energy (SFE) is an important parameter for metals and alloys. The plastic deformation behavior of face centered cubic (FCC) metals and alloys is directly related to the SFE values. The several methods for determining SFE are critically discussed. The values reported in the 1960s and early 1970s are, in general, 20-30% overestimated. The node dislocation method, due to Whelan, overestimates the SFE. The method based on the critical resolved shear stress is not reliable. The most accurate method is the direct observation of dissociated partials by weak beam in TEM or using HREM (High resolution electron microscopy). Indirect methods based in X-Ray Diffraction and texture may provide reasonable estimates since reliable SFE values of reference metals are available. Selected SFE values for Ni, Cu, Ag, Cu and Al are presented.

Interface structure of face-centered-cubic-Ti thin film grown on 6H–SiC substrate

2000 ◽  
Vol 15 (10) ◽  
pp. 2121-2124 ◽  
Author(s):  
Y. Sugawara ◽  
N. Shibata ◽  
S. Hara ◽  
Y. Ikuhara
Keyword(s):  
Thin Film ◽  
Orientation Relationship ◽  
High Resolution Electron Microscopy ◽  
Electron Beam Evaporation ◽  
Face Centered Cubic ◽  
High Adhesion ◽  
Resolution Electron ◽  
Face Centered ◽  
Relationship Of ◽  
High Degree

A titanium thin film was deposited on the flat (0001) face of a 6H–SiC by electron beam evaporation at room temperature in a vacuum of 5.1 × 10−8 Pa. The Ti film was epitaxially grown on the surface, and the interface between Ti and SiC was characterized by high-resolution electron microscopy. It was found that the structure of the deposited titanium is face-centered cubic (fcc), although bulk titanium metal usually has a hexagonal close-packed or body-centered cubic crystal structure. We believe that the unusual fcc structure of Ti thin film is due to the high adhesion of the film to the substrate and the high degree of coherency between them. The orientation relationship of the fcc-Ti/6H–SiC interface was (111)fcc-Ti//(0001)6H–SiC and [110]fcc-Ti//[1120]6H−SiC. Preliminary calculations indicate that this orientation relationship maximizes the lattice coherency across the interface.

Stacking Faults in Crystals

1968 ◽  
Vol 26 ◽  
pp. 250-251
Author(s):  
P. C. J. Gallagher
Keyword(s):  
Stacking Faults ◽  
Elastic Equilibrium ◽  
Stacking Fault ◽  
Stacking Fault Energy ◽  
Major Influence ◽  
Face Centered Cubic ◽  
Degree Of Dissociation ◽  
Partial Dislocations ◽  
Layer Structures ◽  
Face Centered

Stacking faults are an important substructural feature of many materials, and have been widely studied in layer structures (e.g. talc) and in crystals with hexagonal and face centered cubic structure. Particular emphasis has been placed on the study of faulted defects in f.c.c. alloys, since the width of the band of fault between dissociated partial dislocations has a major influence on mechanical properties.Under conditions of elastic equilibrium the degree of dissociation reflects the balance of the repulsive force between the partials bounding the fault, and the attractive force associated with the need to minimize the energy arising from the misfits in stacking sequence. Examples of two of the faulted defects which can be used to determine this stacking fault energy, Υ, are shown in Fig. 1. Intrinsically faulted extended nodes (as at A) have been widely used to determine Υ, and examples will be shown in several Cu and Ag base alloys of differing stacking fault energy. The defect at B contains both extrinsic and intrinsic faulting, and readily enables determination of both extrinsic and intrinsic fault energies.

Stacking fault energy of face-centered-cubic high entropy alloys

2018 ◽  
Vol 93 ◽  
pp. 269-273 ◽  
Author(s):  
S.F. Liu ◽  
Y. Wu ◽  
H.T. Wang ◽  
J.Y. He ◽  
J.B. Liu ◽  
...  
Keyword(s):  
Stacking Fault ◽  
Stacking Fault Energy ◽  
High Entropy Alloys ◽  
Face Centered Cubic ◽  
High Entropy ◽  
Face Centered

Formation of face-centered cubic titanium on a Ni single crystal and in Ni/Ti multilayers

1994 ◽  
Vol 9 (1) ◽  
pp. 31-38 ◽  
Author(s):  
Alan F. Jankowski ◽  
Mark A. Wall
Keyword(s):  
Structural Characteristics ◽  
Single Layer ◽  
High Resolution Electron Microscopy ◽  
Cubic Phase ◽  
Face Centered Cubic ◽  
X Ray Diffraction ◽  
X Ray ◽  
Resolution Electron ◽  
The Face ◽  
Face Centered

The artificial layering of metals can change both physical and structural characteristics from the bulk. The stabilization of polymorphic metallic phases can occur on a dimensional scale that ranges from single overgrowth layers to repetitive layering at the nanoscale. The sputter deposition of crystalline titanium on nickel, as both a single layer and in multilayer form, has produced a face-centered cubic phase of titanium. The atomic structure of the face-centered cubic titanium phase is examined using high resolution electron microscopy in combination with electron and x-ray diffraction.

Microstructure and Homogeneity of Nanocrystalline Co–Cu Supersaturated Solid Solutions Prepared by Mechanical Alloying

1997 ◽  
Vol 12 (4) ◽  
pp. 936-946 ◽  
Author(s):  
J. Y. Huang ◽  
Y. D. Yu ◽  
Y. K. Wu ◽  
D. X. Li ◽  
H. Q. Ye
Keyword(s):  
Electron Microscopy ◽  
Mechanical Alloying ◽  
Solid Solutions ◽  
High Resolution Electron Microscopy ◽  
Face Centered Cubic ◽  
Transmission Electron ◽  
Resolution Electron ◽  
Supersaturated Solid Solutions ◽  
Face Centered ◽  
Fcc Phase

Mechanical alloying (MA) has been performed in the CoxCu(100-x) (x = 10, 25, 50, 60, 75, and 90) system. High resolution electron microscopy (HREM) and field emission gun transmission electron microscopy (FEG TEM) were used to characterize the microstructure and homogeneity of the nanocrystalline Co25Cu75 solid solution. After 20 h of MA, all the mixtures show an entirely face-centered cubic (fcc) phase. HREM shows that the ultrafine-grained (UFG) materials prepared by MA contain a high density of defects. Two kinds of typical defects in UFG Co25Cu75 are deformation twins and dislocations. The dislocations are mostly 60° type, and in many cases they dissociate into 30° and 90° partials. The grain boundaries are ordered in structure, curved, and slightly strained, which is similar to that observed in NC–Pd. Nanoscale energy dispersive x-ray spectroscopy (EDXS) shows that the Co concentration in both the interior of grains and the GB's is close to the global composition, which proves that supersaturated solid solutions are indeed formed. In the meantime EDXS revealed that the mixing of Co and Cu in the solid solutions is homogeneous at nanometer scale. MA in the Co–Cu system is suggested to be a diffusion-controlled process, and stress-stimulated diffusion is proposed to be the reason for the formation of supersaturated solid solutions in this immiscible system.

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