Effects of the Surface Condition of the Substrates on the Electrical Characteristics of 4H-SiC MOSFETs

2009 ◽  
Vol 615-617 ◽  
pp. 781-784 ◽  
Author(s):  
Takeshi Ohshima ◽  
Shinobu Onoda ◽  
Toshiro Kamada ◽  
Kazutoshi Hotta ◽  
Kenji Kawata ◽  
...  
Keyword(s):  
Surface Roughness ◽  
Field Effect Transistors ◽  
Surface Condition ◽  
Drain Current ◽  
Metal Oxide Semiconductor ◽  
Oxide Semiconductor ◽  
Electrical Characteristics ◽  
Surface Conditions ◽  
P Type

Metal Oxide Semiconductor Field Effect Transistors (MOSFETs) were fabricated on p-type epitaxial 4H-SiC substrates with different surface conditions and these electrical characteristics were compared. The MOSFETs on Chemical Mechanical Polished substrates showed the drain current of the order of 10-12A at a gate voltage of 0 V, and the value of the drain current increased with increasing the surface roughness of substrates. With decreasing the surface roughness of substrates, the values of the threshold voltage decreased and the quality of gate oxide became better.

Change in Characteristics of SiC MOSFETs by Gamma-Ray Irradiation at High Temperature

2016 ◽  
Vol 858 ◽  
pp. 860-863 ◽  
Author(s):  
Takuma Matsuda ◽  
Takashi Yokoseki ◽  
Satoshi Mitomo ◽  
Koichi Murata ◽  
Takahiro Makino ◽  
...  
Keyword(s):  
Field Effect ◽  
Gamma Ray ◽  
Field Effect Transistors ◽  
Absorbed Dose ◽  
Drain Current ◽  
Metal Oxide Semiconductor ◽  
Oxide Semiconductor ◽  
Radiation Response ◽  
Electrical Characteristics ◽  
Gamma Ray Irradiation

Radiation response of 4H-SiC vertical power Metal-Oxide-Semiconductor Field Effect Transistors (MOSFETs) was investigated at 150°C up to 10.4 MGy. Until irradiation at 1.2 MGy, the drain current – gate voltage curves of the SiC MOSFETs shifted to the negative voltage side, and the leakage of drain current at gate voltages below threshold voltage increased with increasing absorbed dose. However, no significant change in the electrical characteristics of SiC MOSFETs was observed at doses above 1.2 MGy. For blocking characteristics, there were no degradations of the SiC MOSFETs irradiated at 150°C even after irradiated at 10.4 MGy.

Electrical Characteristics of MOSFETs Using 3C-SiC with Buried Insulating Layer

2010 ◽  
Vol 645-648 ◽  
pp. 1009-1012
Author(s):  
Takafumi Tanehira ◽  
T. Nakano ◽  
Motoi Nakao
Keyword(s):  
Field Effect Transistors ◽  
Metal Oxide Semiconductor ◽  
Oxide Semiconductor ◽  
Implantation Technique ◽  
Electrical Characteristics ◽  
Insulating Layer ◽  
Aluminum Ions ◽  
Drain Region ◽  
First Time

Metal oxide semiconductor field effect transistors (MOSFETs) using SiC on insulator (SiC-OI) substrate with the structure of 3C-SiC (100)/SiO2/Si have been fabricated. SiC-OI substrates with SiC thicknesses of 100 nm and 600 nm are employed as starting materials and aluminum ions are implanted for p-regions or channel regions with a multi-implantation technique. Afterward, to form the source and drain regions, phosphorus ions are implanted. The gate oxide layer is grown in dry thermal oxidation, followed by post-oxidation annealing. Nickel is used as a contact material for the source and drain region, and aluminum is used for the gate material. From Id-Vd characteristics, 600 nm SiC-OI MOSFET is superior to 100 nm SiC-OI MOSFET. It is might that the crystalline quality of surface SiC layers affects the performance of MOSFET. SiC-OI MOSFET is operated successfully for the first time.

AlGaN/GaN Metal-Oxide-Semiconductor Heterostructure Field-Effect Transistors (MOSHFETs) with the Delta-Doped Barrier Layer

2002 ◽  
Vol 743 ◽  
Author(s):  
Z. Y. Fan ◽  
J. Li ◽  
J. Y. Lin ◽  
H. X. Jiang ◽  
Y. Liu ◽  
...  
Keyword(s):  
Metal Oxide ◽  
Field Effect ◽  
Field Effect Transistors ◽  
Cutoff Frequency ◽  
Drain Current ◽  
Metal Oxide Semiconductor ◽  
Oxide Semiconductor ◽  
Semiconductor Heterostructure ◽  
Heterostructure Field Effect Transistors ◽  
Gate Control

ABSTRACTThe fabrication and characterization of AlGaN/GaN metal-oxide-semiconductor heterostructure field-effect transistors (MOSHFETs) with the δ-doped barrier are reported. The incorporation of the SiO2 insulated-gate and the δ-doped barrier into HFET structures reduces the gate leakage and improves the 2D channel carrier mobility. The device has a high drain-current-driving and gate-control capabilities as well as a very high gate-drain breakdown voltage of 200 V, a cutoff frequency of 15 GHz and a maximum frequency of oscillation of 34 GHz for a gate length of 1 μm. These characteristics indicate a great potential of this structure for high-power-microwave applications.

Impact of Ge Content on Flicker Noise Behavior of Strained-SiGe p-Type Metal–Oxide–Semiconductor Field-Effect Transistors

2009 ◽  
Vol 48 (4) ◽  
pp. 04C036 ◽  
Author(s):  
San-Lein Wu ◽  
Chung Yi Wu ◽  
Hau-Yu Lin ◽  
Cheng-Wen Kuo ◽  
Shin-Hsin Chen ◽  
...  
Keyword(s):  
Metal Oxide ◽  
Field Effect ◽  
Flicker Noise ◽  
Field Effect Transistors ◽  
Metal Oxide Semiconductor ◽  
Oxide Semiconductor ◽  
P Type ◽  
Strained Sige
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