Sn-2.5Ag-0.7Cu-0.1Re-xNi Lead-Free Solder Alloy and its Creep Properties of Solder Joints

2010 ◽  
Vol 650 ◽  
pp. 91-96 ◽  
Author(s):  
Ke Ke Zhang ◽  
Yao Li Wang ◽  
Yan Li Fan ◽  
Guo Ji Zhao ◽  
Yan Fu Yan ◽  
...  
Keyword(s):  
Tensile Strength ◽  
Solder Alloy ◽  
Solder Joints ◽  
Rupture Life ◽  
Creep Rupture ◽  
Lead Free ◽  
Lead Free Solder ◽  
Creep Properties ◽  
Lead Free Solder Alloy ◽  
Free Solder

The effects of Ni on the properties of the Sn-2.5Ag-0.7Cu-0.1Re solder alloy and its creep properties of solder joints are researched. The results show that with adding 0.05wt% Ni in the Sn-2.5Ag-0.7Cu-0.1Re solder alloy, the elongation can be sharply improved without decreasing its tensile strength and it is 1.4 times higher than that of the commercial Sn-3.8Ag-0.7Cu solder alloy. Accordingly the creep rupture life of Sn-2.5Ag-0.7Cu-0.1Re-0.05Ni solder joints is the longest, which is 13.3 times longer than that of Sn-2.5Ag-0.7Cu-0.1Re and is also longer than that of the commercial Sn-3.8Ag-0.7Cu solder alloy. In the same environmental conditions, the creep rupture life of Sn-2.5Ag-0.7Cu-0.1Re-0.05Ni solder joints can sharply decrease with increasing the temperature and stress.

Research on Creep Properties of Sn2.5Ag0.7CuXRE Lead-Free Soldered Joints for Surface Mount Technology

2007 ◽  
Vol 353-358 ◽  
pp. 2912-2915 ◽  
Author(s):  
Ke Ke Zhang ◽  
Yao Li Wang ◽  
Yan Li Fan ◽  
Jie Yiang ◽  
Yan Fu Yan ◽  
...  
Keyword(s):  
Rupture Life ◽  
Creep Property ◽  
Creep Rupture ◽  
Lead Free ◽  
Lead Free Solder ◽  
Surface Mount Technology ◽  
Cross Sectional ◽  
Creep Properties ◽  
Surface Mount ◽  
Free Solder

Creep property of solder alloys is one of the important factors to effect the reliability of surface mount technology (SMT) soldered joints. The creep behavior and its rupture life of Sn2.5Ag0.7CuXRE lead-free soldered joints were separately investigated and predicted under constant temperature by a single shear lap creep specimen with a 1mm2 cross sectional area and finite element method (FEM) in this paper. Results show that the creep property of Sn2.5Ag0.7Cu0.1RE is superior to that of the commercial employed lead-free solder Sn3.8Ag0.7Cu and the creep rupture life of its soldered joints is 8.4 times more than that of Sn2.5Ag0.7Cu solder. The creep rupture life of Sn2.5Ag0.7CuXRE lead-free soldered joints indirectly predicted by FEM is better in accord with that of actual testing results, which are important to design the reliability of lead-free soldered joints for SMT.

Creep Properties and Microstructure of the Sn-Ag-Cu-Ni-Ge Lead-Free Solder Alloy

2005 ◽  
Author(s):  
Noboru Hidaka ◽  
Megumi Nagano ◽  
Masayoshi Shimoda ◽  
Hirohiko Watanabe ◽  
Masahiro Ono
Keyword(s):  
Solder Alloy ◽  
Creep Strength ◽  
Aging Treatment ◽  
Lead Free ◽  
Lead Free Solder ◽  
Solder Alloys ◽  
Creep Properties ◽  
Effective Grain Size ◽  
Lead Free Solder Alloy ◽  
Free Solder

A new lead-free solder alloy, Sn-Ag-Cu base adding a small amount of Ni, Ge, has been developed to improve their mechanical properties and prevent oxidation in solder alloys. In this paper, creep properties of two lead-free solder alloys, Sn-3.5Ag-0.5Cu-0.07Ni-0.01Ge (abbr. Sn-3.5Ag-0.5Cu-Ni-Ge) solder and Sn-3.0Ag-0.5Cu solder, were investigated at three temperatures ranging from 313K-398K. It was found that the creep strength of the Sn-3.5Ag-0.5Cu-Ni-Ge solder is higher than that of the Sn-3.0Ag-0.5Cu solder. Especially in the low stress region at 398K, the creep rupture time of the Sn-3.5Ag0.5Cu-Ni-Ge solder is about three times as long as that of the Sn-3.0Ag-0.5Cu solder. The microstructure of these solder alloys show that the addition of Ni was found to refine the effective grain size and provide a fine and uniform distribution of Ag3Sn in the solidified microstructure. The microstructure of the Sn-3.5Ag-0.5Cu-Ni-Ge solder is more stable than that of the Sn-3.0Ag-0.5Cu solder alloy after aging treatment at 398K, 1000 h. TEM observation was also performed, showing that precipitations of (Cu, Ni)6 Sn5, the diameter of which are about 0.5 μm, are distributed in the Ag3Sn/β-Sn phase eutectic area of the Sn-3.5Ag-0.5Cu-Ni-Ge solder after creep test at 398K, 5MPa. It is thought that the precipitations of (Cu, Ni)6 Sn5 contribute to creep strength in the Sn-3.5Ag-0.5Cu-Ni-Ge solder alloy.

A review: Effect of nanoparticles addition on the properties of Sn-Ag-Cu lead free solder alloy

2021 ◽  
Author(s):  
M. N. Ervina Efzan ◽  
M. M. Nur Haslinda ◽  
M. M. Al Bakri Abdullah
Keyword(s):  
Solder Alloy ◽  
Lead Free ◽  
Lead Free Solder ◽  
Lead Free Solder Alloy ◽  
Free Solder

Temperature‐dependent fatigue modelling of a novel Ni, Bi and Sb containing Sn‐3.8Ag‐0.7Cu lead‐free solder alloy

2020 ◽  
Vol 43 (12) ◽  
pp. 2883-2891
Author(s):  
Q.B. Tao ◽  
L. Benabou ◽  
Van Nhat Le ◽  
Ngoc Anh Thi Nguyen ◽  
Hung Nguyen‐Xuan
Keyword(s):  
Solder Alloy ◽  
Lead Free ◽  
Lead Free Solder ◽  
Temperature Dependent ◽  
Lead Free Solder Alloy ◽  
Free Solder

Sn-Mg lead-free solder alloy: Effect of solidification thermal parameters on microstructural features and microhardness

2019 ◽  
Vol 6 (12) ◽  
pp. 126562 ◽  
Author(s):  
Clarissa B da Cruz ◽  
Thiago S Lima ◽  
Thiago A Costa ◽  
Crystopher Brito ◽  
Amauri Garcia ◽  
...  
Keyword(s):  
Solder Alloy ◽  
Thermal Parameters ◽  
Lead Free ◽  
Lead Free Solder ◽  
Alloy Effect ◽  
Lead Free Solder Alloy ◽  
Free Solder

Effect of Cooling Rate on the Microstructural and Mechanical Properties of Sn-0.3Ag-0.7Cu-0.05Ni Solder Alloy

2017 ◽  
Vol 751 ◽  
pp. 9-13
Author(s):  
Kogaew Inkong ◽  
Phairote Sungkhaphaitoon
Keyword(s):  
Mechanical Properties ◽  
Cooling Rate ◽  
Solder Alloy ◽  
Testing Machine ◽  
Optical Microscope ◽  
Lead Free ◽  
Lead Free Solder ◽  
Cooling Systems ◽  
Lead Free Solder Alloy ◽  
Free Solder

The effect of cooling rate on the microstructural and mechanical properties of Sn-0.3Ag-0.7Cu-0.05Ni lead-free solder alloy was studied. The microstructure of specimens was characterized by using an optical microscope (OM) and an energy dispersive X-ray spectroscopy (EDX). The mechanical properties were performed by using a universal testing machine (UTM). The results showed that the cooling rate of water-cooled specimens was about 2.37 °C/s and the cooling rate of mold-cooled specimens was about 0.05 °C/s. To compare the different cooling rates, it was found that the grain size of water-cooled specimens was finer than that of the mold-cooled specimens, this resulted in an increment of mechanical properties of solder alloy. A higher tensile strength (33.10 MPa) and a higher elongation (34%) were observed when water-cooled and mold-cooled systems were used, respectively. The microstructure of Sn-0.3Ag-0.7Cu-0.05Ni lead-free solder alloy solidified by both cooling systems exhibited three phases: β-Sn, Ag3Sn and (Cu,Ni)6Sn5 IMCs.

Effects of Current Stressing and Isothermal Aging on the Tensile Strength of Microscale Lead-Free Solder Joints with Different Joint Volumes

2013 ◽  
Vol 634-638 ◽  
pp. 2800-2803 ◽  
Author(s):  
Li Meng Yin ◽  
Yan Fei Geng ◽  
Zhang Liang Xu ◽  
Song Wei
Keyword(s):  
Tensile Strength ◽  
Current Density ◽  
Isothermal Aging ◽  
Solder Joints ◽  
High Current Density ◽  
Copper Wire ◽  
Lead Free ◽  
Lead Free Solder ◽  
Current Stressing ◽  
Free Solder

Adopting an accurate micro-tensile method based on dynamic mechanical analyzer (DMA) instrument, the tensile strength of three kinds of copper-wire/solder/copper-wire sandwich structured microscale lead-free solder joints that underwent current stressing with a direct current density of 1.0×104 A/cm2 and loading time of 48 hours were investigated, and compared with those solder joints isothermal aged at 100 0C for 48 hours and as-reflowed condition. These three kinds of microscale columnar solder joints have different volumes, i.e., a same diameter of 300 μm but different heights of 100 μm, 200 μm and 300 μm. Experimental results show that both current stressing and isothermal aging degrades the tensile strength of microscale solder joints, and the solder joint with smaller volume obtains higher tensile strength under same test condition. In addition, current stressing induces obvious electromigration (EM) issue under high current density of 1.0×104 A/cm2, resulting in the decreasing of tensile strength and different fracture position, mode and surface morphology of microscale solder joints. The degree of strength degradation increases with the increasing of joint height when keep joint diameter constant, this is mainly due to that electromigration leads to voids form and grow at the interface of cathode, and solder joints with larger volume may contains more soldering defects as well.

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