Thin Film Stress and Texture Analysis at the MCX Synchrotron Radiation Beamline at ELETTRA

2011 ◽  
Vol 681 ◽  
pp. 115-120 ◽  
Author(s):  
Matteo Ortolani ◽  
Cristy Leonor Azanza Ricardo ◽  
Andrea Lausi ◽  
Paolo Scardi

The main instrumental characteristics of MCX, the new beamline at the Italian synchrotron Elettra in Trieste, are presented. Design and geometrical set-up are well suited to the X-ray diffraction stress and texture analysis of thin films and surfaces, and are such to guarantee a full control of the main instrumental errors. Besides exploiting the typical features of synchrotron radiation, like high brilliance, tuneable beam energy and optimal beam geometry, MCX can also host tools for in-situ studies, like X-ray diffraction during four point bending. A few examples of current applications are shown.

2014 ◽  
Vol 996 ◽  
pp. 141-146
Author(s):  
Nicholas Norberg ◽  
Arnold C. Vermeulen

Collecting reliable data is crucial in the research of residual stresses in thin films using X-ray diffraction. The parallel beam geometry has advantage of reliability compared to focusing beam geometry. Though care must be taken to the alignment. A small alignment error may cause a significant error in the stress value. We will show the sensitivity for the misalignment of the parallel beam optics, discuss requirements on hardware alignment and demonstrate a software correction for the presence of remaining hardware errors.


2015 ◽  
Vol 30 (3) ◽  
pp. 694-701 ◽  
Author(s):  
Rita Wiesinger ◽  
Rosie Grayburn ◽  
Mark Dowsett ◽  
Pieter-Jan Sabbe ◽  
Paul Thompson ◽  
...  

In order to study the initial corrosion processes of silver in the presence of corrosive gases in situ time-lapse XRD experiments were performed. The data collected using a newly combined environmental cell/gas flow set up introduces a set of highly useful tools for scientists to study time-lapse gaseous corrosion at ambient temperature and pressure.


1993 ◽  
Vol 318 ◽  
Author(s):  
R. B. Inturi ◽  
M. Chinmulgund ◽  
M. Shamsuzzoha ◽  
J. A. Barnard

ABSTRACTThe effect of laminate geometry and thermal treatment on the microstructural evolution of interfacial reaction products and thin film stress in Al/SiC microlaminates has been investigated by x-ray diffraction, transmission electron and optical microscopy, and thin film stress measurements. Both stress-temperature and stress-time studies are conducted. Crystalline Si of two dimensional ‘dendritic’ morphology is observed as a solid state reaction product at the Al/SiC interface following an anneal at 400 °C. This interfacial reaction is associated with a sharp change in thin film stress in laminates with very thin AI layers to a highly compressive state during isothermal annealing at 400 °C of as-deposited laminates. The change in film stress state is in agreement with the expected larger molar volume of the likely product phases.


Author(s):  
T. Gulik-Krzywicki ◽  
M.J. Costello

Freeze-etching electron microscopy is currently one of the best methods for studying molecular organization of biological materials. Its application, however, is still limited by our imprecise knowledge about the perturbations of the original organization which may occur during quenching and fracturing of the samples and during the replication of fractured surfaces. Although it is well known that the preservation of the molecular organization of biological materials is critically dependent on the rate of freezing of the samples, little information is presently available concerning the nature and the extent of freezing-rate dependent perturbations of the original organizations. In order to obtain this information, we have developed a method based on the comparison of x-ray diffraction patterns of samples before and after freezing, prior to fracturing and replication.Our experimental set-up is shown in Fig. 1. The sample to be quenched is placed on its holder which is then mounted on a small metal holder (O) fixed on a glass capillary (p), whose position is controlled by a micromanipulator.


2021 ◽  
pp. 1-7
Author(s):  
Brian K. Tanner ◽  
Patrick J. McNally ◽  
Andreas N. Danilewsky

X-ray diffraction imaging (XRDI) (topography) measurements of silicon die warpage within fully packaged commercial quad-flat no-lead devices are described. Using synchrotron radiation, it has been shown that the tilt of the lattice planes in the Analog Devices AD9253 die initially falls, but after 100 °C, it rises again. The twist across the die wafer falls linearly with an increase in temperature. At 200 °C, the tilt varies approximately linearly with position, that is, displacement varies quadratically along the die. The warpage is approximately reversible on cooling, suggesting that it has a simple paraboloidal form prior to encapsulation; the complex tilt and twisting result from the polymer setting process. Feasibility studies are reported, which demonstrate that a divergent beam and quasi-monochromatic radiation from a sealed X-ray tube can be used to perform warpage measurements by XRDI in the laboratory. Existing tools have limitations because of the geometry of the X-ray optics, resulting in applicability only to simple warpage structures. The necessary modifications required for use in situations of complex warpage, for example, in multiple die interconnected packages are specified.


2020 ◽  
Vol 117 (25) ◽  
pp. 252905
Author(s):  
Tomohiro Abe ◽  
Sangwook Kim ◽  
Chikako Moriyoshi ◽  
Yuuki Kitanaka ◽  
Yuji Noguchi ◽  
...  

Author(s):  
Mateus Dobecki ◽  
Alexander Poeche ◽  
Walter Reimers

AbstractDespite the ongoing success of understanding the deformation states in sheets manufactured by single-point incremental forming (SPIF), the unawareness of the spatially resolved influence of the forming mechanisms on the residual stress states of incrementally formed sheet metal parts impedes their application-optimized use. In this study, a well-founded experimental proof of the occurring forming mechanisms shear, bending and stretching is presented using spatially resolved, high-energy synchrotron x-ray diffraction-based texture analysis in transmission mode. The measuring method allows even near-surface areas to be examined without any impairment of microstructural influences due to tribological reactions. The depth-resolved texture evolution for different sets of forming parameters offers insights into the forming mechanisms acting in SPIF. Therefore, the forming mechanisms are triggered explicitly by adjusting the vertical step-down increment Δz for groove, plate and truncated cone geometries. The texture analysis reveals that the process parameters and the specimen geometries used lead to characteristic changes in the crystallites’ orientation distribution in the formed parts due to plastic deformation. These forming-induced reorientations of the crystallites could be assigned to the forming mechanisms by means of defined reference states. It was found that for groove, plate and truncated cone geometries, a decreasing magnitude of step-down increments leads to a more pronounced shear deformation, which causes an increasing work hardening especially at the tool contact area of the formed parts. Larger step-down increments, on the other hand, induce a greater bending deformation. The plastic deformation by bending leads to a complex stress field that involves alternating residual tensile stresses on the tool and residual compressive stresses on the tool-averted side incrementally formed sheets. The present study demonstrates the potential of high-energy synchrotron x-ray diffraction for the spatially resolved forming mechanism research in SPIF. Controlling the residual stress states by optimizing the process parameters necessitates knowledge of the fundamental forming mechanism action.


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