Influence of Filler Amount and Content on the Mechanical Performance of Joints Bonded with Metal Powder Filled Adhesive

2013 ◽  
Vol 773-774 ◽  
pp. 226-233
Author(s):  
Nergizhan Kavak ◽  
Erhan Altan

The objective of this study is to investigate the surface roughness that effect the capability of adhesive with adding aluminium powder and 63/37 Sn-Pb soft solder powder to the epoxy to increase the mechanical strength of joints. The adhesive strength of the joints was determined by utilizing the single-lap shear test. As seen from the experiments, the surface roughness has an important effect on the strength of adhesive bonded joints. Experimental results show that joints prepared by adhesive which was modified, adding in the amount of 5 wt% 63/37 Sn-Pb powder have more mechanical strength than joints compared to one which is prepared by adding aluminium powder with different ratios as 5, 25,50 wt%.

2009 ◽  
Vol 13 (9) ◽  
pp. 1073-1082
Author(s):  
Sylvain Chataigner ◽  
Jean-François Caron ◽  
Karim Benzarti ◽  
Marc Quiertant ◽  
Christophe Aubagnac

2011 ◽  
Vol 25 (2) ◽  
pp. 468-478 ◽  
Author(s):  
Sylvain Chataigner ◽  
Jean-Francois Caron ◽  
Karim Benzarti ◽  
Marc Quiertant ◽  
Christophe Aubagnac

2014 ◽  
Vol 611-612 ◽  
pp. 1484-1493 ◽  
Author(s):  
Chiara Mandolfino ◽  
Enrico Lertora ◽  
Carla Gambaro

For an effective application of polymers, it is essential to have good adhesion behaviour to ensure good mechanical properties and durable components. Unfortunately, in general terms, polymers are characterized by high chemical inertness, which leads to very low surface energy values and, consequently, poor adhesive properties; this is particularly true for polyolefins. In this study, the effects of low pressure plasma treatment on surface roughness of polyethylene and polypropylene samples and on shear properties of adhesive bonded joints based on these substrates have been investigated. In particular, the optimization of three plasma process parameters, exposure time, voltage and working gas, were studied performing roughness measurement, contact angle evaluation and lap-shear tests. The experimental results show that the optimized plasma process may remarkably change the surface morphology, increasing wettability properties of the surfaces and shear strength of the bonded joints. These good properties remain almost unchanged even after some days of storage in the laboratory.


2009 ◽  
Vol 33 (6) ◽  
pp. 560-567 ◽  
Author(s):  
Jung-Min Lee ◽  
Chan-Joo Lee ◽  
Dae-Cheol Ko ◽  
Seon-Bong Lee ◽  
Byung-Min Kim

1996 ◽  
Vol 430 ◽  
Author(s):  
Felix L. Paulauskas ◽  
Thomas T. Meek ◽  
C. David Warren

AbstractAdhesive bonding/joining through microwave radiation curing has been evaluated as an alternative processing technology. This technique significantly reduces the required curing time for the adhesive while maintaining equivalent physical characteristics as the adhesive material is polymerized (crosslinked). This results in an improvement in the economics of the process. Testing of samples cured via microwave radiation for evaluation of mechanical properties indicated that the obtained values from the single lap-shear test are in the range of the conventionally cured samples. In general, the ultimate tensile strength, OB, for the microwave processed samples subjected to this single lap-shear test was slightly higher than for conventionally cured samples. This technology shows promise for being applicable to a wide range of high volume, consumer goods industries, where plastics and polymer composites will be processed.


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