Reactive Diffusion between Ti and Cu-9.3Sn-0.3Ti Alloy at Solid-State Temperatures
2011 ◽
Vol 172-174
◽
pp. 470-474
Keyword(s):
The reactive diffusion between Ti and a bronze was experimentally examined using sandwich diffusion couples consisting of Ti and a Cu-9.3Sn-0.3Ti alloy. The diffusion couples were isothermally annealed at temperatures ofT= 923-1023 K. During annealing, CuTi, (Cu, Sn)4Ti3and (Sn, Cu)5Ti6compounds are formed as layers at the interface in the diffusion couple. The overall growth of the compound layers is controlled by volume diffusion atT= 1023 K but by boundary and volume diffusion atT= 923-973 K. Hence, the interface reaction is not the bottleneck for the growth of the compound layers under the present experimental conditions.
2007 ◽
Vol 539-543
◽
pp. 2473-2478
◽
Keyword(s):
2009 ◽
Vol 7
◽
pp. 43-49
◽
1990 ◽
Vol 51
(C4)
◽
pp. C4-121-C4-130
Keyword(s):
2016 ◽
Vol 686
◽
pp. 794-802
◽
Keyword(s):
Keyword(s):