scholarly journals Reliability of High Temperature and Vibration in Sn3.5Ag and Sn0.7Cu Lead-free Solders

2012 ◽  
Vol 19 (3) ◽  
pp. 31-36 ◽  
Author(s):  
Yong-Ho Ko ◽  
Taek-Soo Kim ◽  
Young-Kyu Lee ◽  
Sehoo Yoo ◽  
Chang-Woo Lee
Keyword(s):  
High Temperature ◽  
Lead Free ◽  
Lead Free Solders

Shear Strength and Dsc Analysis of High-Temperature Solders

2013 ◽  
Vol 58 (2) ◽  
pp. 529-533 ◽  
Author(s):  
R. Koleňák ◽  
M. Martinkovič ◽  
M. Koleňáková
Keyword(s):  
Shear Strength ◽  
High Temperature ◽  
Lead Free ◽  
Dsc Analysis ◽  
Ultrasonic Activation ◽  
Metallic Substrates ◽  
Cu Substrate ◽  
Lead Free Solders

The work is devoted to the study of shear strength of soldered joints fabricated by use of high-temperature solders of types Bi-11Ag, Au-20Sn, Sn-5Sb, Zn-4Al, Pb-5Sn, and Pb-10Sn. The shear strength was determined on metallic substrates made of Cu, Ni, and Ag. The strength of joints fabricated by use of flux and that of joints fabricated by use of ultrasonic activation without flux was compared. The obtained results have shown that in case of soldering by use of ultrasound (UT), higher shear strength of soldered joints was achieved with most solders. The highest shear strength by use of UT was achieved with an Au-20Sn joint fabricated on copper, namely up to 195 MPa. The lowest average values were achieved with Pb-based solders (Pb-5Sn and Pb-10Sn). The shear strength values of these solders used on Cu substrate varied from 24 to 27 MPa. DSC analysis was performed to determine the melting interval of lead-free solders.

Interfacial Reactions of Si Die Attachment with Zn-Sn and Au-20Sn High Temperature Lead-Free Solders on Cu Substrates

2009 ◽  
Vol 38 (6) ◽  
pp. 873-883 ◽  
Author(s):  
Seongjun Kim ◽  
Keun-Soo Kim ◽  
Katsuaki Suganuma ◽  
Goro Izuta
Keyword(s):  
High Temperature ◽  
Interfacial Reactions ◽  
Lead Free ◽  
Die Attachment ◽  
Cu Substrates ◽  
Lead Free Solders

Microstructure and Sn Crystal Orientation Evolution in Sn-3.5Ag Lead-Free Solders in High-Temperature Packaging Applications

2013 ◽  
Vol 43 (1) ◽  
pp. 57-68 ◽  
Author(s):  
Bite Zhou ◽  
Govindarajan Muralidharan ◽  
Kanth Kurumadalli ◽  
Chad M. Parish ◽  
Scott Leslie ◽  
...  
Keyword(s):  
High Temperature ◽  
Crystal Orientation ◽  
Lead Free ◽  
Sn Crystal Orientation ◽  
Lead Free Solders

Development of Zn-Al-x Ni Lead-Free Solders for High-Temperature Applications

2019 ◽  
pp. 115-133
Author(s):  
Sanjoy Mallick ◽  
Md Sharear Kabir ◽  
Ahmed Sharif
Keyword(s):  
High Temperature ◽  
Lead Free ◽  
Lead Free Solders ◽  
Temperature Applications

Formation and Mechanical Properties of Intermetallic Compounds in Sn-Cu High-Temperature Lead-Free Solder Joints

2010 ◽  
Vol 654-656 ◽  
pp. 2450-2454 ◽  
Author(s):  
De Kui Mu ◽  
Hideaki Tsukamoto ◽  
Han Huang ◽  
Kazuhiro Nogita
Keyword(s):  
Mechanical Properties ◽  
High Temperature ◽  
Intermetallic Compounds ◽  
Solder Joints ◽  
Nickel Content ◽  
Lead Free ◽  
Lead Free Solder ◽  
Nickel Addition ◽  
Free Solder ◽  
Lead Free Solders

High-temperature lead-free solders are important materials for electrical and electronic devices due to increasing legislative requirements that aim at reducing the use of traditional lead-based solders. For the successful use of lead-free solders, a comprehensive understanding of the formation and mechanical properties of Intermetallic Compounds (IMCs) that form in the vicinity of the solder-substrate interface is essential. In this work, the effect of nickel addition on the formation and mechanical properties of Cu6Sn5 IMCs in Sn-Cu high-temperature lead-free solder joints was investigated using Scanning Electron Microscopy (SEM) and nanoindentation. It was found that the nickel addition increased the elastic modulus and hardness of the (Cu, Ni)6Sn5. The relationship between the nickel content and the mechanical properties of the IMCs was also established.

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