Packaging Induced Die Stress Characterization Using van der Pauw Sensors Between −180°C and 80°C
2014 ◽
Vol 2014
(1)
◽
pp. 000483-000487
Keyword(s):
Packaging-induced die-stresses due to temperature effects on various materials of the package are characterized using piezoresistive van der Pauw stress sensors over a temperature range of −180° C to 80° C. Piezo-resistive coefficients extracted previously are then used to obtain a mapping between change in resistance and corresponding stress at all tested temperatures. The obtained values of stress are compared with finite element simulation results.
2021 ◽
Vol 263
(6)
◽
pp. 648-652
2019 ◽
Vol 30
(5)
◽
pp. 764-777
◽
2020 ◽
Vol 12
(5)
◽
pp. 168781402092205
2014 ◽
Vol 678
◽
pp. 551-555
Keyword(s):
2021 ◽