Effect of Interlaminar Stresses on Crush Behavior of Composite Structures

1992 ◽  
Author(s):  
Hikmat F. Mahmood ◽  
Jianhua Zhou
2005 ◽  
Vol 128 (3) ◽  
pp. 383-392 ◽  
Author(s):  
Brajabandhu Pradhan ◽  
Saroja Kanta Panda

The present study encompasses the thermoelastic effect of material anisotropy and curing stresses on interlaminar embedded elliptical delamination fracture characteristics in multiply laminated fiber-reinforced polymeric (FRP) composites. Two sets of full three-dimensional finite element analyses have been performed to calculate the displacements and interlaminar stresses along the delaminated interface responsible for the delamination onset and propagation. Modified crack closure integral methods based on the concepts of linear elastic fracture mechanics have been followed to evaluate the individual modes of strain energy release rates along the delamination front. It is shown that the individual modes of energy release rates vary along the delamination front depending on the ply sequence, orientation, and thermoelastic material anisotropy of the constituting laminae. This causes the anisotropic and non-self similar delamination propagation along the interface. The asymmetric and nonuniform variations in the nature of energy release rate plots obtained in a thermomechanical loading environment are significant when curing stress effects are included in the numerical analysis and hence should be taken into account in the designs of laminated FRP composite structures.


Mathematics ◽  
2022 ◽  
Vol 10 (2) ◽  
pp. 268
Author(s):  
Salman Khalid ◽  
Jaehun Lee ◽  
Heung Soo Kim

This paper introduces a new loading condition considering the combined thermo-electro-mechanical coupling effect in a series solution-based approach to analyze the free-edge interlaminar stresses in smart composite laminates. The governing equations are developed using the principle of complementary virtual work. The assumed stress fields satisfy the traction-free and free-edge boundary conditions. The accurate stress states of the composite structures are acquired through the procedure of generalized eigenvalue problems. The uniform temperature is employed throughout the laminate, and the electric field loading is applied to the symmetric piezo-bonded actuators to examine the combined effect of thermal and electrical stresses on the overall deformation of smart composite laminates. It was observed that the magnitude of the peeling stresses generated by mechanical loading was reduced by the combined thermal and electric excitation loading (up to 25.3%), which in turn resulted in expanding the service life of the smart composite structures. The proposed approach is implemented on three different layup configurations. The efficiency of the current methodology is confirmed by comparing the results with the 3D finite element (FEM) solution computed by ABAQUS.


2015 ◽  
Vol 07 (05) ◽  
pp. 1550067 ◽  
Author(s):  
G. Lampeas ◽  
K. Fotopoulos

The innovative stacked-shell modeling approach is investigated in the frame of an explicit finite element method for the prediction of laminated structural elements' static response, focusing on the interlaminar stress calculation. The main advantage of the investigated stacked-shell modeling technique is the lower computational cost compared to conventional methods, for the same accuracy in displacement and stress results. A laminated plate under sinusoidally distributed transverse loading, a laminated strip under three-point bending and a laminated cylindrical shell under cylindrical bending have been used in the assessment of the developed methodology; static results referring to displacement and both in-plane and out-of-plane stresses of the investigated cases have shown that the proposed technique is highly efficient in the calculation of interlaminar stresses of composite structures, which provides the background for an accurate and efficient delamination prediction.


Author(s):  
Frances M. Ross ◽  
Peter C. Searson

Porous semiconductors represent a relatively new class of materials formed by the selective etching of a single or polycrystalline substrate. Although porous silicon has received considerable attention due to its novel optical properties1, porous layers can be formed in other semiconductors such as GaAs and GaP. These materials are characterised by very high surface area and by electrical, optical and chemical properties that may differ considerably from bulk. The properties depend on the pore morphology, which can be controlled by adjusting the processing conditions and the dopant concentration. A number of novel structures can be fabricated using selective etching. For example, self-supporting membranes can be made by growing pores through a wafer, films with modulated pore structure can be fabricated by varying the applied potential during growth, composite structures can be prepared by depositing a second phase into the pores and silicon-on-insulator structures can be formed by oxidising a buried porous layer. In all these applications the ability to grow nanostructures controllably is critical.


2019 ◽  
Author(s):  
Curtis Hickmott ◽  
Alireza Forghani ◽  
Victoria Hutten ◽  
Evan Lorbiecki ◽  
Frank Palmieri ◽  
...  

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