Chip Detector, Electrical Connection, Remote Indicating

2021 ◽  
Author(s):  
Keyword(s):  
Electrical Connection

Anode basket with submerged electrical connection

1998 ◽  
Vol 96 (11) ◽  
pp. 115-116
Keyword(s):  
Electrical Connection

scholarly journals Study on the Stability of the Electrical Connection of High-Temperature Pressure Sensor Based on the Piezoresistive Effect of P-Type SiC

Micromachines ◽  
2021 ◽  
Vol 12 (2) ◽  
pp. 216
Author(s):  
Yongwei Li ◽  
Ting Liang ◽  
Cheng Lei ◽  
Qiang Li ◽  
Zhiqiang Li ◽  
...  
Keyword(s):  
High Temperature ◽  
Pressure Sensor ◽  
Pressure Sensors ◽  
Extreme Environment ◽  
Maximum Temperature ◽  
Piezoresistive Effect ◽  
Electrical Connection ◽  
Contact Stability ◽  
The Stability ◽  
P Type

In this study, a preparation method for the high-temperature pressure sensor based on the piezoresistive effect of p-type SiC is presented. The varistor with a positive trapezoidal shape was designed and etched innovatively to improve the contact stability between the metal and SiC varistor. Additionally, the excellent ohmic contact was formed by annealing at 950 °C between Ni/Al/Ni/Au and p-type SiC with a doping concentration of 1018cm−3. The aging sensor was tested for varistors in the air of 25 °C–600 °C. The resistance value of the varistors initially decreased and then increased with the increase of temperature and reached the minimum at ~450 °C. It could be calculated that the varistors at ~100 °C exhibited the maximum temperature coefficient of resistance (TCR) of ~−0.35%/°C. The above results indicated that the sensor had a stable electrical connection in the air environment of ≤600 °C. Finally, the encapsulated sensor was subjected to pressure/depressure tests at room temperature. The test results revealed that the sensor output sensitivity was approximately 1.09 mV/V/bar, which is better than other SiC pressure sensors. This study has a great significance for the test of mechanical parameters under the extreme environment of 600 °C.

Localized Acoustic-Event Measurement Probe: Connector Confirmation Utilizing Acoustic Signatures

2020 ◽  
Author(s):  
Brian Skoglind ◽  
Travis Roberts ◽  
Sourabh Karmakar ◽  
Cameron Turner ◽  
Laine Mears
Keyword(s):  
Background Noise ◽  
Signal To Noise Ratio ◽  
Detection Algorithm ◽  
Consumer Products ◽  
Noise Mitigation ◽  
Acoustic Event ◽  
Electrical Connection ◽  
Acoustic Signatures ◽  
Electrical Connector ◽  
Electrical Connections

Abstract Electrical connections in consumer products are typically made manually rather than through automated assembly systems due to the high variety of connector types and connector positions, and the soft flexible nature of their structures. Manual connections are prone to failure through missed or improper connections in the assembly process and can lead to unexpected downtime and expensive rework. Past approaches for registering connection success such as vision verification or Augmented Reality have shown limited ability to verify correct connection state. However, the feasibility of an acoustic-based verification system for electrical connector confirmation has not been extensively researched. One of the major problems preventing acoustic based verification in a manufacturing or assembly environment is the typically low signal to noise ratio (SNR) between the sound of an electrical connection and the diverse soundscape of the plant. In this study, a physical means of background noise mitigation and signature amplification are investigated in order to increase the SNR between the electrical connection and the plant soundscape in order to improve detection. The concept is that an increase in the SNR will lead to an improvement in the accuracy and robustness of an acoustic event detection and classification system. Digital filtering has been used in the past to deal with low SNRs, however, it runs the risk of filtering out potential important features for classification. A sensor platform is designed to filter out and reduce background noise from the plant without effecting the raw acoustic signal of the electrical connection, and an automated detection algorithm is presented. The solution is over 75% effective at detecting and classifying connections.

A Compact, Low Resistance, Low Force Electrical Connection for High Current Applications

1984 ◽  
Vol PER-4 (10) ◽  
pp. 57-58
Author(s):  
S. E. Allen
Keyword(s):  
High Current ◽  
Low Resistance ◽  
Electrical Connection

scholarly journals INFLUENCE OF ELECTRICAL CONNECTION BETWEEN METAL ELECTRODES ON CONTIGUOUS SOLUTE-FREE ZONES

2013 ◽  
Vol 4 (1) ◽  
Author(s):  
Binghua Chai ◽  
Amrita G. Mahtani ◽  
Gerald H. Pollack
Keyword(s):  
Metal Surfaces ◽  
Aqueous Media ◽  
Exclusion Zone ◽  
Metal Electrodes ◽  
Electrical Connection ◽  
Underlying Mechanisms

Earlier, we reported solute-free “exclusion zones” in aqueous media next to various metal surfaces. Here we explore the effect of connecting zinc, which ordinarily shows a large exclusion zone, to platinum, which ordinarily does not. We found the connecting the two metals diminished the exclusion zone next to zinc, while it increased the exclusion zone next to platinum. Disconnecting resulted in return to control values. These effects were largest when the metals were juxtaposed relatively closely, and became smaller with increasing separation. The underlying mechanisms are considered.

Electrical Connection of Native and Transplanted Sinus Nodes Via Atrial to Atrial Pacing Improves Exercise Performance After Cardiac Transplantation

1998 ◽  
Vol 81 (11) ◽  
pp. 1373-1377 ◽  
Author(s):  
Ainat Beniaminovitz ◽  
James Coromilas ◽  
Mehmet Oz ◽  
Mark Galantowicz ◽  
Lisa Donchez ◽  
...  
Keyword(s):  
Exercise Performance ◽  
Cardiac Transplantation ◽  
Atrial Pacing ◽  
Electrical Connection

Reliability Evaluation of Main Electrical Connection for the Smart Substation with DCB

2014 ◽  
Vol 521 ◽  
pp. 453-456
Author(s):  
Yang Qi Huang ◽  
Jian Hua Zhang ◽  
Xin Yi Lu ◽  
Nian Liu
Keyword(s):  
Smart Grid ◽  
Research And Development ◽  
Reliability Evaluation ◽  
Design Concept ◽  
Electrical Connection ◽  
Minimal Cut Set ◽  
Execution Unit ◽  
Cut Set ◽  
New Generation ◽  
Smart Substation

As an important part of smart grid, smart substation is the acquisition source of operating data and command execution unit, and also acts as the important foundation and support of smart grid. With the continuous deepening of smart substation construction in State Grid Corporation, the overall integration design concept of the new generation smart substation based on research and development of new equipment has been put forward, realizing the main electrical connection optimization and improvement of reliability .Concerning the characteristic and application of DCB in smart substation, reliability of three kinds of typical main electrical connection schemes in existing substation and smart substation is calculated by the minimal cut-set method in this paper.

Active and Passive Devices Embedded in Laminate-Based Multilayer Board

2012 ◽  
Vol 2012 (DPC) ◽  
pp. 001253-001283
Author(s):  
Satoshi Okude ◽  
Kazushisa Itoi ◽  
Masahiro Okamoto ◽  
Nobuki Ueta ◽  
Osamu Nakao
Keyword(s):  
High Temperature ◽  
Thermal Cycling ◽  
Flip Chip ◽  
Wafer Level ◽  
Active Device ◽  
Electrical Connection ◽  
Passive Devices ◽  
High Temperature Storage ◽  
Circuit Resistance ◽  
Temperature Storage

We have developed active and passive devices embedded multilayer board utilizing our laminate-based WLCSP embedding technology. The proposed embedded board is realized by laminating plural circuit formed polyimide films together by adhesive with thin devices being arranged in between those polyimide layers. The electrical connection via has a filled via structure composed of the alloy forming conductive paste which ensures high reliable connection. The embedded active device is WLCSP which has no solder bump on its pads therefore the thickness of the die is reduced to 80 microns. The embedded passive device is a chip resistor or capacitor whose thickness is 150 microns with copper electrodes. The electrical connection between components and board's circuits are made by same conductive paste vias. The thin film based structure and low profile devices yields the 260 microns thickness board which is the thinnest embedded of its kind in the world. To confirm the reliability of the embedded board, we have performed several reliability tests on the WLCSP and resistors embedded TEG board of 4 polyimide/5 copper circuit layers. As environmental tests, we performed a moisture reflow test compliant to JEDEC MSL2 followed by a thermal cycling test (−55 deg.C to 125 deg.C, 1000cycles) and a high temperature storage test (150 deg.C). All tested samples passed the moisture reflow test and showed no significant change of circuit resistance after the thermal cycling/high temperature storage tests. Moreover, mechanical durability of the board was also confirmed by bending the devices embedded portion. The embedded device was never broken and the circuit resistance change was also within acceptable range. The proposed embedded board will open up a new field of device packaging. Alan/Rey ok move from Flip Chip and Wafer Level Packaging 1-3-12.

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