Reproducible Chemical Mechanical Polishing Characteristics of Shallow Trench Isolation Structure using High Selectivity Slurry

2002 ◽  
Vol 3 (4) ◽  
pp. 5-9
Author(s):  
So-Young Jeong ◽  
Yong-Jin Seo ◽  
Sang-Yong Kim
Keyword(s):  
Chemical Mechanical Polishing ◽  
High Selectivity ◽  
Mechanical Polishing ◽  
Shallow Trench Isolation ◽  
Trench Isolation

Effects of underlying films on the chemical-mechanical polishing for shallow trench isolation technology

1997 ◽  
Vol 308-309 ◽  
pp. 543-549 ◽  
Author(s):  
Y.-L Wang ◽  
C Liu ◽  
M.-S Feng ◽  
Jowei Dun ◽  
K.-S Chou
Keyword(s):  
Chemical Mechanical Polishing ◽  
Mechanical Polishing ◽  
Shallow Trench Isolation ◽  
Trench Isolation

Colloidal Silica based High Selectivity Shallow Trench Isolation (STI) Chemical Mechanical Polishing (CMP) Slurry

2005 ◽  
Vol 867 ◽  
Author(s):  
Kyoung-Ho Bu ◽  
Brij M. Moudgil
Keyword(s):  
Silicon Nitride ◽  
Chemical Mechanical Polishing ◽  
Colloidal Silica ◽  
Sodium Dodecyl ◽  
Mechanical Polishing ◽  
Wafer Surface ◽  
Shallow Trench Isolation ◽  
Pattern Size ◽  
Trench Isolation ◽  
Silica Slurry

AbstractAmong various properties of chemical mechanical polishing (CMP) slurry, selectivity plays a key role in global planarization of high density and small pattern size shallow trench isolation (STI) process. Lack of adequate selectivity can lead to defects such as dishing and erosion. To improve the selectivity of STI CMP process, CMP characteristics of silica and silicon nitride wafer were investigated using colloidal silica slurry as a function of slurry pH. Sodium dodecyl sulfate (SDS), an anionic surfactant, was added to increase the selectivity of the slurry. As a result, selectivity increased from 3 to 25. It was concluded that selective passivation layer formed on silicon nitride wafer surface at acidic slurry pH range was responsible for the observed selectivity increase. Adsorption characteristics of SDS on silica and silicon nitride were measured as a function of slurry pH and concentration of SDS. As indicated by zeta potential behavior under acidic pH conditions, SDS adsorption on silicon nitride was significantly higher han silica due to the electrostatic forces. Significantly higher SDS coating on silicone nitride seems to have resulted in lubrication layer leading to increased polishing selectivity.

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