Defect detection strategies for chemical-mechanical polishing process in shallow-trench isolation applications

Mechanical Polishing ◽

Polishing Process ◽

Trench Isolation ◽

Chemical Mechanical Polishing Process ◽

Detection Strategies

IEEE/SEMI 1998 IEEE/SEMI Advanced Semiconductor Manufacturing Conference and Workshop (Cat. No.98CH36168) ◽

Control methods for the chemical-mechanical polishing process in shallow trench isolation

10.1109/asmc.1998.731396 ◽

2002 ◽

Cited By ~ 2

Author(s):

Y. Wu ◽

J. Gilhooly ◽

B. Philips

Keyword(s):

Mechanical Polishing ◽

Control Methods ◽

Polishing Process ◽

Trench Isolation ◽

Control of Microscratches in Chemical-Mechanical Polishing Process for Shallow Trench Isolation

10.1143/jjap.37.5849 ◽

1998 ◽

Vol 37 (Part 1, No. 11) ◽

pp. 5849-5853 ◽

Cited By ~ 10

Author(s):

Heungsoo Park ◽

Kwang-Bok Kim ◽

Chang-Ki Hong ◽

U-In Chung ◽

Moon-Yong Lee

Keyword(s):

Mechanical Polishing ◽

Polishing Process ◽

Trench Isolation ◽

Application of Double Polishing Pad for Shallow Trench Isolation Chemical Mechanical Polishing Process

10.7567/ssdm.2006.p-2-5 ◽

2006 ◽

Author(s):

Yong-Jin Seo ◽

Sung-Woo Park

Keyword(s):

Mechanical Polishing ◽

Polishing Process ◽

Polishing Pad ◽

Trench Isolation ◽

Motor-Current-Based Real-Time End Point Detection of Shallow-Trench-Isolation Chemical Mechanical Polishing Process Using High-Selectivity Slurry

10.1143/jjap.42.6396 ◽

2003 ◽

Vol 42 (Part 1, No. 10) ◽

pp. 6396-6399 ◽

Cited By ~ 15

Author(s):

Yong-Jin Seo ◽

Woo-Sun Lee ◽

Jin-Seong Park ◽

Sang-Yong Kim

Keyword(s):

Real Time ◽

High Selectivity ◽

Polishing Process ◽

Motor Current ◽

Trench Isolation ◽

Chemical Mechanical Polishing Process ◽

End Point Detection ◽

Point Detection

Journal of Vacuum Science & Technology B Microelectronics and Nanometer Structures Processing Measurement and Phenomena ◽

Effect of temperature on copper damascene chemical mechanical polishing process

10.1116/1.2825143 ◽

2008 ◽

Vol 26 (1) ◽

pp. 141 ◽

Cited By ~ 13

Author(s):

Veera Raghava Kakireddy ◽

Subrahmanya Mudhivarthi ◽

Ashok Kumar

Keyword(s):

Mechanical Polishing ◽

Effect Of Temperature ◽

Polishing Process ◽

Integrated Tungsten Chemical Mechanical Polishing Process Characterization for Via Plug Interconnection in Ultralarge Scale Integrated Circuits

10.1143/jjap.41.5120 ◽

2002 ◽

Vol 41 (Part 1, No. 8) ◽

pp. 5120-5124 ◽

Cited By ~ 5

Author(s):

Chin-Kun Wang ◽

Hua-Shu Wu ◽

Nai-Tien Ou ◽

Huang-Chung Cheng

Keyword(s):

Integrated Circuits ◽

Mechanical Polishing ◽

Polishing Process ◽

Process Characterization ◽

Characterization of a New Cleaning Method Using Electrolytic Ionized Water for Polysilicon Chemical Mechanical Polishing Process

10.1143/jjap.41.5098 ◽

2002 ◽

Vol 41 (Part 1, No. 8) ◽

pp. 5098-5103 ◽

Cited By ~ 6

Author(s):

Naoto Miyashita ◽

Shin-ichiro Uekusa ◽

Hiroshi Katumata

Keyword(s):

Mechanical Polishing ◽

Polishing Process ◽

Cleaning Method ◽

Applications of Taguchi and design of experiments methods in optimization of chemical mechanical polishing process parameters

The International Journal of Advanced Manufacturing Technology ◽

10.1007/s00170-007-1124-7 ◽

2007 ◽

Vol 38 (7-8) ◽

pp. 674-682 ◽

Cited By ~ 36

Author(s):

Hsin-Te Liao ◽

Jie-Ren Shie ◽

Yung-Kuang Yang

Keyword(s):

Design Of Experiments ◽

Process Parameters ◽

Mechanical Polishing ◽

Polishing Process ◽

Journal of Vacuum Science & Technology B Microelectronics Processing and Phenomena ◽

Chemical mechanical polishing of shallow trench isolation using the ceria-based high selectivity slurry for sub-0.18 μm complementary metal–oxide–semiconductor fabrication

10.1116/1.1475984 ◽

2002 ◽

Vol 20 (3) ◽

pp. 918 ◽

Cited By ~ 18

Author(s):

Sam-Dong Kim ◽

In-Seok Hwang ◽

Hyung-Moo Park ◽

Jin-Koo Rhee ◽

Chul-Woo Nam

Keyword(s):

Metal Oxide ◽

High Selectivity ◽

Complementary Metal Oxide Semiconductor ◽

Metal Oxide Semiconductor ◽

Mechanical Polishing ◽

Oxide Semiconductor ◽

Trench Isolation ◽

Semiconductor Fabrication

Ultrafiltration based on various polymeric membranes for recovery of spent tungsten slurry for reuse in chemical mechanical polishing process

Journal of Membrane Science ◽

10.1016/j.memsci.2017.11.034 ◽

2018 ◽

Vol 548 ◽

pp. 232-238 ◽

Cited By ~ 2

Author(s):

Nur Fatin Amalina Muhammad Sanusi ◽

Mohd Hizami Mohd Yusoff ◽

Ooi Boon Seng ◽

Mohd Sabirin Marzuki ◽

Ahmad Zuhairi Abdullah

Keyword(s):

Polymeric Membranes ◽

Mechanical Polishing ◽

Polishing Process ◽