Chemical mechanical polishing of shallow trench isolation using the ceria-based high selectivity slurry for sub-0.18 μm complementary metal–oxide–semiconductor fabrication

Author(s):  
Sam-Dong Kim ◽  
In-Seok Hwang ◽  
Hyung-Moo Park ◽  
Jin-Koo Rhee ◽  
Chul-Woo Nam
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