Chemical mechanical polishing of shallow trench isolation using the ceria-based high selectivity slurry for sub-0.18 μm complementary metal–oxide–semiconductor fabrication
2002 ◽
Vol 20
(3)
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pp. 918
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2010 ◽
Vol 28
(2)
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pp. 391-397
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2001 ◽
Vol 4
(11)
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pp. G88
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1997 ◽
Vol 15
(6)
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pp. 1936
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1999 ◽
Vol 38
(Part 1, No. 4B)
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pp. 2232-2237
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2011 ◽
Vol 50
(4S)
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pp. 04DC21
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2003 ◽
Vol 21
(1)
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pp. 500
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2002 ◽
Vol 3
(4)
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pp. 5-9