Countries have Accumulated Experience in Combating COVID 19 to Build System of Effective Neutralization

The aging is not only a personal but also a social challenge from several aspects, several dimensions; a challenge aiming to build system approaches and solutions with a long term importance. Aims: the main aim of this research is to investigate the conditions and challenges in the modern living of the old people, primarily in terms of the social care. However, this research is concentrated on a big group of the population and their challenges are the most intensive in the modern living. The investigation of the conditions and challenges in the aging are basis and encouragement in realizing the progressive approaches in order to improve the modern living of the old people. The practical aim of the research is a deep investigation and finding important data, analyzing the basic indicators of the conditions, needs and challenges in order to facilitate the old population to get ready for the new life. Methods and techniques: Taking into consideration the complexity of the research problem, the basic methodological approach is performed dominantly by descriptive-analytical method. The basic instrument for getting data in the research is the questionnaire with leading interview for the old people. Results: The research showed that the old people over 70-79 years old in a bigger percentage manifested difficulties primarily related to the functional dependency, respectively 39,33 % of the participants in this category showed concern about some specific functional dependency from the offered categories. The percentage of the stomach diseases with 38,33 % is important, as well as the kidney diseases with 32,83% related to the total population and the category of the old people over 80. Conclusion: The old people very often accept the life as it is, often finding things fulfilled with tolerance and satisfaction. However the health problems of the old people are characterized with a dominant representation. The chronic diseases and the diseases characteristic for the aging are challenge in organizing adequate protection which addresses to taking appropriate regulations, programs and activities.

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The BRL-CAD CMake Build System - An Overview

10.21236/ada587400 ◽

2013 ◽

Author(s):

Clifford W. Yapp

Keyword(s):

Build System

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Building an Integrated Development Environment (IDE) on top of a Build System

IFL 2020: Proceedings of the 32nd Symposium on Implementation and Application of Functional Languages ◽

10.1145/3462172.3462180 ◽

2020 ◽

Author(s):

Neil Mitchell ◽

Moritz Kiefer ◽

Pepe Iborra ◽

Luke Lau ◽

Zubin Duggal ◽

...

Keyword(s):

Integrated Development Environment ◽

Development Environment ◽

Integrated Development ◽

Build System

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Stacking of Known Good Rebuilt Wafers without TSV - Applications to Memories and SiP

Additional Conferences (Device Packaging HiTEC HiTEN & CICMT) ◽

10.4071/2010dpc-tha12 ◽

2010 ◽

Vol 2010 (DPC) ◽

pp. 002020-002074

Author(s):

Christian Val ◽

Pascal Couderc ◽

Pierre Lartigues

Keyword(s):

Reduction Factor ◽

Wafer Level ◽

Aircraft Structure ◽

Adhesive Film ◽

Chemical Plating ◽

Direct Laser ◽

European Program ◽

Development Agreement ◽

Low Costs ◽

Build System

The 3-D interconnection started at 3D PLUS in 1996 and led to the stacking of nearly all types of analogical and logical components, sensors, MEMS, etc for the Hi-Rel field (Space, Defence, Medical, Industrial). This technology is extremely robust (−130°C +175°C, 40000g), and is fully qualified by all worldwide most important Space Agencies and for Defence applications. A technological break started in 2002 ; It consisted in another 20 to 30 reduction factor of the weight and volume of these 3-D modules.The Z pitch is 100μm and the X Y size is given by the size of the larger die plus 100μm of polymer around it. This is a stacked of Known Good Rebuilt Wafer of full wafer level technique. The dice are received in wafers and following operations are carried out :- Pick, flip and place of the good dice on a “sticking skin”- Moulding of the whole of this « pseudo wafer » in order to obtain what we call a « Known Good Rebuilt Wafer (KGRW) ». These two first steps are already developed by Infineon and mainly Freescale (RCP technique up to 300mm)- Stacking and gluing of KGRW 1, 2, 3…, n, by means of an adhesive film- Dicing of these stacked rebuilt wafers by techniques identical to the dicing of standard wafers- Metallization of the dicing streets with nickel + gold by electroless chemical plating identical to the UBM plating technique- Direct laser patterning by laser with our edge connection technique up to 100μm pitch. Below this pitch, the Thru Polymer Via (TPV) are made through the stacked wafers. The equivalent pitch will be 20μm. it can be noticed that the shielding can be made on the dicing street.- Electrical test at the stacked wafer level- Singulation of the 3D modules This approach allows using standard dice without any modification. It is multi sources and the stacking of the good rebuilt wafers allows to get an excellent yield. A development agreement has been signed with a semiconductors manufacturer. A development is in progress with the most worldwide important manufacturer of smart cards in order to integrate 5 levels of dice (including a MEMS) within a cavity of 550 μm inside the 800μm SIM card. Other applications with MEMS will be presented:- “Abandoned Sensors” for Heath Monitoring of the aircraft structure developed during the European Program: “e-Cubes” ,- Gyroscope with 6 MEMS,- Micro camera for endoscopy…- Medical applications with an important development made for 3 major pacemaker manufacturers. This « full wafer level » approach will allow to build System in Package (SiP) or “Abandoned Sensors” at very low costs, since the process uses mainly the steps of wafers building; the “panelization” allows to be in parallel processing from A to Z steps. Moreover, the use of Known Good Rebuilt Wafer like the RCP allows stacking Good wafer at the reverse what is impossible with the wafer to wafer approach.

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Stacking of Known Good Rebuilt Wafers without TSV - Industrial Applications

Additional Conferences (Device Packaging HiTEC HiTEN & CICMT) ◽

10.4071/2011dpc-tp36 ◽

2011 ◽

Vol 2011 (DPC) ◽

pp. 001126-001174

Author(s):

Christian Val ◽

Pascal Couderc ◽

Nadia Boulay

Keyword(s):

Industrial Applications ◽

Reduction Factor ◽

Wafer Level ◽

Adhesive Film ◽

Chemical Plating ◽

Direct Laser ◽

D Modules ◽

Development Agreement ◽

Low Costs ◽

Build System

The 3-D interconnection started at 3D PLUS in 1996 and led to the stacking of nearly all types of analogical and logical components, sensors, MEMS, etc for the Hi-Rel field (Space, Defence, Medical, Industrial). This technology is extremely robust (−130 °C +175 °C, 40000g), and is fully qualified by all worldwide most important Space Agencies, for Defence applications and Harsh environment. A technological break started in 2002 ; it consisted in another 20 to 30 reduction factor of the weight and volume of these 3-D modules. The Z pitch is 100 μm and the X Y size is given by the size of the larger die plus 100 μm of polymer around it. This is a stacked of Known Good Rebuilt Wafer of full wafer level technique. The dice are received in wafers and following operations are carried out :- Pick, flip and place of the good dice on a “sticking skin”- Moulding of the whole of this « pseudo wafer » in order to obtain what we call a « Known Good Rebuilt Wafer (KGRW) ». These two first steps are already developed by Freescale (RCP technique up to 300mm), then Infineon and Nanium (ex Infineon/Quimoda) and now about ten companies are developing this 2-D approach:- Stacking and gluing of KGRW 1, 2, 3..., n, by means of an adhesive film- Dicing of these stacked rebuilt wafers by techniques identical to the dicing of standard wafers- Metallization of the dicing streets with nickel + gold by electroless chemical plating identical to the UBM plating technique- Direct laser patterning by laser with our edge connection technique up to 100 μm pitch. Below this pitch, the Thru Polymer Via (TPV) are made through the stacked wafers. The equivalent pitch will be 20 μm. it can be noticed that the shielding can be made on the dicing street.- Electrical test at the stacked wafer level- Singulation This approach allows to use standard dice without any modification. It is multi sources and the stacking of the good rebuilt wafers allows to obtain an excellent yield. A development agreement has been signed with a semiconductors manufacturer. Smart card application- A development is in progress with the most worldwide important manufacturer of smart cards in order to integrate 5 levels of dice within a cavity of 550 μm inside the 800 μm SIM card. Medical applications will be presented:- Micro modulator with 5 ASICs within a 3 mm diameter tube,- Prototypes for the major US pacemaker manufacturer (Medtronic) and one European pacemaker manufacturer (Sorin/Ela Medical). A full pacemaker module of 0,5 cm3 (16 times smaller than the standard pacemaker: 8 cm3) will be shown- Micro camera for Hard X-Ray for Philips Medical (DE). Industrial applications- Abandoned sensors for Airbus and industrial areas. This « full wafer level » approach will allow to build System in Package (SiP) or “Abandoned Sensors” at very low costs, since the process uses mainly the steps of wafers building; the “panelization” allows to be in parallel processing from A to Z steps. Moreover, the use of Known Good Rebuilt Wafer like the RCP allows to stack Good wafer at the reverse what is impossible with the wafer to wafer approach.

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Extending ROOT through Modules

EPJ Web of Conferences ◽

10.1051/epjconf/201921405011 ◽

2019 ◽

Vol 214 ◽

pp. 05011

Author(s):

Oksana Shadura ◽

Brian Paul Bockelman ◽

Vassil Vassilev

Keyword(s):

Object Oriented ◽

Software Framework ◽

Software Ecosystem ◽

User Community ◽

Runtime Environment ◽

Build Time ◽

Build System

The ROOT software framework is foundational for the HEP ecosystem, providing multiple capabilities such as I/O, a C++ interpreter, GUI, and math libraries. It uses object-oriented concepts and build-time components to layer between them. We believe that a new layering formalism will benefit the ROOT user community. We present the modularization strategy for ROOT which aims to build upon the existing source components, making available the dependencies and other metadata outside of the build system, and allow post-install additions on top of existing installation as well as in the ROOT runtime environment. Components can be grouped into packages and made available from repositories in order to provide a post-install step of missing packages. This feature implements a mechanism for the more comprehensive software ecosystem and makes it available even from a minimal ROOT installation. As part of this work, we have reduced inter-component dependencies in order to improve maintainability. The modularization effort draws inspiration from similar efforts in the Java, Python, and Swift ecosystems. Keeping aligned with modern C++, this strategy relies on forthcoming features such as C++ modules. We hope formalizing the component layer provides simpler ROOT installs, improves extensibility, and decreases the complexity of embedding ROOT in other ecosystems.

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