scholarly journals Design and Optimization of Micro-Machined Sierpinski Carpet Fractal Antenna Using Ant Lion Optimization

2020 ◽  
Vol 10 (4) ◽  
pp. 306-318
Author(s):  
Ashish Kumar ◽  
Amar Partap Singh Pharwaha
Keyword(s):  
Integrated Circuits ◽  
Patch Antenna ◽  
Machining Process ◽  
Micro Machining ◽  
Microwave Integrated Circuits ◽  
Sierpinski Carpet ◽  
Monolithic Microwave Integrated Circuits ◽  
Ant Lion Optimization ◽  
Ant Lion ◽  
Sierpiński Carpet

This study investigates the optimized Sierpinski carpet fractal patch antenna and also explores the possibility of the integration of the proposed design with monolithic microwave integrated circuits. The optimization process has been performed using an ant lion optimization algorithm to achieve the required operating frequency and impedance matching. Further, due to surface waves excitation in the high index substrates used for the antenna design, the performance of the antenna degrades. Therefore, a process of micro-machining has been adopted to overcome this limitation. The micro-machining process creates an air cavity underneath the patch which further creates the low index environment in the patch antenna causing drastic improvement in the performance parameters along with the compatibility with monolithic microwave integrated circuits. The design shows multiple resonance frequencies in X-band and Ku-band. The proposed micro-machined design shows the resonance at 7.9 GHz, 9.6 GHz, 13.6 GHz, and 19 GHz with a maximum gain of 6 dBi. 

Using the secondary electrons (SE) of SEM with NIST‘s MONSEL-II program to obtain improved linewidth measurements and slope angles of line edges on a MMIC GaAs device

1996 ◽  
Vol 54 ◽  
pp. 944-945
Author(s):  
Richard G. Sartore
Keyword(s):  
Integrated Circuits ◽  
Plasma Etching ◽  
Microwave Integrated Circuits ◽  
Monolithic Microwave Integrated Circuits ◽  
Thick Gold ◽  
Gaas Devices ◽  
Source Distance ◽  
Margin Of Error ◽  
Dimensional Measurements ◽  
Barrier Metal

In the evaluation of GaAs devices from the MMIC (Monolithic Microwave Integrated Circuits) program for Army applications, there was a requirement to obtain accurate linewidth measurements on the nominal 0.5 micrometer gate lengths used to fabricate these devices. Preliminary measurements indicated a significant variation (typically 10 % to 30% but could be more) in the critical dimensional measurements of the gate length, gate to source distance and gate to drain distance. Passivation introduced a margin of error, which was removed by plasma etching. Additionally, the high aspect ratio (4-5) of the thick gold (Au) conductors also introduced measurement difficulties. The final measurements were performed after the thick gold conductor was removed and only the barrier metal remained, which was approximately 250 nanometer thick platinum on GaAs substrate. The thickness was measured using the penetration voltage method. Linescan of the secondary electron signal as it scans across the gate is shown in Figure 1.

Challenges and Issues in the Design of Micro-Machined Antennas - A Review

2020 ◽  
Vol 13 ◽  
Author(s):  
Ashish Kumar ◽  
Amar Partap Singh Pharwaha
Keyword(s):  
Patch Antenna ◽  
Ground Plane ◽  
Substrate Material ◽  
Review Article ◽  
High Index ◽  
Performance Characteristics ◽  
Machining Process ◽  
Patch Antennas ◽  
Micro Machining ◽  
The Impact

Background: Patch antennas are composed of the substrate material with patch and ground plane on the both sides of the substrate. The dimensions and performance characteristics of the antenna are highly influenced by the choice of the appropriate substrate depending upon the value of their dielectric constant. Generally, low index substrate materials are used to design the patch antenna but there are also some of the applications, which require the implementation of patch antenna design on high index substrate like silicon and gallium arsenide. Objective: The objective of this article is to review the design of antennas developed on high index substrate and the problems associated with the use of these materials as substrate. Also, main challenges and solutions have been discussed to improve the performance characteristics while using the high index substrates. Method: The review article has divided into various sections including the solution of the problems associated with the high index substrates in the form of micro-machining process. Along with this, types of micro machining and their applications have discussed in detail. Results: This review article investigates the various patch antennas designed with micro-machining technology and also discusses the impact of micro-machining process on the performance parameters of the patch antennas designed on high index substrates. Conclusion: By using the micro-machining process, the performance of patch antenna improves drastically but fabrication and tolerances at such minute structures is very tedious task for the antenna designers.

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