scholarly journals Role of soft computing techniques in predicting stock market direction

2012 ◽  
Vol 1 (2) ◽  
pp. 198
Author(s):  
Panchal Amitkumar Mansukhbhai ◽  
Dr. Jayeshkumar Madhubhai Patel

The stock market is a complex and dynamic system with noisy, non-stationary and chaotic data series. Prediction of a financial market is more challenging due to chaos and uncertainty of the system. Soft computing techniques are progressively gaining presence in the financial world. Compared to traditional techniques to predict the market direction, soft computing is gaining the advantage of accuracy and speed. However the input data selection is the major issue in soft computing. The aim of this paper is to explain the potential day by day research contribution of soft computing to solve complex problem such as stock market direction prediction. This study paper synthesizes five reference papers and explains how soft computing is gaining the popularity in the field of financial market. The selection of papers are based on various models wich are processing different input parameters for predicting the direction of stock market.

2021 ◽  
Vol 28 (3) ◽  
pp. 96-100
Author(s):  
Badri Narayan Mohapatra ◽  
◽  
Bhagwat Nagargoje ◽  
Prajwal Zurunge ◽  
Suraj More ◽  
...  

This study investigates the selection of stock from huge stock markets and by using good selection tools so that it will give a good return value. It helps investor to find an easy decision regarding their investment in stock market individually with effective collection of trading activities. Many artificial intelligence (AI) techniques are untested in the financial crisis scenario. This research really helpful to the investor in the stock selection and stock purchase decision. AI is also a one of the hottest topic for most industries, researchers and investors. The financial market is easy to analyze with multiple charts, due to the application of artificial intelligence.


2019 ◽  
Vol 65 (1) ◽  
pp. 9-20 ◽  
Author(s):  
L.O. Skorodumova ◽  
A.V. Belodedova ◽  
E.I. Sharova ◽  
B.E. Malyugin

Keratoconus is a chronic disorder of the cornea, characterized by its progressive thinning, stretching, and conical protrusion. Diagnostics of subclinical keratoconus, as well as its early stages (forme fruste), is a complex problem. The presence of these forms of keratoconus in a patient is one of the reasons for the development of keratectasia after laser refractive surgery. Currently, the role of genetic factors in keratoconus development has been proven. This indicates the possibility of diagnostics of subclinical and forme fruste keratoconus using genetic markers. Knowledge about the patient's genetic susceptibility to keratoconus would allow correcting the tactics of treatment of refractive anomalies and avoiding serious side effects. The studies of causal mutations indicate the genetic heterogeneity of keratoconus, which complicates the development of a diagnostic panel. Selection of candidate variants from the currently known ones based on clear criteria may be one of the approaches for diagnostic markers search. In this review, we have analyzed articles on keratoconus markers in order to form a list of candidate variants for genotyping in the Russian population. The selection criteria took into account the complexes of symptoms in which a marker was found, populations in which a particular marker was investigated, the presence and results of replication studies. The analysis included markers in VSX1, SOD1, ZEB1, LOX, CAST, DOCK9, TGFBI, HGF, MAP3K19, KCND3, COL4A3, COL4A4, COL5A1, FNDC3B, FOXO1, BANP-ZNF469, MPDZ-NF1B, WNT10A genes. Based on the results of the analysis, the following candidate variants were selected for genotyping in the Russian population of patients with keratoconus: rs1536482 and rs7044529 in the COL5A1 gene, rs5745752 and rs2286194 in the HGF gene, rs4954218 in the MAP3K19 gene, rs4839200 near the KCND3 gene, rs2721051 near the FOXO1 gene, rs1324183 between the MPDZ and the NF1B genes, and rs121908120 in the WNT10A gene.


2016 ◽  
Vol 8 (9) ◽  
pp. 208
Author(s):  
Mohammad Khalid Al Attar

This study aimed to measure the level of Amman Financial Market efficiency and show the role of financial derivatives in improving Markets’ efficiency. Generally, financial derivatives are considered an essential source of financing an economy. In addition, diversification of financial derivatives’ instruments which are circulated in a stock market as the main standard of measuring its development and efficiency, called as engineering. For the purpose of achieving the objectives of the study, the researcher selected some of the financial analysts’ that represent institutions in Amman Stock Exchange in Jordan, to serve as the sample of the study. Simple Random Sampling was used to select the sample to represent the whole population. Furthermore, the researcher developed a questionnaire to judge the respondents opinions and test the validity of the hypotheses. The questionnaire was designed by using a five -point -Likert scale (strongly agree, agree, neutral, disagree, strongly disagree). In total, the researcher distributed 100 questionnaires and 85 were returned from the selected sample of the study (85% from the whole questionnaires distributed). Results of the study showed that there was a strong bond between financial derivatives and efficiency of Amman Stock Market. Moreover, findings indicated that there is a statistical significant sign between financial analysts’ interests in returns of financial derivatives with their tools and efficiency of these markets.


2021 ◽  
Vol 11 (18) ◽  
pp. 8290
Author(s):  
Muhammad Adnan Khan ◽  
Jürgen Stamm ◽  
Sajjad Haider

A key goal of sediment management is the quantification of suspended sediment load (SSL) in rivers. This research focused on a comparison of different means of suspended sediment estimation in rivers. This includes sediment rating curves (SRC) and soft computing techniques, i.e., local linear regression (LLR), artificial neural networks (ANN) and the wavelet-cum-ANN (WANN) method. Then, different techniques were applied to predict daily SSL at the Pirna and Magdeburg Stations of the Elbe River in Germany. By comparing the results of all the best models, it can be concluded that the soft computing techniques (LLR, ANN and WANN) better predicted the SSL than the SRC method. This is due to the fact that the former employed non-linear techniques for the data series reconstruction. The WANN models were the overall best performer. The WANN models in the testing phase showed a mean R2 of 0.92 and a PBIAS of −0.59%. Additionally, they were able to capture the suspended sediment peaks with greater accuracy. They were more successful as they captured the dynamic features of the non-linear and time-variant suspended sediment load, while other methods used simple raw data. Thus, WANN models could be an efficient technique to simulate the SSL time series because they extract key features embedded in the SSL signal.


Author(s):  
Satoru Katsurayama ◽  
Hironori Tohmyoh ◽  
Masumi Saka

Generally, underfill material is adopted for encapsulation of flip chip package. And, the role of the underfill materials has become important day by day due to variant requirements for higher reliability of flip chip package. Also lower warpage gives higher mount-ability of the flip chip package and the small changes in the warpage of the package during the thermal cycle mitigate the stress working at the bump/substrate interface and bump/chip interface. Therefore, controlling the warpage of the flip chip package becomes very important problem for enhancing the performance of the package, i.e., the higher mount-ability and longer interconnect life. In this study, the effect of physical properties of underfill materials and substrates on the warpage behavior and the interconnect reliability of the flip chip package is reported. It was found from the experiments that the selection of an underfill and a substrate gave the highest interconnect reliability for the bump bonds. In addition to control the warpage behavior of the package during assembly, by selecting the suitable underfill material and substrate, the flip chip package with lower warpage and higher interconnect reliability can be realized.


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