scholarly journals Sample Preparation Methods for Pesticide Analysis in Food Commodities, Biological and Environment Matrices

Author(s):  
Renata Raina-Fulton ◽  
Zhen Xie
Author(s):  
Elham Sobhanzadeh ◽  
Nor Kartini Abu Bakar ◽  
Mhd Radzi Abas ◽  
Keivan Nemati

Much attention has been made in pesticide analysis to improve agricultural productivity and control these compounds in food and environmental samples. Different methods have been applied in pesticide analysis, among these; methods based on chromatographic separation with mass spectrometric detection have been extremely useful methods for determination of pesticide residues. Despite employing of powerful instrumental techniques, the risk of interference increases with the complexity of the matrix studied, so sample preparation prior to instrumental analysis is necessary. This article reviews the analytical characteristics of the different sample preparation methods for determination of pesticide residues in food and environmental samples and biological fluids, moreover this study describes advantages, disadvantages and details on the analytical characteristics of the procedure that have been applied recently in different sample preparation methods and their application s in combination with chromatographic mass spectrometric analysis. This article provides selection of a reliable method which will be useful for the quantitative analysis of pesticide residues in variety of samples based on their evaluation in recent applications.


Planta Medica ◽  
2016 ◽  
Vol 82 (05) ◽  
Author(s):  
M Wilcox ◽  
M Jacyno ◽  
J Marcu ◽  
J Neal-Kababick

Author(s):  
Andrew J. Komrowski ◽  
N. S. Somcio ◽  
Daniel J. D. Sullivan ◽  
Charles R. Silvis ◽  
Luis Curiel ◽  
...  

Abstract The use of flip chip technology inside component packaging, so called flip chip in package (FCIP), is an increasingly common package type in the semiconductor industry because of high pin-counts, performance and reliability. Sample preparation methods and flows which enable physical failure analysis (PFA) of FCIP are thus in demand to characterize defects in die with these package types. As interconnect metallization schemes become more dense and complex, access to the backside silicon of a functional device also becomes important for fault isolation test purposes. To address these requirements, a detailed PFA flow is described which chronicles the sample preparation methods necessary to isolate a physical defect in the die of an organic-substrate FCIP.


2021 ◽  
Vol 20 ◽  
pp. 100079
Author(s):  
Maxwell C. McCabe ◽  
Lauren R. Schmitt ◽  
Ryan C. Hill ◽  
Monika Dzieciatkowska ◽  
Mark Maslanka ◽  
...  

2011 ◽  
Vol 26 (9) ◽  
pp. 1849 ◽  
Author(s):  
J. S. F. Pereira ◽  
C. L. Knorr ◽  
L. S. F. Pereira ◽  
D. P. Moraes ◽  
J. N. G. Paniz ◽  
...  

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