scholarly journals Retreatment of Polymer Wastes by Disintegrator Milling

2021 ◽  
Author(s):  
Priit Kulu ◽  
Dmitri Goljandin

Global introduction of waste utilization techniques to the polymer market is currently not fully developed but has enormous potential. Before reintegration of used material into a new product, it normally requires grinding, that is shredding, crushing, or milling. In traditional grinders, the generated stresses in the material to be ground are equal to or less than the strength of the material. If by traditional methods, the stresses generated are compressive + shift, so by milling based on collision are tension + shift. Due to the high stress-material strength ratio at collision, it is possible to crush not only brittle materials but also ductile materials. This process allows easily combining the grinding of composite materials with their separation into individual constituents. In the current study, the mechanical recycling of the following groups of polymer materials was studied: pure brittle and soft polymers (PMMA, HDPE and IER), blends of plastics (ABS+PMMA, PC + ABS), reinforced plastics (PMMA+GFP); elastomers (rubber and tyres), and printed circuit boards (PCB).

2015 ◽  
Vol 787 ◽  
pp. 18-21 ◽  
Author(s):  
A.G. Ganesh Kumar ◽  
G. Ranganath ◽  
S.N. Mani Varmaa ◽  
S. Shylin H. Jose ◽  
M. Sakthivel

Recycling of Printed Circuit Boards (PCB) has been carried out by powdering it into granular size of less than 10 microns. The properties of PCB reveal that it possesses density of 1.3 g/cm3 and Tensile Strength of 310 MPa which is comparatively high when compared to the Polycarbonate material which is normally used in the fabrication of Riot shield. The PCB material was subjected to SEM and EDAX analysis for determining their structure, porosity and material composition. Riot shield fabricated from PCB reduces the environmental effects of E-waste PCBs by the recycling technique, improves the material strength and reduces the weight and cost to a larger extent.


2008 ◽  
Vol 128 (11) ◽  
pp. 657-662 ◽  
Author(s):  
Tsuyoshi Maeno ◽  
Yukihiko Sakurai ◽  
Takanori Unou ◽  
Kouji Ichikawa ◽  
Osamu Fujiwara

2018 ◽  
Vol 23 (2) ◽  
pp. 141-148
Author(s):  
S.Sh. Rekhviashvili ◽  
◽  
M.O. Mamchuev ◽  
V.V. Narozhnov ◽  
M.M. Oshkhunov ◽  
...  

2013 ◽  
Vol 61 (3) ◽  
pp. 731-735
Author(s):  
A.W. Stadler ◽  
Z. Zawiślak ◽  
W. Stęplewski ◽  
A. Dziedzic

Abstract. Noise studies of planar thin-film Ni-P resistors made in/on Printed Circuit Boards, both covered with two different types of cladding or uncladded have been described. The resistors have been made of the resistive-conductive-material (Ohmega-Ply©) of 100 Ώ/sq. Noise of the selected pairs of samples has been measured in the DC resistance bridge with a transformer as the first stage in a signal path. 1/f noise caused by resistance fluctuations has been found to be the main noise component. Parameters describing noise properties of the resistors have been calculated and then compared with the parameters of other previously studied thin- and thick-film resistive materials.


Sign in / Sign up

Export Citation Format

Share Document