scholarly journals Studies on the Electroless Nickel Plating with NaBH4 as a Reducing Agent XI. Application of Computer Analysis for the Evaluation of Corrosion Resistance of Electroless Ni-B Deposits

1979 ◽  
Vol 47 (1) ◽  
pp. 12-16
Author(s):  
Masao MATSUOKA ◽  
Tadao HAYASHI
Keyword(s):  
Corrosion Resistance ◽  
Computer Analysis ◽  
Electroless Nickel ◽  
Reducing Agent ◽  
Electroless Nickel Plating ◽  
Nickel Plating ◽  
Electroless Ni

A new concept for electroless nickel plating: aluminium as reducing agent

RSC Advances ◽  
2016 ◽  
Vol 6 (36) ◽  
pp. 30695-30698 ◽  
Author(s):  
Xingkai Zhang ◽  
Junyan Zhang
Keyword(s):  
Corrosion Resistance ◽  
Electroless Plating ◽  
Electroless Nickel ◽  
Reducing Agents ◽  
Reducing Agent ◽  
Electroless Nickel Plating ◽  
Nickel Plating ◽  
Nickel Coatings ◽  
Excellent Corrosion Resistance

Aluminum was used as a reducing agent for preparing nickel coatings with excellent corrosion resistance from electroless plating baths containing no reducing agents.

Fabrication and Research of Electroless Nickel Plating on Carbon Fiber with Palladium-Free Activation

2010 ◽  
Vol 148-149 ◽  
pp. 410-415
Author(s):  
Xiao Ping Luo ◽  
Ming Gang Zhang ◽  
Chun Xiang Lv
Keyword(s):  
Tensile Strength ◽  
Carbon Fiber ◽  
Fiber Surface ◽  
Electroless Nickel ◽  
Electroless Nickel Plating ◽  
Nickel Plating ◽  
Adhesive Properties ◽  
Nickel Deposition ◽  
X Ray ◽  
Electroless Ni

A new procedure of surface activation without using palladium salt is proposed for electroless nickel plating (Ni-P) on carbon fiber. The optimal formula and technical conditions for palladium-free activated electroless Ni-P were obtained by orthogonal experiments. The effects of nitric acid processing time on the quality of nickel coating was investigated .The effects of varying concentrations of Ni2 + on the rate of weight gain during the Ni2 + complex adsorption process were also analyzed and the kinetic equation of the process was established. The theoretical values calculated by the equation were proven to be consistent with the experimental verification. The material characteristics of the deposited layers were analyzed by scanning electron microscopy (SEM), energy-dispersive x-ray spectroscopy (EDX) and X-ray diffraction (XRD). The tensile strength of the carbon fibers was analyzed by the Weibull method, and this showed that when the thickness of the Ni-P coating reached 0.150μm, the tensile strength reached a maximum value. The experimental results showed that the nickel deposition on the carbon fiber surface obtained by this method, had the same uniformity, compactness and adhesive properties as the one by conventional electroless Ni-P.

Electroless Nickel Plating Process Optimization for Aluminum Terminals

2009 ◽  
Author(s):  
Philip Westby ◽  
Kevin Mattson ◽  
Fred Haring ◽  
Jacob Baer ◽  
Matt Steele ◽  
...  
Keyword(s):  
Process Optimization ◽  
Electroless Nickel ◽  
Process Time ◽  
Electroless Nickel Plating ◽  
Nickel Plating ◽  
Effects Of Temperature ◽  
Electroless Ni

An Electroless Ni plating process for aluminum was evaluated and optimized, leading to smooth and uniform nickel growth approaching 28.2 μm/hr. The effects of temperature, and process time were investigated. Nickel bumping die for solder adhesion was performed and the quality of the adhesion between the nickel and aluminum layers was evaluated.

Electroless Nickel Plating on Copper Foil

2014 ◽  
Vol 926-930 ◽  
pp. 103-107
Author(s):  
Zuo Qin Tang ◽  
Su Rong Hu ◽  
Yin Chun Chao
Keyword(s):  
Corrosion Resistance ◽  
Potentiodynamic Polarization ◽  
Copper Foil ◽  
Electroless Nickel ◽  
Electroless Nickel Plating ◽  
Nickel Plating ◽  
Nacl Solution ◽  
Tribological Behaviour ◽  
Microhardness Tester

A pre-cleaning and an electroless nickel plating (EN-HP) were applied to copper foil to improve its tribological behaviour and corrosion resistance. The coating porosity was measured by the corrodkote, tribological behaviour was measured with microhardness tester and a CSM ball-on-disk tribometer, corrosion resistance was measured by potentiodynamic polarization in 3.5 wt.% NaCl solution. Matte nickel plating (mNi) and moderate compact Ni–P coating (EN-MP) were made as comparisons to EN-HP in those tests. By deposition of EN-HP, both coating porosity and tribological behaviour are greatly improved compared to mNi, and the corrosion resistance is distinctly ameliorated to the comparisons. Above research demonstrates that the copper foil with EN-HP coating is good underlay in assemblage of machine.

Electroless Ni-P Plating on Mg-7Al Alloy by Chemical Conversion Pretreatment

2013 ◽  
Vol 652-654 ◽  
pp. 1908-1911
Author(s):  
Su Qiu Jia ◽  
Jing Xin Guan ◽  
Jing Dong Qiu ◽  
Hua Chen ◽  
Shu Yan Jia
Keyword(s):  
Corrosion Potential ◽  
Orthogonal Experiment ◽  
Orthogonal Design ◽  
Saturated Calomel Electrode ◽  
Nickel Sulfate ◽  
Electroless Nickel ◽  
Chemical Conversion ◽  
Electroless Nickel Plating ◽  
Nickel Plating ◽  
Electroless Ni

Electroless Ni-P plating on Mg-7Al alloy by chemical conversion pretreatment was investigated. Morphology of electroless nickel plating coatings and phase compositions were measured by SEM, EDX and XRD. The optimized bath composition parameters were determined through orthogonal design. The morphology of electroless nickel plating coatings on Mg-7Al alloy exhibits a nodular structure and resembles the surface of a cauliflower and the coating is compact and consists of amorphous Ni-P coating. Potentiodynamic polarization curves of the Ni-P coatings in 3.5% NaCl show that the Ni-P coating extensively improves the corrosion resistance of Mg-7Al alloy and the highest corrosion potential reached to -0.54V vs. SCE(saturated calomel electrode). The results of the orthogonal experiment show that Nickel Sulfate of 25 g/L, Sodium Hypopho-sphate of 25 g/L and Citrate 7.5 g/L can be considered as the optimum bath content parameters for electroless Ni–P plating on Mg-7Al alloy and Nickel Sulfate has more effect on corrosion potential than Sodium Hypophosphate and Citrate..

Preliminary Step in Formulating the Optimum Electroless Nickel Bath Using Taguchi Method

2012 ◽  
Author(s):  
M.N. Mohamad Ibrahim ◽  
C. W. Sia ◽  
Z. A. Ahmad
Keyword(s):  
Deposition Rate ◽  
Orthogonal Array ◽  
Electroless Nickel ◽  
Deposition Process ◽  
Reducing Agent ◽  
Complexing Agent ◽  
Nickel Salt ◽  
Electroless Nickel Plating ◽  
Nickel Plating ◽  
Taguchi Orthogonal Array

Teknologi penyaduran nikel secara tanpa elektrik telah berkembang pesat dan diaplikasikan secara meluas dalam banyak bidang industri disebabkan ciri sadurannya yang unggul. Penyaduran tanpa elektrik ialah suatu proses pengautomangkinan iaitu saduran nikel berlaku daripada penurunan garamnya oleh agen penurunan yang hadir dalam larutan elektrik. Komposisi asas larutan tanpa elektrik di dalam kajian ialah NiSO4.6H2O, NaH2PO2.H2O, (NH4)3C6H5O7, agen pembasah dan suhu operasinya ialah 50°C. Dalam kajian awal ini, teknik Taguchi telah digunakan untuk menyelidik beberapa faktor yang dapat mempengaruhi kadar saduran supaya larutan elektrolit nikel yang optimum dapat diformulasikan. Faktor-faktor ini ialah kepekatan garam nikel, agen penurunan, agen pengkompleks dan pH larutan. Susunatur ortogonal Taguchi L9 telah digunakan untuk merancang eksperimen dengan tiga paras bagi setiap faktor. Kepingan keluli lembut digunakan sebagai substrat. Proses penyaduran dijalankan selama setengah jam dan kadar saduran didapati dengan menimbang sampel sebelum dan selepas saduran. Data-data yang diperolehi telah dianalisis berdasarkan nisbah isyarat kepada bisingan Taguchi dan analisis varians. Keputusan menunjukkan bahawa faktor pH paling mempengaruhi kadar saduran diikuti dengan faktor kepekatan garam nikel, agen penurunan dan agen pengkompleks. Formulasi larutan elektrolis yang optimum seterusnya dapat diramalkan berdasarkan keputusan ini. Kata kunci: Penyaduran nikel secara tanpa elektrik; kaedah Taguchi; susun atur ortogonal Taguchi; kadar saduran; larutan tanpa elektrik yang optimum Electroless nickel plating has been rapidly developed and widely used in many fields due to its superior properties of coating. It is an autocatalytic process in which the deposited nickel is reduced from its ionic state by chemical reducing agent in bath. The basic compositions of the bath and operating condition are NiSo4.6H2O, NaH2PO2.H2O,(NH4)3C6H5O7, wetting agent and at 50°C. In this preliminary study, Taguchi Robust Design Technique was used to rank several factors that may affect the deposition rate in order to formulate the optimum electroless nickel bath. They were concentration of nickel salt, reducing agent, complexing agent and pH of the bath. The Taguchi orthogonal array L9 was used for the experimental design with three levels of consideration for each factor. Mild steel plated were used as substrates. The deposition process was carried out for half an hour and the rates were obtained by weighing the samples before and after plating. The response (deposition rate) was analysed based on the Taguchis signal-to-noise ratio (S/N) and analysis of variance (ANOVA). The results showed that the most notable factor influencing the deposition rate was the pH, followed by the concentration of nickel salt, reducing agent and complexing agent. The optimum bath formulation was then predicted based on these results. Key words: Electroless nickel plating; Taguchi's method; Taguchi orthogonal array; deposition rate; optimum bath formulation

EFFECT OF DIFFERENT PRETREATMENTS TO ELECTROLESS NICKEL OR COBALT PLATING ON HOLLOW MICROSPHERES

2010 ◽  
Vol 24 (15n16) ◽  
pp. 2706-2711
Author(s):  
YAN ZHAO ◽  
RUN ZHANG ◽  
TONG ZHANG ◽  
YUEXIN DUAN
Keyword(s):  
Electron Microscopy ◽  
Electroless Nickel ◽  
Single Step ◽  
Chemical Compositions ◽  
Electroless Nickel Plating ◽  
Nickel Plating ◽  
X Ray ◽  
Surface Morphologies ◽  
Electroless Ni ◽  
Scanning Electron

Different pretreatment methods for electroless nickel and cobalt plating are demonstrated and compared in the present investigation. The surface morphologies of the nickel or cobalt deposits are investigated by scanning electron microscopy (SEM), and the chemical compositions of the coatings are analyzed by energy-dispersive X-ray spectroscopy (EDX). Method of single-step pretreatment is selected as the optimized method for electroless nickel plating process, while improved two-step sensitization-activation and single-step pretreatment methods can be selected for electroless cobalt plating. It can be found that the content of free Co is much lower compared to electroless Ni plating.

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