scholarly journals Reliable Measurement Methodology of Wafer Bonding Strength in 3D Integration Process Using Atomic Force Microscopy

2013 ◽  
Vol 20 (2) ◽  
pp. 11-15 ◽  
Author(s):  
Eunmi Choi ◽  
Sung Gyu Pyo
Keyword(s):  
Atomic Force Microscopy ◽  
Wafer Bonding ◽  
Bonding Strength ◽  
Integration Process ◽  
3D Integration ◽  
Reliable Measurement ◽  
Force Microscopy ◽  
Atomic Force ◽  
Measurement Methodology

Measurement of adhesion and bonding strength studies in 3D interconnect structures using atomic force microscopy

2013 ◽  
Vol 19 (6) ◽  
pp. 1339-1342 ◽  
Author(s):  
Eunmi Choi ◽  
Hee Soo Choi ◽  
Areum Kim ◽  
Seon Jea Lee ◽  
Yinhua Cui ◽  
...  
Keyword(s):  
Atomic Force Microscopy ◽  
Bonding Strength ◽  
Force Microscopy ◽  
Atomic Force

Atomic force microscopy: a key to direct wafer bonding technology

1995 ◽  
Vol 14 (2) ◽  
pp. 96-98 ◽  
Author(s):  
V. H. C. Watt ◽  
M. Moinpour ◽  
R. Bower ◽  
R. Sundararaman
Keyword(s):  
Atomic Force Microscopy ◽  
Wafer Bonding ◽  
Force Microscopy ◽  
Atomic Force ◽  
Direct Wafer Bonding ◽  
Bonding Technology

Evaluation of Digital Holography Microscopy for Roughness Control Prior Wafer Direct Bonding

2013 ◽  
Author(s):  
B. Domengès ◽  
France T. Delaroque ◽  
Ch. Gautier ◽  
K. Danilo ◽  
E. Le Flao
Keyword(s):  
Atomic Force Microscopy ◽  
Digital Holography ◽  
Smooth Surfaces ◽  
Alternative Technique ◽  
3D Integration ◽  
Force Microscopy ◽  
Atomic Force ◽  
Surface Bonding ◽  
Roughness Control ◽  
Wafer Direct Bonding

Abstract Direct surface bonding of wafers in 3D integration requires perfectly smooth surfaces, with roughness values below 1 nm, usually characterized with Atomic Force Microscopy. An alternative technique, Digital Holography Microscopy is evaluated here and shown to be precise enough to differentiate adequate wafers, that is chemical mechanical polished, from non treated ones.

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