Low-Contact-Resistance Non-Gold Ta/Si/Ti/Al/Ni/Ta Ohmic Contacts on Undoped AlGaN/GaN High-Electron-Mobility Transistors Grown on Silicon

2013 ◽  
Vol 6 (11) ◽  
pp. 116501 ◽  
Author(s):  
Yang Li ◽  
Geok Ing Ng ◽  
Subramaniam Arulkumaran ◽  
Chandra Mohan Manoj Kumar ◽  
Kian Siong Ang ◽  
...  
Micromachines ◽  
2018 ◽  
Vol 9 (11) ◽  
pp. 546 ◽  
Author(s):  
Wojciech Wojtasiak ◽  
Marcin Góralczyk ◽  
Daniel Gryglewski ◽  
Marcin Zając ◽  
Robert Kucharski ◽  
...  

AlGaN/GaN high electron mobility transistors on semi-insulating bulk ammonothermal GaN have been investigated. By application of regrown ohmic contacts, the problem with obtaining low resistance ohmic contacts to low-dislocation high electron mobility transistor (HEMT) structures was solved. The maximum output current was about 1 A/mm and contact resistances was in the range of 0.3–0.6 Ω ·mm. Good microwave performance was obtained due to the absence of parasitic elements such as high access resistance.


2011 ◽  
Vol 56 (1) ◽  
pp. 56-59
Author(s):  
Martin Kocan ◽  
Felix Recht ◽  
Gilberto A. Umana-Membreno ◽  
Matt R. Kilburn ◽  
Brett D. Nener ◽  
...  

1990 ◽  
Vol 181 ◽  
Author(s):  
H. Barry Harrison

ABSTRACTThe electrical and physical properties of the contact between the active channel of high electron mobility transistors (HEMT’s) and the source or drain contacts play an important role in determining the transistor characteristics. This paper considers electrical models that may be applied to the various techniques now available to form these Interconnections. Results of electrical (and some physical) studies with regard to these systems are then discussed and compared where possible with predictions made using the electrical models. The comparisons show that the electrical models provide a useful base to identify the important parameters in these interconnections.


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