Investigation of Local Bending Stress Effect on Complementary Metal–Oxide–Semiconductor Characteristics in Thinned Si Chip for Chip-to-Wafer Three-Dimensional Integration
2013 ◽
Vol 52
(4S)
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pp. 04CB11
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2015 ◽
Vol 36
(9)
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pp. 887-889
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2009 ◽
Vol 48
(4)
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pp. 04C077
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2008 ◽
Vol 47
(4)
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pp. 2477-2483
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2020 ◽
Vol 20
(7)
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pp. 4176-4181
2009 ◽
Vol 106
(50)
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pp. 21035-21038
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2021 ◽
Vol 134
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pp. 106046