scholarly journals MeteoMex: open infrastructure for networked environmental monitoring and agriculture 4.0

2021 ◽  
Vol 7 ◽  
pp. e343
Author(s):  
Robert Winkler
Keyword(s):  
Food Production ◽  
Printed Circuit Boards ◽  
Low Cost ◽  
Environmental Sensors ◽  
Circuit Boards ◽  
Printed Circuit ◽  
Smart Farming ◽  
Public Areas ◽  
Terrestrial Life ◽  
Iot Platforms

Air, water, and soil are essential for terrestrial life, but pollution, overexploitation, and climate change jeopardize the availability of these primary resources. Thus, assuring human health and food production requires efficient strategies and technologies for environmental protection. Knowing key parameters such as soil moisture, air, and water quality is essential for smart farming and urban development. The MeteoMex project aims to build simple hardware kits and their integration into current Internet-of-Things (IoT) platforms. This paper shows the use of low-end Wemos D1 mini boards to connect environmental sensors to the open-source platform ThingsBoard. Two printed circuit boards (PCB) were designed for mounting components. Analog, digital and I2C sensors are supported. The Wemos ESP8266 microchip provides WiFi capability and can be programed with the Arduino IDE. Application examples for the MeteoMex aeria and terra kits demonstrate their functionality for air quality, soil, and climate monitoring. Further, a prototype for monitoring wastewater treatment is shown, which exemplifies the capabilities of the Wemos board for signal processing. The data are stored in a PostgreSQL database, which enables data mining. The MeteoMex IoT system is highly scalable and of low cost, which makes it suitable for deployment in agriculture 4.0, industries, and public areas. Circuit drawings, PCB layouts, and code examples are free to download from https://github.com/robert-winkler/MeteoMex.

scholarly journals MeteoMex: Open infrastructure for networked environmental monitoring and agriculture 4.0

2020 ◽  
Author(s):  
Robert Winkler
Keyword(s):  
Food Production ◽  
Printed Circuit Boards ◽  
Low Cost ◽  
Environmental Sensors ◽  
Circuit Boards ◽  
Printed Circuit ◽  
Smart Farming ◽  
Public Areas ◽  
Terrestrial Life ◽  
Iot Platforms

<div>Air, water, and soil are essential for terrestrial life, but pollution, overexploitation, and climate change jeopardize the availability of these primary resources. Thus, assuring human health and food production requires efficient strategies and technologies for environmental protection. Knowing key parameters such as soil moisture, air, and water quality is essential for smart farming and urban development. </div><div>The MeteoMex project aims to build simple hardware kits and their integration into current Internet-of-Things (IoT) platforms. This paper shows the use of low-end Wemos D1 mini boards to connect environmental sensors to the open-source platform ThingsBoard. Two printed circuit boards (PCB) were designed for mounting components. Analog, digital and I<sup>2</sup>C sensors are supported. The Wemos ESP8266 microchip provides WiFi capability and can be programmed with the Arduino IDE. Application examples for the MeteoMex aeria and terra kits demonstrate their functionality for air quality, soil, and climate monitoring.</div><div>Further, a prototype for monitoring wastewater treatment is shown, which exemplifies the capabilities of the Wemos board for signal processing. The data are stored in a PostgreSQL database, which enables data mining. The MeteoMex IoT system is highly scalable and of low cost, which makes it suitable for deployment in agriculture 4.0, industries, and public areas. </div><div>Circuit drawings, PCB layouts, and code examples are free to download from https://github.com/robert-winkler/MeteoMex.</div>

scholarly journals MeteoMex: Open infrastructure for networked environmental monitoring and agriculture 4.0

2020 ◽  
Author(s):  
Robert Winkler
Keyword(s):  
Food Production ◽  
Printed Circuit Boards ◽  
Low Cost ◽  
Environmental Sensors ◽  
Circuit Boards ◽  
Printed Circuit ◽  
Smart Farming ◽  
Public Areas ◽  
Terrestrial Life ◽  
Iot Platforms

<div>Air, water, and soil are essential for terrestrial life, but pollution, overexploitation, and climate change jeopardize the availability of these primary resources. Thus, assuring human health and food production requires efficient strategies and technologies for environmental protection. Knowing key parameters such as soil moisture, air, and water quality is essential for smart farming and urban development. </div><div>The MeteoMex project aims to build simple hardware kits and their integration into current Internet-of-Things (IoT) platforms. This paper shows the use of low-end Wemos D1 mini boards to connect environmental sensors to the open-source platform ThingsBoard. Two printed circuit boards (PCB) were designed for mounting components. Analog, digital and I<sup>2</sup>C sensors are supported. The Wemos ESP8266 microchip provides WiFi capability and can be programmed with the Arduino IDE. Application examples for the MeteoMex aeria and terra kits demonstrate their functionality for air quality, soil, and climate monitoring.</div><div>Further, a prototype for monitoring wastewater treatment is shown, which exemplifies the capabilities of the Wemos board for signal processing. The data are stored in a PostgreSQL database, which enables data mining. The MeteoMex IoT system is highly scalable and of low cost, which makes it suitable for deployment in agriculture 4.0, industries, and public areas. </div><div>Circuit drawings, PCB layouts, and code examples are free to download from https://github.com/robert-winkler/MeteoMex.</div>

Low-cost TO-CAN package combined with flexible and hard printed circuit boards for 25 - Gb / s optical subassembly modules

2017 ◽  
Vol 56 (2) ◽  
pp. 026108
Author(s):  
Jau-Ji Jou ◽  
Tien-Tsorng Shih ◽  
Cheng-Ying Wu ◽  
Zhe-Xian Su
Keyword(s):  
Printed Circuit Boards ◽  
Low Cost ◽  
Circuit Boards ◽  
Printed Circuit

scholarly journals Design and Implementation of Solder Paste Dispenser Based on Linear Drive System

2019 ◽  
Vol 3 (2) ◽  
pp. 338
Author(s):  
Riky Tri Yunardi ◽  
Moh. Zakky Zulfiar ◽  
Rr. Wanda Auruma Putri ◽  
Deny Arifianto
Keyword(s):  
Printed Circuit Boards ◽  
Printed Circuit Board ◽  
Low Cost ◽  
Circuit Board ◽  
Solder Paste ◽  
Circuit Boards ◽  
Printed Circuit ◽  
Design And Implementation ◽  
Stepper Motors ◽  
Drive Systems

In the technology to create prototypes for electronic hardware is usually constructed using surface mount device printed circuit board (SMD PCB). In this paper introduces the design and implementation of low-cost electrical solder paste dispenser that supports the PCB solder process. The design consists of a nozzle and linear drive systems based on stepper motors operating with electric power to push the plunger down to drop the solder paste on the board. To test the performance of solder paste that has been designed verified by experiment. Solder paste dispenser design was tested using SMD resistor with the solder pads of different sizes for R0603, R0805, and R1206 on PCB. The results showed that the design of the prototype was able to put the pasta in various field pads between 0.54 mm2, 0.91 mm2 and 1.44 mm2 for standard solder pads with an error in the 2% - 5%. Based on the results, the device has been shown to potentially be used to attach electronic components to printed circuit boards.

scholarly journals Fine Lines in a Three Dimensional Interconnect

1984 ◽  
Vol 11 (2) ◽  
pp. 109-115
Author(s):  
J. A. Scarlett
Keyword(s):  
Printed Circuit Boards ◽  
Low Cost ◽  
Three Dimensional ◽  
High Density ◽  
Circuit Boards ◽  
Fine Line ◽  
Printed Circuit ◽  
Flexible Printed Circuit ◽  
Planar Substrates

The techniques for the generation of fine lines on rigid and flexible printed circuit boards are reviewed, and it is shown how the tracking on the interconnect can be made to match the requirements of chip carriers, TAB chips or beam leaded or wire bonded chips directly mounted.The use of fine line techniques on planar substrates can be adapted to provide a low cost, high density interconnect which offers a truly three dimensional connection capability without the use of a “back wiring panel”. Such a three dimensional interconnect can offer opportunities for improvement in the removal of heat from high dissipation chips, thus offering significantly increased reliability.

scholarly journals Design and fabrication of low-cost micromachining system for prototyping printed circuit boards

2021 ◽  
Author(s):  
Dhinesh S K ◽  
◽  
Senthil Kumar K L ◽  
Megalingam A ◽  
Gokulraj A P ◽  
...  
Keyword(s):  
Printed Circuit Boards ◽  
Low Cost ◽  
Working Environment ◽  
Circuit Boards ◽  
Printed Circuit ◽  
Milling Operation ◽  
Wide Range ◽  
Complex Shapes ◽  
The Cost ◽  
Selection Of

Printed circuit boards (PCBs) have a portentous position in constructing modern electronic equipment. Currently, chemical etching is the process used to produce PCBs at huge volumes, which is not suitable for preparing prototypes. The working environment is also not an encouraging one. There is no economical way to manufacture PCBs in low volumes, which is the basic requirement for Small and Medium Scale Enterprises (SMEs). Prototyping the desired circuit boards, prior to the mass production, is essential to avoid major losses by producing faulty designs. Developing a low-cost machine for prototyping PCBs may overcome these drawbacks. Hence, in this work, a machine capable of performing PCB mechanical milling operation on wide range of materials like copper/epoxy boards and flexible substrates has been developed. The machine developed is capable of milling lines that are 0.3 mm in width and 0.46 mm in depth. The performance of the machine reveals that it can mill any complex shapes and designs with expected accuracy. Selection of hardware components according to the needs would reduce the cost and programming snag further, which makes it affordable to SMEs.

Microfluidic Technology using SU8 on top of PCBs

2013 ◽  
Vol 2013 (DPC) ◽  
pp. 000890-000914 ◽  
Author(s):  
Stefan Gassmann ◽  
Lienhard Pagel
Keyword(s):  
Surface Roughness ◽  
Printed Circuit Boards ◽  
Low Cost ◽  
Dna Sensor ◽  
Circuit Boards ◽  
Printed Circuit ◽  
Uniform Coating ◽  
Electrochemical Dna Sensor ◽  
Micro Technology ◽  
Micro Systems

The usage of standard PCBs (Printed Circuit Boards) for the creation of micro fluidic systems was already reported. The combination of a standard micro technology using photolithography and photo sensitive layers and the PCB technology leads to interesting low cost solutions for micro systems. The technology and some examples will be presented in this talk. Using PCBs as the substrate the integration of electronics is simple and the substrate is available at low cost. Putting the sophisticated SU8 based micro technology using photolithography on top, new systems can be created. Both technologies deliver their best, in the PCB technology integrated electrodes and electronics can be created while the SU8 technology adds high resolution high aspect-ratio micro systems which are not possible in a PCB implementation. Although this combination seems to be straight forward, several issues have to overcome for a successful realization. These are the surface roughness, adhesion problems and the uniform coating of rectangular substrates. In the talk these issues will be addressed. As successful examples an electro-osmotic pump and an electrochemical DNA sensor will be presented.

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